公开(公告)号：DE60034863D1

公开(公告)日：2007-06-28

申请号：DE60034863

申请日：2000-12-22

Applicant: ST MICROELECTRONICS SA

Inventor： COLLARD EMMANUEL ,  LHORTE ANDRE

IPC: H01L29/872 ,  H01L21/329 ,  H01L29/24

公开(公告)号：FR2849533A1

公开(公告)日：2004-07-02

申请号：FR0216804

申请日：2002-12-27

Applicant: ST MICROELECTRONICS SA

Inventor： DOSSEUL FRANCK ,  COLLARD EMMANUEL

IPC: H01L21/60 ,  H01L23/495 ,  H01L25/07 ,  H01L23/488

Abstract: Assembly on a support. of at least one first semiconductor chip (1) containing a vertical component, support surface, comprises: providing zones to receive conductor bosses on the support surface; providing on a surface of the semiconductor chip to be connected to the support, the conductor bosses distributed vertically over some receiving zones; and soldering the conductor bosses. All the bosses are connected electrically in parallel on both the semiconductor chip and support surfaces. Independent claims are also included for the following: (a) power circuit made up of two diodes in series; (b) circuit filling the function of two diodes with a common anode; (c) circuit providing a control diode and a MOST.

公开(公告)号：FR2814856B1

公开(公告)日：2003-07-11

申请号：FR0012601

申请日：2000-10-03

Applicant: ST MICROELECTRONICS SA

Inventor： COLLARD EMMANUEL ,  DEFIVES DOMINIQUE ,  NOBLANC OLIVIER

IPC: H01L21/04 ,  H01L21/329 ,  H01L29/45 ,  H01L29/872