公开(公告)号：WO2017132539A8

公开(公告)日：2017-08-03

申请号：PCT/US2017/015393

申请日：2017-01-27

Applicant: MOTION ENGINE INC. ,  BOYSEL, Robert, Mark

Inventor： BOYSEL, Robert, Mark ,  ROSS, Louis ,  GATLING, William, Lance

IPC: G01C19/5712 ,  G01P15/08 ,  H01Q1/00 ,  H01Q1/27 ,  H01Q3/26 ,  H01Q19/10 ,  G01S7/40 ,  G01S13/89 ,  G01S15/89 ,  G01S13/02

Abstract: Systems and methods are provided for determining the position of sensor elements in an sensor system (1000). The sensor system includes a plurality of sensor elements (1040). The platform comprises a plurality of MEMS IMUs (1020), each associated with one of the sensor elements (1040), measuring the acceleration and angular rate of the sensor elements. A controller (1030) determines the position and attitude of the sensor elements (1040), based on the acceleration and angular rate measured by each of the MEMS IMUs (1020).

公开(公告)号：WO2015103688A1

公开(公告)日：2015-07-16

申请号：PCT/CA2014/051245

申请日：2014-12-22

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: B81B7/02 ,  B81B5/00 ,  G01D5/56 ,  G01P15/125 ,  G01P15/18 ,  H01L23/52

CPC classification number: G01P15/18 ,  B81B5/00 ,  B81B7/007 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2207/012 ,  B81B2207/07 ,  G01P15/0802 ,  G01P15/125 ,  H01L2224/16145

Abstract: The present invention provides a 3D System ("3DS") MEMS architecture that enables the integration of MEMS devices with IC chips to form a System on Chip (So C) or System in Package (Si P). The integrated MEMS system comprises at least one MEMS chip, including MEMS transducers, and at least one IC chip, including not only MEMS processing circuitry, but also additional/auxiliary circuitry to process auxiliary signals. The MEMS and IC chips are bump bonded. The MEMS chip includes first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducers and the IC chip, for processing; and the second conducting pathways extend through the entire thickness of the MEMS chip, to conduct auxiliary signals, such as power, RF, I/Os, to the IC chip, to be processed the additional circuitry.

Abstract translation: 本发明提供了一种3D系统（“3DS”）MEMS架构，其能够将MEMS器件与IC芯片集成以形成片上系统（So C）或系统级封装（Si P）。 集成MEMS系统包括至少一个MEMS芯片，包括MEMS换能器，以及至少一个IC芯片，不仅包括MEMS处理电路，还包括用于处理辅助信号的附加/辅助电路。 MEMS和IC芯片是凸点焊接的。 MEMS芯片包括第一和第二绝缘导电路径。 第一路通过传感器和IC芯片之间的MEMS信号进行处理; 并且第二导电路径延伸穿过MEMS芯片的整个厚度，以将辅助信号（例如功率，RF，I / O）传导到IC芯片，以便对附加电路进行处理。

公开(公告)号：WO2015003264A1

公开(公告)日：2015-01-15

申请号：PCT/CA2014/050635

申请日：2014-07-04

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert, Mark ,  ROSS, Louis

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2224/94

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

Abstract translation: 提供了一种MEMS器件。 该器件包括MEMS晶片，顶盖晶片和底盖晶片。 顶盖和底盖晶片分别结合到MEMS晶片的第一和第二侧，MEMS和盖晶片是导电的。 顶盖晶片的外侧设有电触点。 MEMS晶片，顶盖晶片和底盖晶片限定用于容纳MEMS结构的空腔。 该器件包括从底盖晶片内部穿过MEMS晶片并穿过顶盖晶片延伸的绝缘导电通路。 通路连接到顶盖晶片上的各个电触点，用于将电信号从底盖晶片转移到顶盖晶片上的电触点。 还提供了一种制造MEMS器件的方法。

公开(公告)号：WO2015013828A1

公开(公告)日：2015-02-05

申请号：PCT/CA2014/050730

申请日：2014-08-01

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01C19/5712 ,  G01P15/14 ,  G01P15/18

CPC classification number: G01C19/56 ,  G01C19/5769 ,  H01L2224/94

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract translation: 提供了MEMS运动传感器及其制造方法。 该传感器包括一个MEMS晶片，其中包括一个检测质量块和弹性弹簧，弹性悬挂该质量块，并使证明物质相对于外框沿相互正交的x，y和z轴移动。 传感器包括顶盖和底盖晶片，其包括顶盖电极和底盖电极，形成具有检测质量的电容器，电极被配置为检测检测质量块的运动。 电触头设置在顶盖晶片上，其中一些连接到相应的顶盖电极，而另一些则通过绝缘导电通路连接到相应的底盖电极，绝缘导电通道沿着z轴从相应的底部电极之一延伸 帽电极并且依次通过底盖晶片，MEMS晶片的外框架和顶盖晶片。

公开(公告)号：WO2017132539A1

公开(公告)日：2017-08-03

申请号：PCT/US2017/015393

申请日：2017-01-27

Applicant: MOTION ENGINE INC. ,  BOYSEL, Robert, Mark

Inventor： BOYSEL, Robert, Mark ,  ROSS, Louis ,  GATLING, William, Lance

IPC: G01C19/5712 ,  G01P15/08 ,  H01Q1/00 ,  H01Q1/27 ,  H01Q3/26 ,  H01Q19/10 ,  G01S7/40 ,  G01S13/89 ,  G01S15/89 ,  G01S13/02

CPC classification number: G01S7/4026 ,  B81B2201/0235 ,  G01C21/165 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01S13/89 ,  G01S15/8915 ,  G01S2013/0245 ,  H01Q1/005 ,  H01Q1/28 ,  H01Q3/267 ,  H01Q19/10

Abstract: Systems and methods are provided for determining the position of sensor elements in an sensor system (1000). The sensor system includes a plurality of sensor elements (1040). The platform comprises a plurality of MEMS IMUs (1020), each associated with one of the sensor elements (1040), measuring the acceleration and angular rate of the sensor elements. A controller (1030) determines the position and attitude of the sensor elements (1040), based on the acceleration and angular rate measured by each of the MEMS IMUs (1020).

Abstract translation: 系统和方法被提供用于确定传感器系统（1000）中的传感器元件的位置。 传感器系统包括多个传感器元件（1040）。 平台包括多个MEMS IMU（1020），每个MEMS IMU与传感器元件（1040）中的一个相关联，用于测量传感器元件的加速度和角速率。 控制器（1030）基于由每个MEMS IMU（1020）测量的加速度和角速率来确定传感器元件（1040）的位置和姿态。

公开(公告)号：WO2015184531A1

公开(公告)日：2015-12-10

申请号：PCT/CA2015/050018

申请日：2015-01-12

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01C19/5712 ,  G01C19/56 ,  G01P13/00 ,  G01P15/18

CPC classification number: G01C19/5712 ,  B81B2201/0235 ,  G01C19/5719 ,  G01C19/5733 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/18 ,  G01P2015/084

Abstract: A micro-electro-mechanical system (MEMS) motion sensor is provided that includes a MEMS wafer having a frame structure, a plurality of proof masses suspended to the frame structure, movable in three dimensions, and enclosed in one or more cavities. The MEMS sensor includes top and bottom cap wafers bonded to the MEMS wafer and top and bottom electrodes provided in the top and bottom cap wafers, forming capacitors with the plurality of proof masses, and being together configured to detect motions of the plurality of proof masses. The MEMS sensor further includes first electrical contacts provided on the top cap wafer and electrically connected to the top electrodes, and a second electrical contacts provided on the top cap wafer and electrically connected to the bottom electrodes by way of vertically extending insulated conducting pathways. A method for measuring acceleration and angular rate along three mutually orthogonal axes is also provided.

Abstract translation: 提供了一种微电子机械系统（MEMS）运动传感器，其包括具有框架结构的MEMS晶片，悬挂于框架结构的多个校准块，可在三维中移动并封闭在一个或多个空腔中。 MEMS传感器包括接合到MEMS晶片的顶盖和底盖晶片，以及设置在顶盖和底盖晶片中的顶电极和底电极，形成具有多个检验质量块的电容器，并且一起构造成检测多个检验质量块的运动 。 MEMS传感器还包括设置在顶盖晶片上并电连接到顶部电极的第一电触点和设置在顶盖晶片上并通过垂直延伸的绝缘导电路径电连接到底部电极的第二电触点。 还提供了一种用于沿三个相互正交的轴测量加速度和角速度的方法。

公开(公告)号：WO2015154173A1

公开(公告)日：2015-10-15

申请号：PCT/CA2015/050026

申请日：2015-01-15

Applicant: MOTION ENGINE INC.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01L9/12

CPC classification number: G01L9/0073 ,  B81B7/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2207/012 ,  B81B2207/015 ,  B81B2207/07 ,  B81C1/00182 ,  B81C1/00301 ,  B81C2203/0109 ,  B81C2203/0792 ,  G01L13/025

Abstract: The present invention provides a MEMS pressure sensor and a manufacturing method. The pressure is formed by a top cap wafer, a MEMS wafer and a bottom cap wafer. The MEMS wafer comprises a frame and a membrane, the frame defining a cavity. The membrane is suspended by the frame over the cavity. The bottom cap wafer closes the cavity. The top cap wafer has a recess defining with the membrane a capacitance gap. The top cap wafer comprises a top cap electrode located over the membrane and forming, together with the membrane, a capacitor to detect a deflection of the membrane. Electrical contacts on the top cap wafer are connected to the top cap electrode. A vent is extends from outside of the sensor into the cavity or the capacitance gap. The pressure sensor can include two cavities and two capacitance gaps, to form a differential pressure sensor.

Abstract translation: 本发明提供一种MEMS压力传感器及其制造方法。 压力由顶盖晶片，MEMS晶片和底盖晶片形成。 MEMS晶片包括框架和膜，框架限定空腔。 膜通过框架悬挂在空腔上。 底盖晶片封闭空腔。 顶盖晶片具有限定了膜的电容间隙的凹部。 顶盖晶片包括位于膜上方的顶盖电极，并与薄膜一起形成用于检测膜偏转的电容器。 顶盖晶片上的电触点连接到顶盖电极。 通气孔从传感器的外部延伸到空腔或电容间隙。 压力传感器可以包括两个空腔和两个电容间隙，以形成差压传感器。

公开(公告)号：EP3019442A1

公开(公告)日：2016-05-18

申请号：EP14822259.9

申请日：2014-07-04

Applicant: Motion Engine Inc.

Inventor： BOYSEL, Robert, Mark ,  ROSS, Louis

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00301 ,  H01L2224/94

Abstract: A MEMS device is provided. The device includes a MEMS wafer, a top cap wafer and a bottom cap wafer. The top and bottom cap wafers are respectively bonded to first and second sides of the MEMS wafer, the MEMS and cap wafers being electrically conductive. The outer side of the top cap wafer is provided with electrical contacts. The MEMS wafer, the top cap wafer and the bottom cap wafer define a cavity for housing a MEMS structure. The device includes insulated conducting pathways extending from within the bottom cap wafer, through the MEMS wafer and through the top cap wafer. The pathways are connected to the respective electrical contacts on the top cap wafer, for routing electrical signals from the bottom cap wafer to the electrical contacts on the top cap wafer. A method of manufacturing the MEMS device is also provided.

公开(公告)号：EP3028007A1

公开(公告)日：2016-06-08

申请号：EP14831791.0

申请日：2014-08-01

Applicant: Motion Engine Inc.

Inventor： BOYSEL, Robert Mark ,  ROSS, Louis

IPC: G01C19/5712 ,  G01P15/14 ,  G01P15/18

CPC classification number: G01C19/56 ,  G01C19/5769 ,  H01L2224/94

Abstract: A MEMS motion sensor and its manufacturing method are provided. The sensor includes a MEMS wafer including a proof mass and flexible springs suspending the proof mass and enabling the proof mass to move relative to an outer frame along mutually orthogonal x, y and z axes. The sensor includes top and bottom cap wafers including top and bottom cap electrodes forming capacitors with the proof mass, the electrodes being configured to detect a motion of the proof mass. Electrical contacts are provided on the top cap wafer, some of which are connected to the respective top cap electrodes, while others are connected to the respective bottom cap electrodes by way of insulated conducting pathways, extending along the z axis from one of the respective bottom cap electrodes and upward successively through the bottom cap wafer, the outer frame of the MEMS wafer and the top cap wafer.

Abstract translation: 提供了MEMS运动传感器及其制造方法。 该传感器包括一个MEMS晶片，其中包括一个检测质量块和弹性弹簧，悬挂该质量块，并使检测质量块相对于外框沿着相互正交的x，y和z轴移动。 传感器包括顶盖和底盖晶片，其包括形成具有检测质量的电容器的顶部和底部电极电极，电极被配置为检测检测质量块的运动。 电触点设置在顶盖晶片上，其中一些连接到相应的顶盖电极，而另一些则通过绝缘导电路径连接到相应的底盖电极，绝缘导电通道沿着z轴从相应的底部电极之一延伸 帽电极并且依次通过底盖晶片，MEMS晶片的外框架和顶盖晶片。