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    CAPACITIVE POSITION SENSING IN AN ELECTROSTATIC MICROMOTOR
    11.
    发明公开
    CAPACITIVE POSITION SENSING IN AN ELECTROSTATIC MICROMOTOR 审中-公开
    电容SYSTEM FOR位置GIVE静电微电机

    公开(公告)号：EP2132868A1

    公开(公告)日：2009-12-16

    申请号：EP07736756.3

    申请日：2007-04-03

    Applicant: STMicroelectronics S.r.l.

    Inventor： MURARI, Bruno ,  MASTROMATTEO, Ubaldo ,  RICOTTI, Giulio

    IPC: H02N1/00

    CPC classification number: H02N1/006

    Abstract: An electrostatic micromotor (10') is provided with a fixed substrate (12), a mobile substrate (13) facing the fixed substrate (12), and electrostatic-interaction elements (14, 15, 17) enabling a relative movement of the mobile substrate (3) with respect to the fixed substrate (2) in a movement direction (x); the electrostatic micromotor is also provided with a capacitive position-sensing structure (18') configured to enable sensing of a relative position of the mobile substrate (13) with respect to the fixed substrate (12) in the movement direction (x). The capacitive position-sensing structure (18') is formed by at least one sensing indentation (22), extending within the mobile substrate (13) from a first surface (13a; 13b) thereof, and by at least one first sensing electrode (24), facing, in at least one given operating condition, the sensing indentation (22).

    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE
    15.
    发明公开
    INTEGRATED ELECTRONIC DEVICE FOR MONITORING PARAMETERS WITHIN A SOLID STRUCTURE AND MONITORING SYSTEM USING SUCH A DEVICE 有权
    用于监测PARAMENETERN集成电子设备以坚固的结构和监控系统使用这种VORRICHUNG

    公开(公告)号：EP2656057A1

    公开(公告)日：2013-10-30

    申请号：EP11771170.5

    申请日：2011-10-20

    Applicant: STMicroelectronics S.r.l.

    Inventor： PAGANI, Alberto ,  MURARI, Bruno

    IPC: G01N27/20 ,  G01N33/38 ,  G01L1/18

    CPC classification number: G01N27/00 ,  G01L1/26 ,  G01M5/0083

    Abstract: Device (100) for detecting and monitoring local parameters within a solid structure (300). The device comprises an integrated detection module (1) made on a single chip, having an integrated functional circuitry portion (16) comprising at least one integrated sensor (10) and an integrated antenna (11), and electromagnetic means (2) for transmitting/receiving signals and energy exchange. The integrated functional circuitry portion (16) comprises a functional surface (18) facing towards the outside of the chip. A passivation layer (15) is arranged to completely cover at least the functional surface (18), so that the integrated detection module (1) is entirely hermetically sealed and galvanically insulated from the surrounding environment. The integrated antenna (11), the electromagnetic means (2) and the remote antenna (221) are operatively connected wirelessly through magnetic or electromagnetic coupling.

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