公开(公告)号：EP1082882A4

公开(公告)日：2005-10-12

申请号：EP00923062

申请日：2000-01-18

Applicant: MOTOROLA INC

Inventor： DUNN GREGORY J ,  ZHANG MIN-XIAN ,  SAVIC JOHN

IPC: H01C1/032 ,  H01C7/00 ,  H01C17/06 ,  H05K1/09 ,  H05K1/16 ,  H05K3/38 ,  H01L21/302

CPC classification number: H05K1/167 ,  H05K1/095 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0355 ,  H05K2201/0391 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1453 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T29/4913

Abstract: Printed circuit boards (6) with integral high and low value resistors (2 and 4) are efficiently produced. The method of their manufacture entails applying a first layer of a low resistance material (8) onto a dielectric substrate (6) in a predetermined thickness and pattern. The pattern defines the electrical lengths and widths of low value resistors (2), as well as pairs of terminal electrode pads (28 and 30) for the high value resistors (4). A second layer of a high resistance material (18) is applied between and in contact with the top surfaces of the facing ends of each member of the terminal pad pairs (28 and 30). The fixed lengths, widths and thicknesses of the patterned high resistance material determine the values of the high value resistors. Conductive metal terminals are provided at the ends of the low value resistors and at the distal ends of the high value resistor pad to complete the resistors.