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公开(公告)号：DE60042438D1
公开(公告)日：2009-08-06
申请号：DE60042438
申请日：2000-01-20
Applicant: MOTOROLA INC
Inventor： LEE TIEN , LACH LAWRENCE , DUNN GREGORY J
Abstract: A thin-film metal resistor (44) suitable for a multilayer printed circuit board (12), and a method for its fabrication. The resistor (44) generally has a multilayer construction, with the individual layers (34, 38) of the resistor (44) being self-aligned with each other so that a negative mutual inductance is produced that very nearly cancels out the self-inductance of each resistor layer (34, 38). As a result, the resistor (44) has a very low net parasitic inductance. In addition, the multilayer construction of the resistor (44) reduces the area of the circuit board (12) required to accommodate the resistor (44), and as a result reduces the problem of parasitic interactions with other circuit elements on other layers of the circuit board (12).
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公开(公告)号：DE69935780T2
公开(公告)日：2007-12-27
申请号：DE69935780
申请日：1999-06-29
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , SAVIC JOVICA , BEUHLER ALLYSON
IPC: G03C5/00 , G03F7/00 , H01C17/06 , H01C17/07 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/04 , H05K3/06 , H05K3/38
Abstract: A method for manufacturing a microelectronic assembly to have a resistor, and particularly a metal resistive film, with desirable processing and dimensional characteristics. The method generally entails applying a photosensitive dielectric to a substrate to form a dielectric layer. The dielectric layer is photoimaged to polymerize a first portion of the dielectric layer on a first region of the substrate, leaving the remainder of the dielectric layer unpolymerized. An electrically resistive film is then applied to the dielectric layer, and the dielectric layer is developed to remove concurrently the unpolymerized portion thereof and the portion of the resistive film overlying the unpolymerized portion, so that a portion of the resistive film remains over the second portion to form the resistor. An alternative process order is to apply the resistive film prior to exposing the dielectric layer to radiation, and then exposing the dielectric layer through the resistive film. The resistive film is preferably a multilayer film that includes an electrically resistive layer, such as NiP, NiCr or another nickel-containing alloy, and a sacrificial backing such as a layer of copper.
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公开(公告)号：CA2713433C
公开(公告)日：2014-03-04
申请号：CA2713433
申请日：2009-01-28
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , BLAKE TERANCE B , FRANCOIS HOLLY L , LIN PETER A
Abstract: A communication device contains multiple microphones that receive acoustic signals from a user and from the background. The acoustic signals from the user are enhanced using the background acoustic signals to reduce background noise. The enhanced signals are transmitted to an emergency network when an emergency call is made from the communication device. The raw signals are stored in the communication device for later retrieval or are transmitted simultaneously with the enhanced signals. The enhanced signals are transmitted using a circuit-switched voice mode while the raw signals are transmitted using a packet-switched voice mode.
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公开(公告)号：DE69937561D1
公开(公告)日：2007-12-27
申请号：DE69937561
申请日：1999-12-02
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , SAVIC JOVICA , BEUHLER ALLYSON , ZHANG MIN-XIAN , SIMONS EVERETT
Abstract: A method for manufacturing a microelectronic assembly to have aligned conductive regions and dielectric regions with desirable processing and dimensional characteristics. The invention is particularly useful for producing integral capacitors, with the desired processing and dimensional characteristics achieved with the invention yielding predictable electrical characteristics for the capacitors. The method generally entails providing a substrate with a first conductive layer, forming a dielectric layer on the first conductive layer, and then forming a second conductive layer on the dielectric layer. A first region of the second conductive layer is then removed to expose a first region of the dielectric layer, which in turn is removed to expose a first region of the first conductive layer that is also removed. From this process, the first regions of the conductive and dielectric layers are each removed by using the overlying layer or layers as a mask, so that the remaining second regions of these layers are coextensive.
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公开(公告)号：CA2728036A1
公开(公告)日：2009-12-23
申请号：CA2728036
申请日：2009-06-11
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , BLAKE TERANCE B
Abstract: A device and method of background substitution are disclosed. One or more cameras in a mobile device obtain a depth image. A processor in or external to the device segments the foreground from the background of the image. The original background is removed and a stored background image or video is substituted in place of the original background. The substituted background is altered dependent on the attitude and motion of the device, which is sensed by one or more sensors in the device. A portion of the stored background selected as the substitute background varies in correspondence with the device movement.
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Patent Agency Ranking
公开(公告)号：DE69937561T2
公开(公告)日：2008-09-04
申请号：DE69937561
申请日：1999-12-02
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , SAVIC JOVICA , BEUHLER ALLYSON , ZHANG MIN-XIAN , SIMONS EVERETT
Abstract: A method for manufacturing a microelectronic assembly to have aligned conductive regions and dielectric regions with desirable processing and dimensional characteristics. The invention is particularly useful for producing integral capacitors, with the desired processing and dimensional characteristics achieved with the invention yielding predictable electrical characteristics for the capacitors. The method generally entails providing a substrate with a first conductive layer, forming a dielectric layer on the first conductive layer, and then forming a second conductive layer on the dielectric layer. A first region of the second conductive layer is then removed to expose a first region of the dielectric layer, which in turn is removed to expose a first region of the first conductive layer that is also removed. From this process, the first regions of the conductive and dielectric layers are each removed by using the overlying layer or layers as a mask, so that the remaining second regions of these layers are coextensive.
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公开(公告)号：DE69935780D1
公开(公告)日：2007-05-24
申请号：DE69935780
申请日：1999-06-29
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , SAVIC JOVICA , BEUHLER ALLYSON
IPC: G03C5/00 , G03F7/00 , H01C17/06 , H01C17/07 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/04 , H05K3/06 , H05K3/38
Abstract: A method for manufacturing a microelectronic assembly to have a resistor, and particularly a metal resistive film, with desirable processing and dimensional characteristics. The method generally entails applying a photosensitive dielectric to a substrate to form a dielectric layer. The dielectric layer is photoimaged to polymerize a first portion of the dielectric layer on a first region of the substrate, leaving the remainder of the dielectric layer unpolymerized. An electrically resistive film is then applied to the dielectric layer, and the dielectric layer is developed to remove concurrently the unpolymerized portion thereof and the portion of the resistive film overlying the unpolymerized portion, so that a portion of the resistive film remains over the second portion to form the resistor. An alternative process order is to apply the resistive film prior to exposing the dielectric layer to radiation, and then exposing the dielectric layer through the resistive film. The resistive film is preferably a multilayer film that includes an electrically resistive layer, such as NiP, NiCr or another nickel-containing alloy, and a sacrificial backing such as a layer of copper.
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公开(公告)号：DE60036907D1
公开(公告)日：2007-12-13
申请号：DE60036907
申请日：2000-01-18
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , ZHANG MIN-XIAN , SAVIC JOHN
Abstract: Printed circuit boards with integral high and low value resistors are efficiently produced. The method of their manufacture entails applying a first layer of a low resistance material onto a dielectric substrate in a predetermined thickness and pattern. The pattern defines the electrical lengths and widths of low value resistors, as well as pairs of terminal electrode pads for the high value resistors. A second layer of a high resistance material is applied between and in contact with the top surfaces of the facing ends of each member of the terminal pad pairs. The fixed lengths, widths and thicknesses of the patterned high resistance material determine the values of the high value resistors. Conductive metal terminals are provided at the ends of the low value resistors and at the distal ends of the high value resistor pad pairs to complete the resistors.
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公开(公告)号：AT359539T
公开(公告)日：2007-05-15
申请号：AT99939643
申请日：1999-06-29
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , SAVIC JOVICA , BEUHLER ALLYSON
IPC: G03F7/00 , H01C17/06 , H01C17/07 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/04 , H05K3/06 , H05K3/38 , G03C5/00
Abstract: A method for manufacturing a microelectronic assembly to have a resistor, and particularly a metal resistive film, with desirable processing and dimensional characteristics. The method generally entails applying a photosensitive dielectric to a substrate to form a dielectric layer. The dielectric layer is photoimaged to polymerize a first portion of the dielectric layer on a first region of the substrate, leaving the remainder of the dielectric layer unpolymerized. An electrically resistive film is then applied to the dielectric layer, and the dielectric layer is developed to remove concurrently the unpolymerized portion thereof and the portion of the resistive film overlying the unpolymerized portion, so that a portion of the resistive film remains over the second portion to form the resistor. An alternative process order is to apply the resistive film prior to exposing the dielectric layer to radiation, and then exposing the dielectric layer through the resistive film. The resistive film is preferably a multilayer film that includes an electrically resistive layer, such as NiP, NiCr or another nickel-containing alloy, and a sacrificial backing such as a layer of copper.
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公开(公告)号：DE69942090D1
公开(公告)日：2010-04-15
申请号：DE69942090
申请日：1999-12-02
Applicant: MOTOROLA INC
Inventor： DUNN GREGORY J , LACH LARRY , SAVIC JOVICA , BEUHLER ALLYSON , SIMONS EVERETT
IPC: H05K1/16 , H01F17/00 , H01F41/04 , H01L21/768 , H01L23/522 , H05K1/00 , H05K3/00 , H05K3/06 , H05K3/46
Abstract: A method for fabricating circuit board conductors with desirable processing and reduced self and mutual capacitance. The method generally entails forming a metal layer on a positive-acting photodielectric layer formed on a substrate, and then etching the metal layer to form at least two conductor traces that cover two separate regions of the photodielectric layer while exposing a third region of the photodielectric layer between the two regions. The third region of the photodielectric layer is then irradiated and developed using the two traces as a photomask, so that the third region of the photodielectric layer is removed. The two remaining regions of the photodielectric layer masked by the traces remain on the substrate and are separated by an opening formed by the removal of the third dielectric region. As a result, the traces are not only separated by a void immediately therebetween formed when the metal layer was etched, but are also separated by the opening formed in the photodielectric layer by the removal of the third region of the photodielectric layer. Traces formed in accordance with the above may be formed as adjacent and parallel conductors or adjacent inductor windings of an integral inductor.
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