公开(公告)号：WO2015042700A1

公开(公告)日：2015-04-02

申请号：PCT/CA2014/050902

申请日：2014-09-19

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert Mark

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81B7/007 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2207/07 ,  B81B2207/095 ,  B81C1/00238 ,  B81C2201/013 ,  B81C2203/0792

Abstract: A MEMS and a method of manufacturing MEMS components are provided. The method includes providing a MEMS wafer stack including a top cap wafer, a MEMS wafer and optionally a bottom cap wafer. The MEMS wafer has MEMS structures patterned therein. The MEMS wafer and the cap wafers include insulated conducting channels forming insulated conducting pathways extending within the wafer stack. The wafer stack is bonded to an integrated circuit wafer having electrical contacts on its top side, such that the insulated conducting pathways extend from the integrated circuit wafer to the outer side of the top cap wafer. Electrical contacts on the outer side of the top cap wafer are formed and are electrically connected to the respective insulated conducting channels of the top cap wafer. The MEMS wafer stack and the integrated circuit wafer are then diced into components having respective sealed chambers and MEMS structures housed therein.

Abstract translation: 提供MEMS和制造MEMS部件的方法。 该方法包括提供包括顶盖晶片，MEMS晶片和任选的底盖晶片的MEMS晶片叠层。 MEMS晶片具有图案化的MEMS结构。 MEMS晶片和盖晶片包括形成在晶片堆叠内延伸的绝缘导电路径的绝缘导电沟道。 晶片堆叠结合到在其顶侧上具有电触点的集成电路晶片，使得绝缘导电路径从集成电路晶片延伸到顶盖晶片的外侧。 形成顶盖晶片外侧的电触点，并与顶盖晶片的相应的绝缘导电通道电连接。 然后将MEMS晶片堆叠和集成电路晶片切割成具有容纳在其中的相应密封室和MEMS结构的部件。

公开(公告)号：WO2015013828A1

公开(公告)日：2015-02-05

申请号：PCT/CA2014/050730

申请日：2014-08-01

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01C19/5712 ,  G01P15/14 ,  G01P15/18

CPC classification number: G01C19/56 ,  G01C19/5769 ,  H01L2224/94

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract translation: 提供了MEMS运动传感器及其制造方法。 该传感器包括一个MEMS晶片，其中包括一个检测质量块和弹性弹簧，弹性悬挂该质量块，并使证明物质相对于外框沿相互正交的x，y和z轴移动。 传感器包括顶盖和底盖晶片，其包括顶盖电极和底盖电极，形成具有检测质量的电容器，电极被配置为检测检测质量块的运动。 电触头设置在顶盖晶片上，其中一些连接到相应的顶盖电极，而另一些则通过绝缘导电通路连接到相应的底盖电极，绝缘导电通道沿着z轴从相应的底部电极之一延伸 帽电极并且依次通过底盖晶片，MEMS晶片的外框架和顶盖晶片。

公开(公告)号：EP3028007A1

公开(公告)日：2016-06-08

申请号：EP14831791.0

申请日：2014-08-01

Applicant: Motion Engine Inc.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01C19/5712 ,  G01P15/14 ,  G01P15/18

CPC classification number: G01C19/56 ,  G01C19/5769 ,  H01L2224/94

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract translation: 提供了MEMS运动传感器及其制造方法。 该传感器包括一个MEMS晶片，其中包括一个检测质量块和弹性弹簧，悬挂该质量块，并使检测质量块相对于外框沿着相互正交的x，y和z轴移动。 传感器包括顶盖和底盖晶片，其包括形成具有检测质量的电容器的顶部和底部电极电极，电极被配置为检测检测质量块的运动。 电触点设置在顶盖晶片上，其中一些连接到相应的顶盖电极，而另一些则通过绝缘导电路径连接到相应的底盖电极，绝缘导电通道沿着z轴从相应的底部电极之一延伸 帽电极并且依次通过底盖晶片，MEMS晶片的外框架和顶盖晶片。