DEVICE AND METHOD FOR OPTICAL INSPECTION OF SEMICONDUCTOR WAFER
    1.
    发明申请
    DEVICE AND METHOD FOR OPTICAL INSPECTION OF SEMICONDUCTOR WAFER 审中-公开
    用于光电检测半导体波形的器件和方法

    公开(公告)号:WO0215238A3

    公开(公告)日:2002-10-03

    申请号:PCT/US0125196

    申请日:2001-08-10

    CPC classification number: G03F7/70625 G01N21/956

    Abstract: A wafer measurement station (19) integrated within a process tool (11) has a scatterometry instrument (35) for measuring patterned features on wafers (31). A wafer handler (17) feeds wafers between a cassette (15) and one or more process stations (13) of the process tool. Wafers presented to the measurement station are held on a wafer support (33), which may be moveable, and a scatterometry instrument has an optical measurement system (41) that is moveable by a stage (39) over the wafer support. A window (37) isolates the moveable optics from the wafer. The optical measurement system are microscope-based optics forming a low NA system. The illumination spot size at the wafer is larger than a periodicity of the patterned features, and data processing uses a scattering model to analyze the optical signature of the collected light.

    Abstract translation: 集成在处理工具(11)内的晶片测量站(19)具有用于测量晶片(31)上的图案特征的散射仪(35)。 晶片处理器(17)在处理工具的盒(15)和一个或多个处理站(13)之间馈送晶片。 提供给测量站的晶片保持在可以是可移动的晶片支撑件(33)上,并且散射仪器具有可由晶片支撑件上的台(39)移动的光学测量系统(41)。 窗口(37)将可移动光学器件与晶片隔离。 光学测量系统是形成低NA系统的基于显微镜的光学器件。 晶片上的照明光点尺寸大于图案化特征的周期,数据处理使用散射模型来分析所收集的光的光学特征。

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