Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser capable of effectively inhibiting the influence of return light. SOLUTION: Notches 51 are formed at a pair of corners on the main light emitting side end surface 11 of a protrude 50. Light emission does not occur at regions near transverse boundaries 31B, 31C of a light emission region 31, thus making it possible to inhibit the influence of the return light, even if it may enter or intrude the region. In another embodiment on the main light emitting side end surface, a reflection coefficient of a laser beam at a region near the transverse center of the light emitting region is caused to be higher those that at the regions near the transverse boundaries. Alternately, two groove like recesses are formed on the surface of a second conductivity type semiconductor layer in the same direction, and the two groove-shaped recesses near the main light emitting side end surface may have larger widths than those of groove-shaped recesses at an intermediate position between the main light emitting side end surface and an opposite side end surface. Additionally, the light emitting region near the transverse boundaries may have an inclined plane in the main light emitting side end surface, or an impurity added region may be formed on the main light emitting side end surface so that it covers corners of the main light emitting side end surface of the protruding part. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve a crystal property and electrical conductivity and also uniform the composition ratio and the p-type impurity concentration in a growth surface of a crystal. SOLUTION: First layers 11 of about 1 to 100 nm in thickness formed of AlGaN mixed crystal each and second layers 12 of about 1 to 100 nm in thickness formed of Mg doped p-type GaN each are stacked alternately to stack a plurality of layers. The first layers 11 and the second layers 12 that have aluminum contents and p-type impurity concentrations different from each other are formed in separate processes to enable fabricating a satisfactory p-type group III nitride compound semiconductor that has a property of p-type AlGaN mixed crystal as a whole. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser device where both NFP and FFP have a uniform distribution of light intensity. SOLUTION: The semiconductor laser device 40 has the same layered structure as a conventional broad area-type semiconductor laser device has except that regions 44 located at the sides of a light emitting region 42 of an AlGaAs active layer 18 and a p-AlGaAs clad layer 20 are two-dimensionally photonic-crystallized. A two-dimensional photonic crystal structure provided in the regions 44 located at both the sides of the light emitting region 42 has the property of hardly transmitting laser rays having a wavelength of 780 μm in the region 44 in a direction parallel with a stripe-like ridge (lengthwise direction of a resonator). Laser rays traveling in the lengthwise direction of a resonator are present only in the light emitting region 42 sandwiched between the two photonic crystal regions 44, so that laser rays are trapped in a lateral direction by the photonic crystal regions 44. The laser rays are trapped by the regions 44, whereby an optical loss occurring at both the edges of the stripe serving as a light trapping interface can be restrained, a wavefront is less curved, and both NFP and FFP have a uniform distribution of light intensity. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a nitride-based semiconductor light emitting device high in In composition and also high in light emitting efficiency. SOLUTION: The laser device 50 has a laminated structure wherein a GaN-ELO (epitaxial lateral overgrowth) structure layer 54 is built on a sapphire substrate 52 and, thereon, an n-GaN contact layer 56, n-InGaN/GaN superlattice layer 58, n-Al 0.07 Ga 0.93 N cladding layer 60, n-GaN optical guide layer 62, InGaN/InGaN-MQW active layer 64, p-GaN optical guide layer 66, p-Al 0.07 Ga 0.93 N cladding layer 68, and then a p-GaN contact layer 70 are laminated. The superlattice layer is a laminated superlattice layer wherein an n-In 0.05 Ga 0.95 N/n-GaN superlattice layer is grown for ten cycles, and its lattice constant is higher than that of the n-GaN contact layer below the superlattice layer but is less than that of the MQW active layer. The superlattice layer functions as a lattice relaxation layer for the n-Al 0.07 Ga 0.93 N cladding layer and for the n-GaN optical guide layer, and suppresses the occurrence of strain in the active layer. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for growing a mono-crystal nitride system group III-V compound semiconductor with low crystal failure density and high quality, and a semiconductor device manufactured by a growth method and a method for manufacturing the semiconductor device. SOLUTION: At the time of forming a growth mask on a substrate, and selectively growing a nitride system group III-V compound semiconductor on the substrate by using the growth mask, a stripe-shaped multi-layer film at least whose mostsurface is made of nitride, and whose width is 4.8 μm or less is used as the growth mask. The growth mask may be constituted of an oxide film and a nitride film on the oxide film, constituted of a metal film and a nitride film on the metal film, constituted of an oxide film and a film made of nitride and an oxide on the oxide film and a nitride film on the film, and constituted of a first metal film and a second metal film on the first metal film and the nitride film on the second metal film. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To realize a method for growing a III-V nitride compound semiconductor having high crystallinity by increasing nitrogen materials contributing to growth. SOLUTION: A material gas, including ammonia gas being the material of nitrogen and carrier gas, is supplied inside of a reaction tube 3. The flow of the material gas inside the reaction tube 3 is set in a direction, parallel to the growth surface of a substrate 14, and the velocity of flow of the material gas inside the reaction tube 3 is set at 2 m/s or less. Thus, ammonia can be fully heated by the delay amount of the velocity of flow, and decomposing efficiency can be improved, and the supply of the nitrogen material to the growth surface of the substrate 14 can be increased, and the evaporation of nitrogen from the III-V nitride compound semiconductor during growth can be suppressed. Also, it is desirable that the inside the reaction tube 3 be pressurized.
Abstract:
PROBLEM TO BE SOLVED: To enhance planarity of the edge of a resonator while facilitating fabrication. SOLUTION: An underlying layer 3 of GaN is formed on a sapphire substrate 1 through a buffer layer 2 before growing a coating layer 5 of GaN through a mask layer 4 having an opening 4a extended in the direction of the underlying layer 3. An n-type clad layer 7 of III nitride compound conductor, an active layer 9, and a p-type clad layer 11 are formed thereon. Direction B of a resonator is set in the direction of the underlying layer 3 and differentiated by 90 deg. from the extending direction A of mask opening and a pair of resonator edges 16, 17 are formed in the direction B of the resonator. Consequently, an emission region is not required to be aligned with the mask layer 4. Furthermore, planarity can be enhanced easily because the resonator edges 16, 17 located in the direction B of the resonator can be formed by cleavage.
Abstract:
PROBLEM TO BE SOLVED: To enhance the emission efficiency, improve the essential emission strength of a light-emitting layer and enable the emission by the carrier injection by limiting the thickness of this emitting layer to a specified range. SOLUTION: A semiconductor light-emitting element has a light-emitting layer set to 1.5-0.3nm thick. A first buffer layer 2 of 30nm thick is grown at low temp. on a substrate 1, a second buffer layer 3 is grown to 2μm thick, a first clad layer 4 composed of a light absorptive layer to be a first lower clad layer 4A of 0.1μm thick and upper clad layer 4B of 10nm thick is epitaxially grown on the buffer layer 3, an active layer 5 of 1nm thick and second clad layer 14 of 0.1μm thick are epitaxially grown. Thus it is possible to form a carrier injection type light-emitting element and short-wavelength light-emitting element for ultraviolet regions.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor laser whose NFP can be rendered a stable and uniform shape. SOLUTION: A zonal ridge portion 24 is provided in the upper part of a semiconductor layer 20, and zonal protrusions 22A, extending in the extending direction of the ridge portion 24, are provided in the region corresponding to the ridge portion 24 in the semiconductor layer 20. As a result, since light emitted from an active layer 24 is guided by waveguide mechanisms, corresponding to refractive index distributions formed by the ridge portion 24 and the protrusions 22A, the interaction of both waveguide mechanisms of the ridge portion 24 and the protrusions 22A can stabilize lateral mode and suppress filament emission. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To achieve a laminated structure for room-temperature continuous oscillation of a Be-containing group II-VI semiconductor laser without deterioration of crystal, using an InP substrate. SOLUTION: The basic structure of a semiconductor laser is composed by using a lattice-matched group II-VI semiconductor containing Be on the InP substrate. In order to enhance carrier injection efficiency into an active layer, the laminated structure is composed as follows: the active layer and a clad layer are composed by a double-hetero structure having an I-type band lineup. The active layer and the clad layer that strengthen light trapping into the active layer are composed. The composition ratio of a p-type clad layer is set to Mg