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公开(公告)号：AU2003268514A8
公开(公告)日：2004-03-29
申请号：AU2003268514
申请日：2003-09-05
Applicant: MOTOROLA INC
Inventor： KALYANASUNDARAM KRISHNA , BRAZIS PAUL , CHASON MARC , GAMOTA DANIEL
IPC: H01L21/78 , H01L20060101 , H01L21/301 , H01L21/58 , H01L21/68 , H01L21/76 , H01L23/538 , H01L29/76 , H01L29/94 , H01L31/062 , H01L31/113 , H01L31/119
Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.
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公开(公告)号：AU2003268514A1
公开(公告)日：2004-03-29
申请号：AU2003268514
申请日：2003-09-05
Applicant: MOTOROLA INC
Inventor： BRAZIS PAUL , CHASON MARC , KALYANASUNDARAM KRISHNA , GAMOTA DANIEL
IPC: H01L20060101 , H01L21/301 , H01L21/58 , H01L21/68 , H01L21/76 , H01L21/78 , H01L23/538
Abstract: A wafer (10) having integrated circuit elements formed therein is thinned and a first carrier (41) is adhered thereto. The first carrier (41) facilitates handling of the thinned wafer (30). A second carrier (51) is then adhered as well and the various integrated circuits are singulated to yield a plurality of thinned die (81). Once the thinned die is mounted to a desired substrate (91), the first carrier (41) is readily removed. In one embodiment, the first carrier (41) has an adhesive that becomes less adherent when exposed to a predetermined stimulus (such as a given temperature range or a given frequency range of photonic energy). Such thinned die (or modules containing such die) are readily amenable to stacking in order to achieve significantly increased circuit densities.
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公开(公告)号：AU2003297348A1
公开(公告)日：2004-07-29
申请号：AU2003297348
申请日：2003-12-18
Applicant: MOTOROLA INC
Inventor： ZHANG JIE , GAMOTA DANIEL , ZHANG MIN-XIAN , BRAZIS PAUL , KALYANASUNDARAM KRISHNA
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公开(公告)号：WO2004095511A2
公开(公告)日：2004-11-04
申请号：PCT/US2004010776
申请日：2004-04-08
Applicant: MOTOROLA INC , ADEWOLE HAKEEM , BRAZIS PAUL , GAMOTA DANIEL , ZHANG JIE
Inventor： ADEWOLE HAKEEM , BRAZIS PAUL , GAMOTA DANIEL , ZHANG JIE
IPC: G06F19/00 , H01L20060101 , H01L
CPC classification number: G06K19/0723 , G06K19/0717 , G06K19/07703
Abstract: An organic semiconductor product state monitor attached to a product receives a product usefulness input, which, along with the product predetermined usefulness limit, is used to determine an indicator command to indicate a state of usefulness of the product. An organic circuit is formed and placed on a product with a power supply to control the circuit operation.
Abstract translation: 附加到产品的有机半导体产品状态监视器接收产品有用性输入，其与产品预定有用限制一起用于确定指示产品有用状态的指示符命令。 形成有机电路并放置在具有电源的产品上以控制电路操作。
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公开(公告)号：AU2003258965A8
公开(公告)日：2004-01-23
申请号：AU2003258965
申请日：2003-06-26
Applicant: MOTOROLA INC
Inventor： GAMOTA DANIEL , ZHANG JIE , CHOWDHURI ABHIJIT ROY , SCHEIFERS STEVEN , KALYANASUNDARAM KRISHNA , BRAZIS PAUL , WIELGUS JERZY
Abstract: An organic field effect transistor utilizes a bifunctional contact-enhancing agent at various interfaces to improve carrier mobility through the organic semiconductor layer, to improve carrier injection, and to enhance adhesion via a bifunctional mechanism. The contact-enhancing agent can be situated between the gate electrode (2) and the dielectric layer (3) to form a chemical or physical bond between the gate electrode and the dielectric layer. It can also be situated between the dielectric layer and the organic semiconducting layer (4), or between the source and drain electrodes (5, 6) and the organic semiconducting layer.
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Patent Agency Ranking
公开(公告)号：AU2003297348A8
公开(公告)日：2004-07-29
申请号：AU2003297348
申请日：2003-12-18
Applicant: MOTOROLA INC
Inventor： BRAZIS PAUL , ZHANG MIN-XIAN , ZHANG JIE , KALYANASUNDARAM KRISHNA , GAMOTA DANIEL
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公开(公告)号：AU2003258965A1
公开(公告)日：2004-01-23
申请号：AU2003258965
申请日：2003-06-26
Applicant: MOTOROLA INC
Inventor： KALYANASUNDARAM KRISHNA , SCHEIFERS STEVEN , WIELGUS JERZY , CHOWDHURI ABHIJIT ROY , ZHANG JIE , BRAZIS PAUL , GAMOTA DANIEL
Abstract: An organic field effect transistor utilizes a bifunctional contact-enhancing agent at various interfaces to improve carrier mobility through the organic semiconductor layer, to improve carrier injection, and to enhance adhesion via a bifunctional mechanism. The contact-enhancing agent can be situated between the gate electrode (2) and the dielectric layer (3) to form a chemical or physical bond between the gate electrode and the dielectric layer. It can also be situated between the dielectric layer and the organic semiconducting layer (4), or between the source and drain electrodes (5, 6) and the organic semiconducting layer.
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公开(公告)号：AU2003248770A8
公开(公告)日：2004-01-23
申请号：AU2003248770
申请日：2003-06-03
Applicant: MOTOROLA INC
Inventor： BRAZIS PAUL , SCHEIFERS STEVEN , CHOWDHURI ABHIJIT ROY , GAMOTA DANIEL , KALANASUNDARAM KRISHNA , WIELGUS JERZY , ZHANG JIE
IPC: H01L29/417 , H01L21/336 , H01L21/338 , H01L29/786 , H01L29/812 , H01L35/24 , H01L51/00 , H01L51/05 , H01L51/30 , H01L51/40 , H01L29/06
Abstract: An integrated circuit (100, 200, 300, 400) that includes a field effect transistor (102, 202, 302, 402) is fabricated by forming an organic semiconductor channel (112, 216, 308, 418) on one substrate (106, 204), forming device electrodes (114, 116, 110, 208, 210, 212) on one or more other substrates (104, 108, 206), and subsequently laminating the substrates together. In one embodiment, a dielectric patch (214) that functions as a gate dielectric is formed on one of the substrates (204, 206) prior to performing the lamination. Lamination provides a low cost route to device assembly, allows for separate fabrication of different device structures on different substrates, and thins various device layers resulting in improved performance.
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公开(公告)号：AU2003248770A1
公开(公告)日：2004-01-23
申请号：AU2003248770
申请日：2003-06-03
Applicant: MOTOROLA INC
Inventor： SCHEIFERS STEVEN , WIELGUS JERZY , CHOWDHURI ABHIJIT ROY , ZHANG JIE , BRAZIS PAUL , GAMOTA DANIEL , KALANASUNDARAM KRISHNA
IPC: H01L29/417 , H01L21/336 , H01L21/338 , H01L29/786 , H01L29/812 , H01L35/24 , H01L51/00 , H01L51/05 , H01L51/30 , H01L51/40
Abstract: An integrated circuit (100, 200, 300, 400) that includes a field effect transistor (102, 202, 302, 402) is fabricated by forming an organic semiconductor channel (112, 216, 308, 418) on one substrate (106, 204), forming device electrodes (114, 116, 110, 208, 210, 212) on one or more other substrates (104, 108, 206), and subsequently laminating the substrates together. In one embodiment, a dielectric patch (214) that functions as a gate dielectric is formed on one of the substrates (204, 206) prior to performing the lamination. Lamination provides a low cost route to device assembly, allows for separate fabrication of different device structures on different substrates, and thins various device layers resulting in improved performance.
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10.发明公开
公开(公告)号：EP1540734A4
公开(公告)日：2010-10-27
申请号：EP03763068
申请日：2003-06-03
Applicant: MOTOROLA INC
Inventor： ZHANG JIE , BRAZIS PAUL , GAMOTA DANIEL , KALANASUNDARAM KRISHNA , SCHEIFERS STEVEN , WIELGUS JERZY , CHOWDHURI ABHIJIT ROY
IPC: H01L29/417 , H01L21/336 , H01L21/338 , H01L29/786 , H01L29/812 , H01L35/24 , H01L51/00 , H01L51/05 , H01L51/30 , H01L51/40 , H01L29/06
CPC classification number: H01L51/0516 , B82Y10/00 , H01L27/283 , H01L51/0024 , H01L51/0036 , H01L51/0038 , H01L51/0046 , H01L51/0052 , H01L51/0053 , H01L51/0078 , H01L51/0097 , H01L51/0512 , H01L51/0541 , H01L51/0545
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