Abstract:
PROBLEM TO BE SOLVED: To provide a light emitting semiconductor element which is enhanced in radiation efficiency, and a method of manufacturing the light emitting semiconductor element.SOLUTION: The light emitting semiconductor element has a first main surface and a second main surface, and a semiconductor base of the semiconductor element is formed by a stack of various group III-V nitride semiconductor layers. At least part of produced radiation is passed through the first main surface to be output and coupled, and a reflector is bonded to the second main surface. A group III-V nitride layer is bonded to a junction substrate having a substrate base and an intermediate layer, and the substrate base has a larger coefficient of thermal expansion than the group III-V nitride layer, which is deposited on the intermediate layer.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing an optoelectronics device using an ion-assisted application method, and to provide the optoelectronics device. SOLUTION: The method includes: a step (A) of providing a semiconductor layer sequence that has at least one active area, wherein the active area is suitable for emitting electromagnetic radiation during operations; and a step (B) of applying at least one layer on the first surface of the semiconductor sequence by the ion-assisted application method. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an optoelectronic semiconductor chip capable of extremely effectively operating the chip, and manufacturing at an extremely economical cost. SOLUTION: The electronics semiconductor chip is formed of a growth substrate (1) equipped with a structured growing surface (2) having a lot of protrudes (4) and recesses (3), and an array of active layers (5) deposited on the growing surface (2). COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To obtain a III-V nitride semiconductor material, based radiation-emitting semiconductor, which allows its manufacture to be simple in terms of technology and thereby being inexpensive to be performed, and has high external quantum efficiency. SOLUTION: This radiation-emitting semiconductor chip is constituted, in which a thin-layer element is attached on a conductive substrate in a p-type side and has a contact surface in a n-type side, a buffer layer adjoining the contact surface of the thin-layer element has an AlGaN-based material, a side facing the contact surface of the buffer layer has the Al content higher than that of an side opposite to the contact surface, the buffer layer has many conductive regions made from the III-V nitride semiconductor material, and remaining regions of the buffer layer have other III-V nitride semiconductor materials, and which has many layers made from III-V nitride semiconductor materials and provided with n-type and p-type sides. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method of fabricating a multitude of semiconductor chips of high quality achieving an improved yield. SOLUTION: The method comprises steps of: forming on a baseboard 1 a mask layer 3 having a plurality of windows opened to the baseboard 1; growing a semiconductor material 5 on the baseboard such that the semiconductor material is grown starting from on the windows so as to make excess growth, merge in the midway between neighboring windows beyond the mask layer and form merge regions 8 there; growing arrays of element layers on the semiconductor material; and separating the combination made up of the baseboard, the mask layer, the semiconductor material and the arrays of element layers into individual semiconductor chips along the merge regions. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an improved semiconductor substrate particularly for an optoelectronic device capable of reflecting emitted radiation, and thereby suppressing the absorption of the radiation that intrudes. SOLUTION: In the semiconductor substrate (1), a reflective laminar region (3) is arranged. The laminar region (3) is introduced in the semiconductor substrate (1), and the region contains different materials distributed in layers. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device that uses a nitride-compound semiconductor as a base, has an improved contact metallizing section, and emits radiations. SOLUTION: In the semiconductor device that is equipped with a semiconductor body (1) having a nitride-compound semiconductor, arranges a contact metallizing section (3) on a surface (2) of the semiconductor body, and emits radiations, the contact metallizing section (3) can transmit radiations, and is at least partially covered with a conductive contact layer (4) that can transmit radiations. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To offer a semiconductor device that emits radiation with vertical emission direction, which enables high spectral purity of radiation and simple electrical connection. SOLUTION: This semiconductor device that emits radiation with vertical emission direction has a substrate, a first reflector layer, a semiconductor layer equipped with a radiation-generating active layer, and a second reflector layer. The second reflector layer, together with the first reflector layer, forms a resonator whose axis represents the vertical emission direction of the semiconductor device, and is at least partly transmissive for radiation generated. The radiation passes through the second reflector layer, and is emitted out from the semiconductor device. The substrate is made of a conductive material. The first reflector layer is doped, epitaxially grown, distributed Bragg reflector layer. COPYRIGHT: (C)2003,JPO
Abstract:
Disclosed is a composite substrate (1) comprising a substrate member (2) and a wear layer (31) that is attached to the substrate member (2). A planarizing layer (4) is disposed between the wear layer (31) and the substrate member (2). Also disclosed is a method for producing a composite substrate (1), in which a planarizing layer (4) is applied to a previously provided wear substrate (3). The wear substrate (3) is attached to a substrate member (2) for the composite substrate (1). The wear substrate (3) is then separated such that a wear layer (31) of the wear substrate (3) for the composite substrate (1) remains on the substrate member (2).
Abstract:
According to the invention, a semiconductor component is produced for the emission of electromagnetic radiation, in particular, light, which is characterised by comprising an active layer for production of radiation, a p contact, electrically connected to the active layer, an n contact, electrically connected to the active layer and a current limiting structure for the definition of a current path, whereby the current limiting structure is provided between the n contact and the active layer.