公开(公告)号：EP3240306A1

公开(公告)日：2017-11-01

申请号：EP17162651.8

申请日：2017-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： BRIOSCHI, Roberto ,  GHIDONI, Marco Omar

IPC: H04R19/00 ,  B06B1/02 ,  B81C1/00 ,  H04M1/03 ,  H04R3/00

CPC classification number: H04R19/04 ,  B06B1/0292 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0292 ,  B81B2201/047 ,  B81B2207/012 ,  B81B2207/07 ,  B81C1/0023 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/44 ,  H04R3/005 ,  H04R7/06 ,  H04R19/005 ,  H04R31/003 ,  H04R31/006 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

Abstract: A multi-device module (61), comprising: a first substrate (23), which houses a first MEMS transducer (21, 1), designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit (22, 22'), coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate (49), which houses a second MEMS transducer (41, 42), designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit (36), mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.

Abstract translation: 1。一种多装置模块（61），包括：第一基板（23），其容纳被设计成将第一环境量转换成第一电信号的第一MEMS换能器（21,1）;以及集成电路 耦合到所述第一MEMS换能器，用于接收所述第一电信号; 第二衬底（49），其容纳第二MEMS换能器（41,42），所述第二MEMS换能器设计成将第二环境量转换成第二电信号; 和柔性印刷电路（36），所述柔性印刷电路机械连接到所述第一和第二基板并且电耦合到所述集成电路和所述第二MEMS换能器，使得所述第二电信号在使用中从所述第二MEMS换能器流到所述集成电路 。

公开(公告)号：EP3206071A1

公开(公告)日：2017-08-16

申请号：EP16194664.5

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BRIOSCHI, Roberto

IPC: G02B26/08

CPC classification number: G02B26/101 ,  B81B7/008 ,  B81B2201/042 ,  B81C2203/07 ,  G02B26/0833 ,  G02B26/0841

Abstract: The mirror group (30) is formed by a monolithic frame (31) bent along a bending line (C) and including a first and a second supporting portions (32, 33) carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions (32, 33) are arranged on opposite sides of the bending line of the frame (C), angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

Abstract translation: 镜组（30）由沿着弯曲线（C）弯曲并包括第一和第二支撑部分（32,33）的整体框架（31）形成，所述第一和第二支撑部分分别承载形成两个微镜的第一和第二芯片 使用MEMS技术制造。 第一支撑部分和第二支撑部分（32,33）布置在框架（C）的弯曲线的相对侧上，相对于彼此成角度地倾斜。 镜组通过分离带有多个框架的成形金属带而获得，所述金属带具有柔性电连接元件。 在连接芯片后，框架被预切，沿弯曲线弯曲并分离。

公开(公告)号：EP3239096A3

公开(公告)日：2018-01-03

申请号：EP17162672.4

申请日：2017-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： GHIDONI, Marco Omar ,  BRIOSCHI, Roberto

IPC: B81B7/00 ,  B81C1/00 ,  H04R1/40 ,  H04R19/00

CPC classification number: B81B7/02 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer module (10), comprising: a supporting substrate (23), having a first side (23a) and a second side (23b); a cap (27), which extends over the first side of the supporting substrate and defines therewith a first chamber (108) and a second chamber (109) internally isolated from one another; a first transducer (1) in the first chamber (8); a second transducer (42) in the second chamber (18); and a control chip (22), which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

公开(公告)号：EP3239096A2

公开(公告)日：2017-11-01

申请号：EP17162672.4

申请日：2017-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： GHIDONI, Marco Omar ,  BRIOSCHI, Roberto

IPC: B81B7/00 ,  B81C1/00 ,  H04R1/40 ,  H04R19/00

CPC classification number: B81B7/02 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/07 ,  B81B2207/092 ,  B81B2207/096 ,  B81C1/0023 ,  H04R1/04 ,  H04R1/406 ,  H04R19/005 ,  H04R2201/003

Abstract: A transducer module (10), comprising: a supporting substrate (23), having a first side (23a) and a second side (23b); a cap (27), which extends over the first side of the supporting substrate and defines therewith a first chamber (108) and a second chamber (109) internally isolated from one another; a first transducer (1) in the first chamber (8); a second transducer (42) in the second chamber (18); and a control chip (22), which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.

Abstract translation: 1。一种换能器模块（10），包括：具有第一侧面（23a）和第二侧面（23b）的支撑衬底（23）; （27），其在支撑基板的第一侧上延伸并且与其一起限定彼此在内部彼此隔离的第一室（108）和第二室（109）;以及盖， 第一腔室（8）中的第一换能器（1）; 第二腔室（18）中的第二换能器（42）; 和控制芯片（22），其至少部分地在第一腔室和/或第二腔室中延伸，并功能性地耦合到第一和第二换能器，以在使用中接收由第一和第二换能器转换的信号。

公开(公告)号：EP3206071B1

公开(公告)日：2018-09-19

申请号：EP16194664.5

申请日：2016-10-19

Applicant: STMicroelectronics S.r.l.

Inventor： BRIOSCHI, Roberto

IPC: G02B26/08

CPC classification number: G02B26/101 ,  B81B7/008 ,  B81B2201/042 ,  B81C2203/07 ,  G02B26/0833 ,  G02B26/0841

Abstract: The mirror group (30) is formed by a monolithic frame (31) bent along a bending line (C) and including a first and a second supporting portions (32, 33) carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions (32, 33) are arranged on opposite sides of the bending line of the frame (C), angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.

公开(公告)号：EP2032255A1

公开(公告)日：2009-03-11

申请号：EP06780577.0

申请日：2006-06-23

Applicant: STMicroelectronics S.r.l.

Inventor： MAGNI, Pierangelo ,  BRIOSCHI, Roberto

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L2200/027 ,  B01L2200/10 ,  B01L2300/043 ,  B01L2300/0609 ,  B01L2300/0867 ,  B01L2300/123 ,  B01L2300/1805 ,  B01L2400/0481 ,  B01L2400/0622 ,  B01L2400/0638 ,  B01L2400/0644 ,  Y10T436/25 ,  Y10T436/2575

Abstract: In a microfluidic assembly (20), a microfluidic device (1') is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (1'). The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10'), adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.