公开(公告)号：EP3151271A1

公开(公告)日：2017-04-05

申请号：EP16161856.6

申请日：2016-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： TOCCHIO, Alessandro ,  VALZASINA, Carlo ,  GUERINONI, Luca ,  ALLEGATO, Giorgio

IPC: H01L23/13 ,  B81B7/00 ,  B81C1/00 ,  G01L19/14 ,  H01L21/56

CPC classification number: B81B7/0048 ,  B81C1/00325 ,  H01L23/055 ,  H01L23/13 ,  H01L23/16 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16195 ,  H01L2924/16251 ,  H01L2924/3511 ,  H01L2924/00012

Abstract: An encapsulated device of semiconductor material wherein a chip (56) of semiconductor material is fixed to a base element (52) of a packaging body (51) through at least one pillar element (60) having elasticity and deformability greater than the chip, for example a Young's modulus lower than 300 MPa. In one example, four pillar elements (60) are fixed in proximity of the corners of a fixing surface (56A) of the chip and operate as uncoupling structure, which prevents transfer of stresses and deformations of the base element to the chip.

Abstract translation: 半导体材料的worin半导体材料的芯片（56）封装的器件是通过具有弹性的和可变形大于所述芯片，用于至少一个支柱元件（60）固定于包装体（51）的基部元件（52） 实施例的杨氏模量低于300兆帕。 在一个例子中，四个支柱元件（60）被固定在所述芯片的一个固定表面（56A）的角部的接近和作为解偶联结构，这防止应力和底座元件的芯片的变形的转移操作。

公开(公告)号：EP4123313A1

公开(公告)日：2023-01-25

申请号：EP22183947.5

申请日：2022-07-08

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  DARMANIN, Jean Marie ,  RIZZINI, Francesco ,  VALZASINA, Carlo

IPC: G01P15/08 ,  B81B5/00 ,  G01P15/125 ,  G01P15/13

Abstract: A closed-loop microelectromechanical accelerometer includes a substrate (23) of semiconductor material, an out-of-plane sensing mass (13) and feedback electrodes (17a-17d). The out-of-plane sensing mass (13), of semiconductor material, has a first side (13a) facing the supporting body (11) and a second side (13b) opposite to the first side (13a). The out-of-plane sensing mass (13) is also connected to the supporting body (11) to oscillate around a non-barycentric fulcrum axis (F) parallel to the first side (13a) and to the second side (13b) and perpendicular to an out-of-plane sensing axis (Z). The feedback electrodes (17a-17d) are capacitively coupled to the sensing mass (13) and are configured to apply opposite electrostatic forces (F FB1 , F FB2 ) to the sensing mass (13).

公开(公告)号：EP3657676A1

公开(公告)日：2020-05-27

申请号：EP19211628.3

申请日：2019-11-26

Applicant: STMicroelectronics S.r.l.

Inventor： MUSSI, Giorgio ,  LANGFELDER, Giacomo ,  VALZASINA, Carlo ,  GATTERE, Gabriele

IPC: H03K5/13 ,  H03K5/156

Abstract: A clock generator (30) having a variable-modulus frequency divider (34), receiving a high-frequency clock signal (HFCK) and outputting a divided clock signal (DIV) having a frequency controlled by a modulus-control signal (MC) generated by a temperature-compensation circuit (36). A jitter filter (35) is coupled to the output of the variable-modulus frequency divider (34) and to the temperature-compensation circuit (36) and generates a compensated clock signal (OUT) having switching edges that are delayed, with respect to the divided clock signal (DIV), by a time correlated to a quantization-error signal.

公开(公告)号：EP3301398B1

公开(公告)日：2019-10-16

申请号：EP17162662.5

申请日：2017-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  TOCCHIO, Alessandro ,  VALZASINA, Carlo

IPC: G01C19/5726 ,  G01C19/574 ,  G01C19/5755

公开(公告)号：EP3187825A1

公开(公告)日：2017-07-05

申请号：EP16199423.1

申请日：2016-11-17

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics, Inc. ,  STMicroelectronics International N.V.

Inventor： VALZASINA, Carlo ,  HUANTONG, Zhang ,  BRUNETTO, Matteo Fabio ,  ANDERSSON, Gert Ingvar ,  SVENSSON, Erik Daniel ,  HEDENSTIERNA, Nils Einar

IPC: G01C19/574

Abstract: A gyroscope includes: a substrate (2); a first structure (11), a second structure (12) and a third structure (10) elastically coupled to the substrate (2) and movable along a first axis (X), the first and second structure (11; 12) being arranged at opposite sides of the third structure (10) with respect to the first axis (X); a driving system (4, 16a, 16b, 20a, 20b), configured to oscillate the first and second structure (11, 12) along the first axis (X) in phase with one another and in phase opposition with the third structure (10); the first, second and third structure (11, 12, 10) being provided with respective sets of sensing electrodes (17a, 21a), configured to be displaced along a second axis (Y) perpendicular to the first axis (X) in response to rotations of the substrate (2) about a third axis (Z) perpendicular to the first axis (X) and to the second axis (Y).

Abstract translation: 陀螺仪包括：衬底（2）; 第一结构（11），第二结构（12）和第三结构（10），所述第一结构（11），所述第二结构（12）和第三结构（10）弹性地联接到所述基板（2）并且能够沿着第一轴线 在第三结构（10）的相对于第一轴线（X）的相对侧处; 驱动系统（4,16a，16b，20a，20b），所述驱动系统被配置为使所述第一结构（11）和所述第二结构（12）沿着所述第一轴线（X）彼此相位地振荡并且与所述第三结构（10 ）; 所述第一，第二和第三结构（11,12,10）设置有相应的感测电极组（17a，21a），所述感测电极组被配置为响应于所述感测电极沿着垂直于所述第一轴（X）的第二轴（Y） 围绕垂直于第一轴线（X）和第二轴线（Y）的第三轴线（Z）旋转衬底（2）。

公开(公告)号：EP3086089A1

公开(公告)日：2016-10-26

申请号：EP15200480.0

申请日：2015-12-16

Applicant: STMicroelectronics S.r.l.

Inventor： PRATI, Daniele ,  VALZASINA, Carlo ,  FALORNI, Luca Giuseppe ,  BRUNETTO, Matteo Fabio

IPC: G01C19/5747 ,  G01C19/5762

CPC classification number: G01C19/5733 ,  G01C19/5747 ,  G01C19/5762

Abstract: A microelectromechanical gyroscope includes: a substrate (2); a stator sensing structure (16b) fixed to the substrate (2); a first mass (7) elastically constrained to the substrate (2) and movable with respect to the substrate (2) in a first direction (D1); a second mass (8) elastically constrained to the first mass (7) and movable with respect to the first mass (7) in a second direction (D2); and a third mass (10) elastically constrained to the second mass (8) and to the substrate (2) and capacitively coupled to the stator sensing structure (16b), the third mass (10) being movable with respect to the substrate (2) in the second direction (D2) and with respect to the second mass (8) in the first direction (D1).

Abstract translation: 一种微机电陀螺仪，包括：衬底（2）; 定子感测结构（16B）固定在基板（2）; 第一质量（7）弹性地约束于基板（2）和可相对于第一方向（D1）的基板（2）; 第二质量（8）在第二方向（D2）弹性地约束到所述第一质量块（7）和可相对于所述第一质量块（7）; 和第三质量块（10）弹性地约束到所述第二质量块（8）和所述基材（2）和电容耦合到可相对于基板的定子感测结构（16B），所述第三质量块（10）（2 ）（在第二方向（D2），并且相对于在所述第一方向（D1），第二质量块8）。

公开(公告)号：EP4300040A1

公开(公告)日：2024-01-03

申请号：EP23180883.3

申请日：2023-06-22

Applicant: STMicroelectronics S.r.l.

Inventor： FALORNI, Luca Giuseppe ,  FEDELI, Patrick ,  GATTERE, Gabriele ,  VALZASINA, Carlo ,  CARULLI, Paola

IPC: G01C19/5747

Abstract: MEMS gyroscope (350), having a first movable mass (303, 403) configured to move with respect to a fixed structure along a first drive direction and along a first sense direction, transverse to the first drive direction; a first drive assembly (310), coupled to the first movable mass and configured to generate a first alternate drive movement; a first drive elastic structure (320), coupled to the first movable mass and to the first drive assembly, rigid in the first drive direction and compliant in the first sense direction; a second movable mass (303, 403), configured to move with respect to the fixed structure in a second drive direction parallel to the first drive direction and in a second sense direction parallel to the first sense direction; a second drive assembly (311), coupled to the second movable mass and configured to generate a second alternate drive movement in the second drive direction; and a second drive elastic structure (320), coupled to the second movable mass and to the second drive assembly, rigid in the second drive direction and compliant in the second sense direction.

公开(公告)号：EP3945323A1

公开(公告)日：2022-02-02

申请号：EP21188923.3

申请日：2021-07-30

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  FEDELI, Patrick ,  VALZASINA, Carlo

IPC: G01P15/09 ,  B81B3/00 ,  G01P15/08

Abstract: A MEMS accelerometer including a supporting structure (2; 102) and at least one deformable group (21*, 51; 121*, 151) and one second deformable group (22*, 52; 122*, 152), which include, respectively, a first deformable cantilever element (21*; 121*) and a second deformable cantilever element (22*; 122*), which each have a respective first end, which is fixed to the supporting structure (2; 102), and a respective second end. The first and second deformable groups (21*, 51; 121*, 151) further include, respectively, a first piezoelectric detection structure (51; 151) and a second piezoelectric detection structure (52; 152). The MEMS accelerometer (1; 101) further includes: a first mobile mass (31, 131) and a second mobile mass (32, 132), which are fixed, respectively, to the second ends of the first and second deformable cantilever elements (21*, 22*; 121*, 122*) and are vertically staggered with respect to the first and second deformable cantilever elements (21*, 121*; 22*, 122*), respectively; and a first elastic structure (M1, M1'), which elastically couples the first and second mobile masses (31; 131; 32, 132).

公开(公告)号：EP3279609B1

公开(公告)日：2020-11-04

申请号：EP17162588.2

申请日：2017-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： PRATI, Daniele ,  VALZASINA, Carlo ,  CHIARILLO, Tiziano ,  FRANCO, Pasquale

IPC: G01C19/574

公开(公告)号：EP3656478A1

公开(公告)日：2020-05-27

申请号：EP19210776.1

申请日：2019-11-21

Applicant: STMicroelectronics S.r.l.

Inventor： GATTERE, Gabriele ,  VALZASINA, Carlo ,  VERCESI, Federico ,  ALLEGATO, Giorgio

IPC: B06B1/06 ,  G10K9/122 ,  H01L41/053

Abstract: An ultrasonic microintegrated MEMS acoustic transducer (30) formed in a body (32) of semiconductor material having a first and a second surfaces (32A, 32B) opposite to one another. A first cavity (34) extends in the body (32) and delimits at the bottom a sensitive portion (38), which extends between the first cavity (34) and the first surface (32A) of the body (32). The sensitive portion houses a second cavity (42) and forms a membrane (45) that extends between the second cavity (42) and the first surface (32A) of the body (32). An elastic supporting structure (40, 40A-40D) extends between the sensitive portion (38) and the body (32) and is suspended over the first cavity (34).