Abstract:
A method for testing virgin memory cells in a multilevel memory device which comprises a plurality of memory cells, the particularity of which consists of the fact that it comprises the steps of: reading the individual memory cells that constitute a memory device and comparing each one of these memory cells with at least one reference memory cell at a time, so as to determine whether the threshold of the memory cells is lower than the threshold of the at least one reference memory cell or not; determining the number of the memory cells whose threshold is higher than the threshold of the at least one reference cell; the at least one reference memory cell being chosen with a gradually higher threshold; when the number of memory cells whose threshold is higher than a given reference threshold is found to be sufficiently lower than the number of redundancy memory cells provided in the memory device, assuming the given reference threshold as lower reference threshold for the memory device, determining a statistical distribution of the thresholds of the memory cells.
Abstract:
A method for testing virgin memory cells in a multilevel memory device which comprises a plurality of memory cells, the particularity of which consists of the fact that it comprises the steps of:
reading the individual memory cells that constitute a memory device and comparing each one of these memory cells with at least one reference memory cell at a time, so as to determine whether the threshold of the memory cells is lower than the threshold of the at least one reference memory cell or not; determining the number of the memory cells whose threshold is higher than the threshold of the at least one reference cell; the at least one reference memory cell being chosen with a gradually higher threshold; when the number of memory cells whose threshold is higher than a given reference threshold is found to be sufficiently lower than the number of redundancy memory cells provided in the memory device, assuming the given reference threshold as lower reference threshold for the memory device, determining a statistical distribution of the thresholds of the memory cells.
Abstract:
The invention relates to a compensated voltage regulator (1) useful with programming circuitry for electrically programmable non-volatile memory cells in a cell matrix (3) which is divided in sectors (7), the regulator being of a type which includes a comparator (2) connected between first (Vpp) and second (GND) supply voltage references, and having:
a first input terminal (+) which is supplied by a reference voltage (Vref); an output terminal (U) connected to the control terminal of an output MOS transistor (Mcasc) having a conduction terminal through which an output current (Iout) is passed and being connected to the memory cells by a program line (10); a second input terminal (-), feedback connected to said program line (10).
A compensation block (20) is provided which is powered from said first voltage reference (Vpp) and has an input connected to both said output terminal (U) and said output transistor (Mcasc), and has an output connected to said output terminal (U) to duplicate a current (Iout*α) which is suitably attenuated with respect to the output current (Iout) and useful to modify the output voltage (Vg) of the comparator (2) included in the regulator.
Abstract:
The invention relates to a circuit structure (1) for programming data in reference cells (3) of an electrically programmable/erasable integrated non-volatile memory device, comprising a matrix of multi-level memory cells and at least one corresponding reference cell provided for comparison with a respective memory cell during the read phase. The reference cell (3) is incorporated, along with other cells of the same type, to a reference cell sub-matrix (4) which is structurally independent of the memory cell matrix and directly accessed from outside in the DMA mode. The bit lines of the sub-matrix (4) branch off to a series of switches (9) which are individually operated by respective control signals REF(i) issued from a logic circuit (8) with the purpose of selectively connecting the bit lines to a single external I/O terminal (10) through a single addressing line (11) of the access DMA mode.
Abstract:
The integrated device (100) comprises a PMOS transistor (101) and a voltage selector (1) having an output (6g) connected to the bulk terminal (101d) of the PMOS transistor (101). The voltage selector (1) comprises an input stage (2) supplying (2c) a supply voltage (Vdd) or a programming voltage (Vpp) according to whether the device (100) is in a reading step or in a programming step; a comparator (3) connected to the output (2c) of the input stage (2), receiving a boosted voltage (Vboost), and generating (3g) a first control signal (OC), the state whereof depends upon the comparison of the voltages at the inputs of the comparator (3); a logic circuit (4) connected to the output (3g) of the comparator (3) and generating a second control signal (VDDIS), the state whereof depends upon the state of the first control signal (OC) and of a third-level signal (VTL); and a switching circuit (6) controlled by the first control signal (OC), by the second control signal (VDDIS), and by the third-level signal (VTL) and supplying (6g) each time the highest among the supply voltage (Vdd), the boosted voltage (Vboost), and the programming voltage (Vpp).
Abstract:
The charge pump (1) comprises a phase-generator circuit (6) generating phase signals (A, B) and comprising an oscillator circuit (12.1-12.3) supplying a clock signal (CK), a current-limitation circuit (24.1-24.3) to limit the current flowing in the oscillator circuit, and a control circuit (26') supplying on an output (32a) a control signal (V REF ) supplied to the current-limitation circuit. The control circuit (26') comprises a first current mirror (60) connected to a ground line (22), a second current mirror (62) connected to a supply line (20), a cascode structure (64), arranged between the first and the second current mirrors (60, 62) and connected to the output (32a) of the control circuit (26') to compensate the effects on the control signal (V REF ) caused by sharp relative variations between the potential (V DD ) of the supply line and the potential (V GND ) of the ground line, and a compensation circuit (70) to compensate the effects on the control signal (V REF ) caused by sharp relative variations between the potential (V DD ) of the supply line and the potential (V GND ) of the ground line and by slow variations in temperature.