公开(公告)号：WO2004023528A3

公开(公告)日：2006-11-02

申请号：PCT/US0327966

申请日：2003-09-05

Applicant: MOTOROLA INC

Inventor： BRAZIS PAUL ,  CHASON MARC ,  KALYANASUNDARAM KRISHNA ,  GAMOTA DANIEL

IPC: H01L21/78 ,  H01L20060101 ,  H01L21/301 ,  H01L21/58 ,  H01L21/68 ,  H01L21/76 ,  H01L23/538 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062 ,  H01L31/113 ,  H01L31/119

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01049 ,  H01L2924/01058 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.

Abstract translation: 其中形成有集成电路元件的晶片（10）变薄，并且第一载体（41）粘附到其上。 第一载体（41）便于处理薄的晶片（30）。 然后粘合第二载体（51），并且将各种集成电路分离以产生多个薄的模具（81）。 一旦将薄的模具安装到期望的基板（91）上，则容易地移除第一载体（41）。 在一个实施例中，第一载体（41）具有当暴露于预定刺激（例如给定温度范围或给定的光子能量的给定频率范围）时变得较不粘附的粘合剂。 这种薄的模具（或包含这种模具的模块）易于堆叠以便实现显着增加的电路密度。

公开(公告)号：WO2004061906A3

公开(公告)日：2005-06-23

申请号：PCT/US0340469

申请日：2003-12-18

Applicant: MOTOROLA INC

Inventor： ZHANG JIE ,  GAMOTA DANIEL ,  ZHANG MIN-XIAN ,  BRAZIS PAUL ,  KALYANASUNDARAM KRISHNA

IPC: H01L51/00 ,  H01L51/30 ,  H01L51/40 ,  H01L35/24

CPC classification number: H01L51/0516 ,  H01L51/0024 ,  H01L51/0036 ,  H01L51/0051 ,  H01L51/0078 ,  H01L51/0084

Abstract: Organic field effect transistors (OFETs) can be created rapidly and at low cost on organic films by using a multilayer film (202) that has an electrically conducting layer (204, 206) on each side of a dielectric core. The electrically conducting layer is patterned to form gate electrodes (214), and a polymer film (223) is attached onto the gate electrode side of the multilayer dielectric film, using heat and pressure (225) or an adhesive layer (228). A source electrode and a drain electrode (236) are then fashioned on the remaining side of the multilayer dielectric film, and an organic semiconductor (247) is deposited over the source and drain electrodes, so as to fill the gap between the source and drain electrodes and touch a portion of the dielectric film to create an organic field effect transistor.

Abstract translation: 有机场效应晶体管（OFET）可以通过使用在介质芯的每一侧上具有导电层（204,206）的多层膜（202）在有机膜上快速且低成本地产生。 图案化导电层以形成栅电极（214），并且使用热和压力（225）或粘合剂层（228）将聚合物膜（223）附着到多层电介质膜的栅电极侧。 然后在多层电介质膜的剩余侧上形成源电极和漏电极（236），并且在源电极和漏电极上沉积有机半导体（247），以填充源极和漏极之间的间隙 电极并且接触电介质膜的一部分以产生有机场效应晶体管。

公开(公告)号：WO2004006633A3

公开(公告)日：2004-06-17

申请号：PCT/US0320650

申请日：2003-06-03

Applicant: MOTOROLA INC

Inventor： ZHANG JIE ,  BRAZIS PAUL ,  GAMOTA DANIEL ,  KALANASUNDARAM KRISHNA ,  SCHEIFERS STEVEN ,  WIELGUS JERZY ,  CHOWDHURI ABHIJIT ROY

IPC: H01L29/417 ,  H01L21/336 ,  H01L21/338 ,  H01L29/786 ,  H01L29/812 ,  H01L35/24 ,  H01L51/00 ,  H01L51/05 ,  H01L51/30 ,  H01L51/40 ,  H01L29/06

CPC classification number: H01L51/0516 ,  B82Y10/00 ,  H01L27/283 ,  H01L51/0024 ,  H01L51/0036 ,  H01L51/0038 ,  H01L51/0046 ,  H01L51/0052 ,  H01L51/0053 ,  H01L51/0078 ,  H01L51/0097 ,  H01L51/0512 ,  H01L51/0541 ,  H01L51/0545

Abstract: An integrated circuit (100, 200, 300, 400) that includes a field effect transistor (102, 202, 302, 402) is fabricated by forming an organic semiconductor channel (112, 216, 308, 418) on one substrate (106, 204), forming device electrodes (114, 116, 110, 208, 210, 212) on one or more other substrates (104, 108, 206), and subsequently laminating the substrates together. In one embodiment, a dielectric patch (214) that functions as a gate dielectric is formed on one of the substrates (204, 206) prior to performing the lamination. Lamination provides a low cost route to device assembly, allows for separate fabrication of different device structures on different substrates, and thins various device layers resulting in improved performance.

Abstract translation: 包括场效应晶体管（102,202,302,402）的集成电路（100,200,300,400）通过在一个衬底上形成有机半导体沟道（112,216,308,418）来制造， 204），在一个或多个其它衬底（104,108,206）上形成器件电极（114,116,110,208,210,212），然后将衬底层叠在一起。 在一个实施例中，在执行层压之前，在一个基板（204,206）上形成用作栅极电介质的电介质贴片（214）。 层压为器件组装提供了低成本的途径，允许在不同衬底上单独制造不同的器件结构，并且使各种器件层产生改善的性能。

公开(公告)号：WO2004006300B1

公开(公告)日：2004-05-27

申请号：PCT/US0320267

申请日：2003-06-26

Applicant: MOTOROLA INC

Inventor： ZHANG JIE ,  BRAZIS PAUL ,  GAMOTA DANIEL ,  KALYANASUNDARAM KRISHNA ,  SCHEIFERS STEVEN ,  WIELGUS JERZY ,  CHOWDHURI ABHIJIT ROY

IPC: H01L21/00 ,  H01L35/24 ,  H01L51/00 ,  H01L51/40

CPC classification number: H01L51/0545 ,  H01L51/0021

Abstract: An organic field effect transistor utilizes a bifunctional contact-enhancing agent at various interfaces to improve carrier mobility through the organic semiconductor layer, to improve carrier injection, and to enhance adhesion via a bifunctional mechanism. The contact-enhancing agent can be situated between the gate electrode (2) and the dielectric layer (3) to form a chemical or physical bond between the gate electrode and the dielectric layer. It can also be situated between the dielectric layer and the organic semiconducting layer (4), or between the source and drain electrodes (5, 6) and the organic semiconducting layer.

Abstract translation: 有机场效应晶体管在各种界面处利用双功能接触增强剂，以改善载流子迁移率通过有机半导体层，改善载流子注入，并通过双功能机制增强粘附力。 接触增强剂可以位于栅极（2）和电介质层（3）之间，以在栅电极和电介质层之间形成化学或物理结合。 它也可以位于介电层和有机半导体层（4）之间，或位于源极和漏极（5,6）和有机半导体层之间。

公开(公告)号：WO2004006300A2

公开(公告)日：2004-01-15

申请号：PCT/US0320267

申请日：2003-06-26

Applicant: MOTOROLA INC

Inventor： ZHANG JIE ,  BRAZIS PAUL ,  GAMOTA DANIEL ,  KALYANASUNDARAM KRISHNA ,  SCHEIFERS STEVEN ,  WIELGUS JERZY ,  CHOWDHURI ABHIJIT ROY

IPC: H01L21/00 ,  H01L35/24 ,  H01L51/00 ,  H01L51/40 ,  H01L

CPC classification number: H01L51/0545 ,  H01L51/0021

Abstract: An organic field effect transistor utilizes a bifunctional contact-enhancing agent at various interfaces to improve carrier mobility through the organic semiconductor layer, to improve carrier injection, and to enhance adhesion via a bifunctional mechanism. The contact-enhancing agent can be situated between the gate electrode (2) and the dielectric layer (3) to form a chemical or physical bond between the gate electrode and the dielectric layer. It can also be situated between the dielectric layer and the organic semiconducting layer (4), or between the source and drain electrodes (5, 6) and the organic semiconducting layer.