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    Optical device
    11.
    发明专利
    Optical device 审中-公开
    光学装置

    公开(公告)号：JP2006049512A

    公开(公告)日：2006-02-16

    申请号：JP2004227121

    申请日：2004-08-03

    Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

    Inventor： IWASAKI YASUNORI ,  FUKUYAMA MASASHI ,  IDE AKIHIRO

    IPC: H01L31/02 ,  G02B6/42 ,  H01L31/0232

    Abstract: PROBLEM TO BE SOLVED: To improve the moisture resistance, crosstalk characteristic, or the like, of an optical device in which a photodiode (PD) or a PD array is incorporated.
    SOLUTION: The optical device 10 includes the PD array 26 having a first paired electrode 56, a sub-mount 28 having a second paired electrode 58, and a glass substrate 14 having a V-groove 12 for fixing an optical fiber 16. Among them, the PD array 26 and the sub-mount 28 are connected through a moisture permeation preventive resin 64 in which conductive particles 66 are distributed and which is set to black. The first paired electrode 56 and the second paired electrode 58 isolated mutually at a predetermined interval are surrounded by this moisture permeation preventive resin 64 and protected.
    COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提高其中掺入光电二极管（PD）或PD阵列的光学装置的耐湿性，串扰特性等。 解决方案：光学装置10包括具有第一成对电极56的PD阵列26，具有第二成对电极58的副底座28和具有用于固定光纤16的V形槽12的玻璃基板14 其中，PD阵列26和副底座28通过分布导电粒子66并被设定为黑色的防潮树脂64连接。 以预定间隔相互隔离的第一配对电极56和第二配对电极58被该防湿透过树脂64包围并被保护。 版权所有（C）2006，JPO＆NCIPI

    Method for manufacturing composite substrate
    15.
    发明专利
    Method for manufacturing composite substrate 有权
    制造复合基板的方法

    公开(公告)号：JP2011091650A

    公开(公告)日：2011-05-06

    申请号：JP2009243804

    申请日：2009-10-22

    Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

    Inventor： HORI YUJI ,  KOBAYASHI HIROTOSHI ,  IWASAKI YASUNORI

    IPC: H03H3/10 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/337 ,  H03H9/145 ,  H03H9/25

    Abstract: PROBLEM TO BE SOLVED: To prevent a passing characteristic of an SAW filter having a resonator structure from largely varying due to a temperature in a composite substrate in which a support substrate is an Si substrate. SOLUTION: First, the Si substrates having different resistivity are prepared, and the relationship between a ratio r of a thickness t Si of the Si substrate to a thickness t pz of a piezoelectric substrate and a TCF in a resonance frequency frp of a parallel arm resonator Rp (hereinafter referred to as TCFfr), and the relationship between the ratio r and a TCF at an antiresonance frequency fas of a series arm resonator Rs (hereinafter referred to as TCFfa) are checked for each resistivity of the Si substrate. Secondly, the resistivity of the Si substrate to be used this time is set, and the ratio r is set so that an absolute value of the TCFfr corresponding to the set resistivity and an absolute value of the TCFfa become 20 ppm/°C or less. The piezoelectric substrate is jointed to the Si substrate to be used this time, and at least one of the piezoelectric substrate and the Si substrate is ground and/or polished to attain the ratio r set previously. COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：为了防止具有谐振器结构的SAW滤波器的通过特性由于其中支撑衬底是Si衬底的复合衬底中的温度而大大变化。 解决方案：首先，制备具有不同电阻率的Si衬底，并且Si衬底的厚度t SB SB 与厚度t SB SB / SB SB之间的关系 并且在并联臂谐振器Rp（以下称为TCFfr）的谐振频率frp中的压电衬底和TCF之间的关系，以及串联臂谐振器Rs的反谐振频率fas之间的比率r和TCF之间的关系 称为TCFfa）检查Si衬底的每个电阻率。 其次，设定此次使用的Si衬底的电阻率，设定比率r，使得对应于设定电阻率的TCFfr的绝对值和TCFfa的绝对值为20ppm /℃以下 。 此次压电基片与Si基板接合，并且将压电基板和Si基板中的至少一个研磨和/或抛光以获得先前设定的比率r。 版权所有（C）2011，JPO＆INPIT

    Measuring instrument and its manufacturing device
    16.
    发明专利
    Measuring instrument and its manufacturing device 有权
    测量仪器及其制造设备

    公开(公告)号：JP2005221327A

    公开(公告)日：2005-08-18

    申请号：JP2004028307

    申请日：2004-02-04

    Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

    Inventor： FUKUYAMA MASASHI ,  IWASAKI YASUNORI ,  IDE AKIHIRO

    IPC: G01N21/64 ,  G01N15/14

    Abstract: PROBLEM TO BE SOLVED: To effectively actualize reduction in cost and miniaturization of an instrument itself while assuring long-term reliability, in optically measuring the properties of an object under measurement with the object disposed between optical fiber arrays. SOLUTION: This measuring instrument 10A comprises a base 12 and an optical fiber array 16 made up of four optical fibers 14. A principal plane 12a of the base 12 is provided with four V-grooves for therein placing and fixing the fiber array 16, and a crossing groove 22, of a V-groove shape for example, for therein placing and thereto fixing a capillary 20. The capillary 20 is placed in and fixed to the crossing groove 22 with its axial direction made to coincide with the axial direction of the crossing groove 22. This capillary 20 has a cylindrical shape with a hollow part 30 axially formed therein. The hollow part 30 is supplied with a substance 32 under measurement. COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题：为了有效地实现仪器本身的成本降低和小型化，同时确保长期可靠性，光学测量被测物体的性质，其中物体设置在光纤阵列之间。 解决方案：该测量仪器10A包括基座12和由四条光纤14组成的光纤阵列16.基座12的主平面12a设有四个V形槽，用于放置和固定光纤阵列 16和交叉槽22，例如V槽形状，用于放置和固定毛细管20.毛细管20被放置并固定到交叉槽22，其轴向方向与轴向 该毛细管20具有轴向形成在其中的中空部30的圆筒形状。 中空部30被供给被测量物质32。 版权所有（C）2005，JPO＆NCIPI

    OPTICAL HEAD
    17.
    发明专利
    OPTICAL HEAD 失效

    公开(公告)号：JP2001281506A

    公开(公告)日：2001-10-10

    申请号：JP2000099916

    申请日：2000-03-31

    Applicant: NGK INSULATORS LTD

    Inventor： IWASAKI YASUNORI

    IPC: G02B6/42 ,  H01L31/0232 ,  H01L33/00 ,  H01L33/08 ,  H01L33/62 ,  H04B10/25 ,  H04B10/2507 ,  H04B10/12 ,  H04B10/13 ,  H04B10/135 ,  H04B10/14

    Abstract: PROBLEM TO BE SOLVED: To save the labor of a positioning adjustment performed conventionally using inspection light, to prevent the hindrance of optical signal transmission by reducing the noise of reflected light originating from the end face of an optical fiber opposed to a light receiving surface or a light emitting element compared with a conventional one having a nearly parallel light receiving and transmitting surface and the end surface of an optical fiber, to cut the end surface inclined with good machining accuracy, and to provide an optical head with good joint efficiency by reducing an angle formed by the light receiving and transmitting surface and the end surface of the optical fiber to less than 8 degrees. SOLUTION: The optical head is provided with a mount material 30 to fix an optical element 10, and a mount material 40 to fix an optical fiber array 20 to which the optical fiber 21 is connected. The optical fiber 21 is optically connected to the optical element 10, and the angle formed by the light receiving and transmitting surface of the optical element 10 and the end surface of the optical fiber 21 is 2 degrees.

    OPTICAL DEVICE
    18.
    发明专利
    OPTICAL DEVICE 失效

    公开(公告)号：JP2000304983A

    公开(公告)日：2000-11-02

    申请号：JP11137899

    申请日：1999-04-19

    Applicant: NGK INSULATORS LTD

    Inventor： TOYODA SHUHEI ,  IWASAKI YASUNORI ,  MATSUHIRO KEIJI

    IPC: G02B6/30 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022

    Abstract: PROBLEM TO BE SOLVED: To obtain a waveguide sealing material which can be sealed airtightly with a simple structure by arranging a waveguide substrate at a feedthrough part of an optical device package. SOLUTION: A glass waveguide substrate 1 has a laser array 2 fixed at one end and an optical waveguide 3 optically coupled with the laser array 2 is optically coupled also with an optical fiber 5 supported by a connector 4. The glass waveguide substrate 1 is inserted into a field part 11 provided on a flank of the package 10 and an airtight sealant 12 is charged between the glass waveguide substrate 1 and field part 11 and fixed along the whole outer periphery in a flat plate shape to obtain secure airtight sealing.

    SUB-MOUNT, OPTICAL ELEMENT USING IT, AND MANUFACTURE OF ITS WIRING SECTION
    19.
    发明专利
    SUB-MOUNT, OPTICAL ELEMENT USING IT, AND MANUFACTURE OF ITS WIRING SECTION 失效

    公开(公告)号：JPH10261820A

    公开(公告)日：1998-09-29

    申请号：JP6774497

    申请日：1997-03-21

    Applicant: NGK INSULATORS LTD

    Inventor： ENOMOTO AKIO ,  ITO EIJI ,  IWASAKI YASUNORI

    IPC: H01L23/12 ,  H01L33/26 ,  H01L33/38 ,  H01L33/40 ,  H01L33/62 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/12 ,  H01L33/00

    Abstract: PROBLEM TO BE SOLVED: To provide a sub-mount having a wiring section which is improved in continuity reliability and the manufacturing process of which can be simplified. SOLUTION: A sub-mount 1 is constituted of a ceramic substrate 2 having a first flat surface for placing optical parts and a massive electrode 3 which is buried in the second flat surface of the substrate 2 so that the first surface 3a of the electrode 3 may be exposed on the first flat surface of the substrate 2 in a flushed state and, at the same time, the second surface 3b of the electrode 3 may be flushed with the second flat surface of the substrate 2. An optical element is formed by providing a photodiode or laser diode on the first flat surface of the substrate 2 of the sub-mount 1 as the optical parts. In addition, the wiring section of the sub-mount 1 is formed by forming punoced holes through a ceramic green sheet and filling up the punched holes with printed metallized paste composed of a conductive material, and then, baking the sheet after cutting the sheet into pieces or cutting the sheet into pieces after baking.

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