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公开(公告)号：US20210363000A1
公开(公告)日：2021-11-25
申请号：US17320993
申请日：2021-05-14
Applicant: STMicroelectronics S.r.l.
Inventor： Giorgio ALLEGATO , Lorenzo CORSO , Ilaria GELMI , Carlo VALZASINA
Abstract: A process for manufacturing a MEMS device includes forming a first structural layer of a first thickness on a substrate. First trenches are formed through the first structural layer, and masking regions separated by first openings are formed on the first structural layer. A second structural layer of a second thickness is formed on the first structural layer in direct contact with the first structural layer at the first openings and forms, together with the first structural layer, thick structural regions having a third thickness equal to the sum of the first and the second thicknesses. A plurality of second trenches are formed through the second structural layer, over the masking regions, and third trenches are formed through the first and the second structural layers by removing selective portions of the thick structural regions.
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公开(公告)号：US20210190814A1
公开(公告)日：2021-06-24
申请号：US17122793
申请日：2020-12-15
Applicant: STMicroelectronics S.r.l.
Inventor： Jean Marie DARMANIN , Carlo VALZASINA , Alessandro TOCCHIO , Gabriele GATTERE
IPC: G01P15/125
Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.
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13.发明申请公开(公告)号：US20210095949A1
公开(公告)日：2021-04-01
申请号：US17025977
申请日：2020-09-18
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Gabriele GATTERE , Carlo VALZASINA , Enri DUQI
Abstract: A button device includes a MEMS sensor having a MEMS strain detection structure and a deformable substrate configured to undergo deformation under the action of an external force. The MEMS strain detection structure includes a mobile element carried by the deformable substrate via at least a first and a second anchorage, the latter fixed with respect to the deformable substrate and configured to displace and generate a deformation force on the mobile element in the presence of the external force; and stator elements capacitively coupled to the mobile element. The deformation of the mobile element causes a capacitance variation between the mobile element and the stator elements. Furthermore, the MEMS sensor is configured to generate detection signals correlated to the capacitance variation.
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公开(公告)号：US20230296643A1
公开(公告)日：2023-09-21
申请号：US18322488
申请日：2023-05-23
Applicant: STMicroelectronics S.r.l.
Inventor： Jean Marie DARMANIN , Carlo VALZASINA , Alessandro TOCCHIO , Gabriele GATTERE
IPC: G01P15/125
CPC classification number: G01P15/125
Abstract: A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.
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公开(公告)号：US20220033254A1
公开(公告)日：2022-02-03
申请号：US17385555
申请日：2021-07-26
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele GATTERE , Patrick FEDELI , Carlo VALZASINA
Abstract: A MEMS accelerometer includes a supporting structure, at least one deformable group and one second deformable group, which include, respectively, a first deformable cantilever element and a second deformable cantilever element, which each have a respective first end, which is fixed to the supporting structure, and a respective second end. The first and second deformable groups further include, respectively, a first piezoelectric detection structure and a second piezoelectric detection structure. The MEMS accelerometer further includes: a first mobile mass and a second mobile mass, which are fixed, respectively, to the second ends of the first and second deformable cantilever elements and are vertically staggered with respect to the first and second deformable cantilever elements, respectively; and a first elastic structure, which elastically couples the first and second mobile masses.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20170339494A1
公开(公告)日：2017-11-23
申请号：US15365590
申请日：2016-11-30
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Matteo PERLETTI , Igor VARISCO , Luca LAMAGNA , Silvia ADORNO , Gabriele GATTERE , Carlo VALZASINA , Sebastiano CONTI
CPC classification number: H04R19/005 , B81B3/0021 , B81B2201/0257 , B81B2203/0127 , B81B2203/0136 , B81B2203/0315 , B81B2203/04 , B81B2203/053 , B81C1/00158 , B81C2201/0109 , B81C2201/0111 , B81C2201/0133 , G01H11/06 , H04R31/00 , H04R2201/003 , H04R2201/023
Abstract: A MEMS acoustic transducer provided with: a substrate of semiconductor material, having a back surface and a front surface opposite with respect to a vertical direction; a first cavity formed within the substrate, which extends from the back surface to the front surface; a membrane which is arranged at the upper surface, suspended above the first cavity and anchored along a perimeter thereof to the substrate; and a combfingered electrode arrangement including a number of mobile electrodes coupled to the membrane and a number of fixed electrodes coupled to the substrate and facing respective mobile electrodes for forming a sensing capacitor, wherein a deformation of the membrane as a result of incident acoustic pressure waves causes a capacitive variation of the sensing capacitor. In particular, the combfingered electrode arrangement lies vertically with respect to the membrane and extends parallel thereto.
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17.发明申请公开(公告)号：US20170108337A1
公开(公告)日：2017-04-20
申请号：US14964347
申请日：2015-12-09
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Daniele PRATI , Carlo VALZASINA , Luca Giuseppe FALORNI , Matteo Fabio BRUNETTO
IPC: G01C19/5733
CPC classification number: G01C19/5733 , G01C19/5747 , G01C19/5762
Abstract: A microelectromechanical gyroscope includes: a substrate; a stator sensing structure fixed to the substrate; a first mass elastically constrained to the substrate and movable with respect to the substrate in a first direction; a second mass elastically constrained to the first mass and movable with respect to the first mass in a second direction; and a third mass elastically constrained to the second mass and to the substrate and capacitively coupled to the stator sensing structure, the third mass being movable with respect to the substrate in the second direction and with respect to the second mass in the first direction.
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18.发明申请公开(公告)号：US20160145096A1
公开(公告)日：2016-05-26
申请号：US14971639
申请日：2015-12-16
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Giorgio ALLEGATO , Barbara SIMONI , Carlo VALZASINA , Lorenzo CORSO
CPC classification number: B81B7/0074 , B81B7/007 , B81B7/008 , B81B7/02 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81B2207/015 , B81B2207/07 , B81B2207/092 , B81B2207/093 , B81B2207/096 , B81B2207/097 , B81C1/0023 , B81C2203/0118 , B81C2203/0792 , H01L2924/0002 , H01L2924/00
Abstract: A microelectromechanical device includes: a body accommodating a microelectromechanical structure; and a cap bonded to the body and electrically coupled to the microelectromechanical structure through conductive bonding regions. The cap including a selection module, which has first selection terminals coupled to the microelectromechanical structure, second selection terminals, and at least one control terminal, and which can be controlled through the control terminal to couple the second selection terminals to respective first selection terminals according, selectively, to one of a plurality of coupling configurations corresponding to respective operating conditions.
Abstract translation: 微机电装置包括：容纳微机电结构的主体; 以及盖，其结合到主体并通过导电接合区域电耦合到微机电结构。 盖包括选择模块，其具有耦合到微机电结构的第一选择端子，第二选择端子和至少一个控制端子，并且可以通过控制端子控制以将第二选择端子耦合到相应的第一选择端子， 选择性地，对应于相应的操作条件的多个耦合配置之一。
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公开(公告)号：US20230028797A1
公开(公告)日：2023-01-26
申请号：US17866378
申请日：2022-07-15
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele GATTERE , Jean Marie DARMANIN , Francesco RIZZINI , Carlo VALZASINA
IPC: G01P15/125 , G01P1/00
Abstract: A closed-loop microelectromechanical accelerometer includes a substrate of semiconductor material, an out-of-plane sensing mass and feedback electrodes. The out-of-plane sensing mass, of semiconductor material, has a first side facing the supporting body and a second side opposite to the first side. The out-of-plane sensing mass is also connected to the supporting body to oscillate around a non-barycentric fulcrum axis parallel to the first side and to the second side and perpendicular to an out-of-plane sensing axis. The feedback electrodes are capacitively coupled to the sensing mass and are configured to apply opposite electrostatic forces to the sensing mass.
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公开(公告)号：US20220301789A1
公开(公告)日：2022-09-22
申请号：US17690869
申请日：2022-03-09
Applicant: STMICROELECTRONICS S.r.l.
Inventor： Enri DUQI , Gabriele GATTERE , Carlo VALZASINA
IPC: H01H13/14 , G01L1/16 , H01H13/06 , H01L41/113 , B81B3/00
Abstract: Button device comprising: a fixed support structure; a movable structure, laterally surrounded by said support structure and configured to deform at least in part under the action of an external force; and a fluid-tight protection cap. The movable structure includes a piston element, deformable elements having piezoelectric transducers arranged thereon, and anchor elements that couple the piston element to the deformable elements. When an external force acts on the piston element, the anchor elements transfer this force to the deformable elements and to the piezoelectric transducers, so as to sense the extent of this force.
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