公开(公告)号：US11515240B2

公开(公告)日：2022-11-29

申请号：US16940815

申请日：2020-07-28

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio Fontana

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

Abstract: A lead frame for an integrated electronic device includes a die pad made of a first metallic material. A top coating layer formed by a second metallic material is arranged on a top surface of the die pad. The second metallic material has an oxidation rate lower than the first metallic material. The top coating layer leaves exposed a number of corner portions of the top surface of the die pad. A subsequent heating operation, for example occurring in connection with wirebonding, causes an oxidized layer to form on the corner portions of the top surface of the die pad at a position in contact with the top coating layer.

公开(公告)号：US11004775B2

公开(公告)日：2021-05-11

申请号：US16782797

申请日：2020-02-05

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristina Somma ,  Fulvio Vittorio Fontana

IPC: H01L23/495

Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.

公开(公告)号：US10211129B2

公开(公告)日：2019-02-19

申请号：US15797464

申请日：2017-10-30

Applicant: STMicroelectronics S.R.L.

Inventor： Fulvio Vittorio Fontana

IPC: H01L21/00 ,  H01L23/495 ,  H05K5/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/60

Abstract: A process for manufacturing surface-mount semiconductor devices, in particular of the Quad-Flat No-Leads Multi-Row type, comprising providing a metal leadframe, in particular a copper leadframe, which includes a plurality of pads, each of which is designed to receive the body of the device, the pads being separated from adjacent pads by one or more rows of wire-bonding contacting areas, outermost rows from among the one or more rows of wire-bonding contacting areas identifying, together with outermost rows corresponding to the adjacent pads, separation regions.

公开(公告)号：US09640468B2

公开(公告)日：2017-05-02

申请号：US14839408

申请日：2015-08-28

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio Fontana

IPC: H01L23/495 ,  H01L21/56 ,  H01L21/48 ,  H01L23/31

CPC classification number: H01L23/4951 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49579 ,  H01L23/49805 ,  H01L2221/68381 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81005 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012

Abstract: A surface-mount electronic device includes a body of semiconductor material, and a lead frame that includes a plurality of contact terminals. The plurality of contact terminals is electrically connected to the semiconductor body. The contact terminals are formed of sintered material.

公开(公告)号：US09428380B2

公开(公告)日：2016-08-30

申请号：US14686540

申请日：2015-04-14

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio Fontana ,  Giovanni Graziosi ,  Alex Gritti

IPC: H01L23/552 ,  B81B7/00 ,  H04R19/04 ,  H04R31/00 ,  H05K9/00 ,  H04R1/02 ,  H04R1/04 ,  H04R19/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H04R1/021 ,  H04R1/04 ,  H04R19/005 ,  H04R19/04 ,  H04R31/006 ,  H04R2201/003 ,  H04R2201/029 ,  H05K9/0009 ,  H01L2924/00014

Abstract: One or more embodiments are directed to encapsulating structure comprising: a substrate having a first surface and housing at least one conductive pad, which extends facing the first surface and is configured for being electrically coupled to a conduction terminal at a reference voltage; a cover member, set at a distance from and facing the first surface of the substrate; and housing walls, which extend between the substrate and the cover member. The substrate, the cover member, and the housing walls define a cavity, which is internal to the encapsulating structure and houses the conductive pad. Moreover present inside the cavity is at least one electrically conductive structure, which extends between, and in electrical contact with, the cover member and the conductive pad for connecting the cover member electrically to the conduction terminal.

公开(公告)号：US20140371631A1

公开(公告)日：2014-12-18

申请号：US14305728

申请日：2014-06-16

Applicant: STMicroelectronics S.r.l.

Inventor： Fulvio Vittorio Fontana

IPC: A61B7/04 ,  H04R1/46

CPC classification number: A61B7/04 ,  H04R1/46

Abstract: A mobile device for an electronic stethoscope, including: a microphone, which receive an acoustic signal coming from an area of the body during a detection period and generates an auscultation signal of an electrical type, as a function of the acoustic signal; a transmitter; a processing unit, which transmits the auscultation signal to an external electronic device, through the transmitter; and an electronic accelerometer, which generates an acceleration signal indicating acceleration of the mobile device. The processing unit generates, on the basis of the acceleration signal, a position signal, indicating the position of the mobile device during the detection period, and transmits the position signal to the external electronic device, through the transmitter.

Abstract translation: 一种用于电子听诊器的移动设备，包括：麦克风，其在检测期间接收来自身体区域的声信号，并且产生作为声信号的函数的电类型的听诊信号; 发射机 处理单元，其通过发送器将听诊信号发送到外部电子设备; 以及电子加速度计，其产生表示移动装置的加速度的加速度信号。 处理单元基于加速度信号生成表示移动装置在检测期间的位置的位置信号，并通过发送器将位置信号发送到外部电子装置。

公开(公告)号：US20140061892A1

公开(公告)日：2014-03-06

申请号：US14013730

申请日：2013-08-29

Applicant: STMicroelectronics S.r.l.

Inventor： Federico Giovanni Ziglioli ,  Fulvio Vittorio Fontana ,  Luca Maggi

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0077 ,  B81B7/0058 ,  B81B2201/0264 ,  B81C1/00333 ,  B81C2203/0118 ,  H01L2224/48091 ,  H01L2224/48145 ,  H04R1/086 ,  H04R19/04 ,  H04R2201/003 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.

Abstract translation: 一种封装器件，其中芯片的至少一个敏感部分被封装在由封装形成的腔室中。 该包装具有透气区域，具有多个孔和拒水结构，以使得能够在外部环境和室之间通过空气并阻止液体的通过。

公开(公告)号：US11842948B2

公开(公告)日：2023-12-12

申请号：US17244378

申请日：2021-04-29

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Cristina Somma ,  Fulvio Vittorio Fontana

IPC: H01L23/495

CPC classification number: H01L23/49503 ,  H01L23/49517 ,  H01L23/49575

Abstract: One or more embodiments are directed to quad flat no-lead (QFN) semiconductor packages, devices, and methods in which one or more electrical components are positioned between a die pad of a QFN leadframe and a semiconductor die. In one embodiment, a device includes a die pad, a lead that is spaced apart from the die pad, and at least one electrical component that has a first contact on the die pad and a second contact on the lead. A semiconductor die is positioned on the at least one electrical component and is spaced apart from the die pad by the at least one electrical component. The device further includes at least one conductive wire, or wire bond, that electrically couples the at least one lead to the semiconductor die.

公开(公告)号：US09824956B2

公开(公告)日：2017-11-21

申请号：US14971750

申请日：2015-12-16

Applicant: STMicroelectronics S.R.L.

Inventor： Fulvio Vittorio Fontana

IPC: H01L23/495 ,  H01L21/00 ,  H05K5/02 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31 ,  H01L21/60

CPC classification number: H01L23/49503 ,  H01L21/561 ,  H01L23/3114 ,  H01L23/4952 ,  H01L24/97 ,  H01L2021/6027 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A process for manufacturing surface-mount semiconductor devices, in particular of the Quad-Flat No-Leads Multi-Row type, comprising providing a metal leadframe, in particular a copper leadframe, which includes a plurality of pads, each of which is designed to receive the body of the device, the pads being separated from adjacent pads by one or more rows of wire-bonding contacting areas, outermost rows from among the one or more rows of wire-bonding contacting areas identifying, together with outermost rows corresponding to the adjacent pads, separation regions.

公开(公告)号：US09618532B2

公开(公告)日：2017-04-11

申请号：US15081507

申请日：2016-03-25

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Giulio Ricotti ,  Alberto Pagani ,  Fulvio Vittorio Fontana ,  Ubaldo Mastromatteo

IPC: G01P15/11 ,  G01P15/105 ,  G01P15/08 ,  B81B7/00 ,  B81C1/00 ,  G01C19/5783 ,  G01P15/097

CPC classification number: G01P15/11 ,  B81B7/008 ,  B81B2201/025 ,  B81B2207/012 ,  B81C1/0023 ,  G01C19/5783 ,  G01P15/0802 ,  G01P15/097 ,  G01P15/105 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: An inertial sensor having a body with an excitation coil and a first sensing coil extending along a first axis. A suspended mass includes a magnetic-field concentrator, in a position corresponding to the excitation coil, and configured for displacing by inertia in a plane along the first axis. A supply and sensing circuit is electrically coupled to the excitation coil and to the first sensing coil, and is configured for generating a time-variable flow of electric current that flows in the excitation coil so as to generate a magnetic field that interacts with the magnetic-field concentrator to induce a voltage/current in the sensing coil. The integrated circuit is configured for measuring a value of the voltage/current induced in the first sensing coil so as to detect a quantity associated to the displacement of the suspended mass along the first axis.