公开(公告)号：AU4175800A

公开(公告)日：2000-10-09

申请号：AU4175800

申请日：2000-03-22

Applicant: SENSYS INSTR CORP

Inventor： STANKE FRED E ,  WEBER-GRABAU MICHAEL ,  RUTH DOUGLAS E ,  TONG EDRIC H ,  CAHILL JAMES M JR ,  CARLISLE CLINTON ,  BURKE ELLIOT ,  PHAM HUNG

IPC: B24B49/12 ,  G01B11/06 ,  G01B11/24 ,  G01B11/30 ,  G01N21/21 ,  G01N21/95 ,  H01L21/66 ,  H01L21/67 ,  H01L21/683 ,  C23C16/52 ,  G01N21/88 ,  H01L21/304

公开(公告)号：AU1596899A

公开(公告)日：1999-06-15

申请号：AU1596899

申请日：1998-11-20

Applicant: SENSYS INSTR CORP ,  UNIV LELAND STANFORD JUNIOR

Inventor： STANKE FRED E ,  KHURI-YAKUB B T ,  DEGERTEKIN FAHRETTIN LEVENT ,  PHAM HUNG

IPC: G01H5/00 ,  G01N29/07 ,  G01N29/32 ,  G01N29/34

公开(公告)号：AU8719001A

公开(公告)日：2002-03-04

申请号：AU8719001

申请日：2001-08-17

Applicant: SENSYS INSTR CORP

Inventor： NORTON ADAM E ,  JOHNSON KENNETH C ,  STANKE FRED E

IPC: G01J3/02 ,  G01J3/28 ,  G01N21/27 ,  G01N21/31 ,  G01N21/47 ,  G01N21/956 ,  G02B5/30 ,  G02B21/36 ,  G02B27/28

Abstract: A small-spot imaging, spectrometry instrument for measuring properties of a sample has a polarization-scrambling element, such as a Lyot depolarizer, incorporated between the polarization-introducing components of the system, such as the beamsplitter, and the microscope objective of the system. The Lyot depolarizer varies polarization with wavelength. Sinusoidal perturbation in the resulting measured spectrum can be removed by data processing techniques or, if the depolarizer is thick or highly birefringent, may be narrower than the wavelength resolution of the instrument.

公开(公告)号：AU9500001A

公开(公告)日：2002-02-25

申请号：AU9500001

申请日：2001-08-07

Applicant: SENSYS INSTR CORP

Inventor： STANKE FRED E

IPC: G01N21/31 ,  G01N21/94 ,  G01N21/95 ,  G01N21/88

Abstract: An apparatus for and method of determining the states on a wafer to be processed, e.g., whether residue in the form of metal is left on the surface of a wafer after chemical-mechanical polishing. The method comprises the steps of calculating first spectral signatures from a first set of measurement sites on one or more training wafers. Each measurement site is known to be in one of two or more states. In the case of only two states, the states could be "residue present" and "residue absent" states. The next step involves correlating the first spectral signatures to the states on the training wafer(s). The next step then involves calculating second spectral signatures from a second set of measurement sites on a wafer where the states are unknown. The final step is determining the states on the wafer to be processed based on the second spectral signatures.

公开(公告)号：AU8124301A

公开(公告)日：2002-02-25

申请号：AU8124301

申请日：2001-08-10

Applicant: SENSYS INSTR CORP

Inventor： WEBER-GRABAU MICHAEL ,  TONG EDRIC H ,  NORTON ADAM E ,  STANKE FRED E ,  CAHILL JAMES M JR ,  RUTH DOUGLAS E ,  JOHNSON KENNETH C

IPC: H01L21/66 ,  G01N21/956 ,  G03F7/20 ,  H01L21/02 ,  H01L21/027 ,  H01L21/00

Abstract: A wafer measurement station integrated within a process tool has a scatterometry instrument for measuring patterned features on wafers. A wafer handler feeds wafers between a cassette and one or more process stations of the process tool. Wafers presented to the measurement station are held on a wafer support, which may be moveable, and a scatterometry instrument has an optical measurement system that is moveable by a stage over the wafer support. A window isolates the moveable optics from the wafer. The optical measurement system are microscope-based optics forming a low NA system. The illumination spot size at the wafer is larger than a periodicity of the patterned features, and data processing uses a scattering model to analyze the optical signature of the collected light.