公开(公告)号：JP2001294843A

公开(公告)日：2001-10-23

申请号：JP2000111640

申请日：2000-04-13

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  OSAWA YOKO ,  SHINOHARA HIDEKI

IPC: C09J7/02 ,  C09J133/06 ,  C09J161/06 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To industrially produce a new adhesive composition for semiconductor apparatus having excellent processability, bond strength, wire bonding properties, heat cycle reliability and reflow resistance, an adhesive sheet for semiconductor apparatus using the same, and a semiconductor apparatus, and to improve the reliability of the semiconductor apparatus and the economic efficiency based on ready processability. SOLUTION: This adhesive composition for semiconductor apparatus is characterized in that the adhesive composition forms (B) the adhesive layer of the semiconductor apparatus having a structure obtained by laminating (A) a circuit board layer composed of an insulator layer and a conductor pattern, (B) the adhesive layer and (C) a semiconductor integrated circuit in this order and connecting the (C) the semiconductor integrated circuit to (A) the circuit board layer by wire bonding. The adhesive composition comprises at least one kind of a thermoplastic resin and at least one kind of a thermosetting resin as essential components, the adhesive composition after heating and curing has at least one softening point in the temperature range of -65 deg.C to 50 deg.C and a modulus of elasticity E' at a temperature of 100 deg.C to 150 deg.C is 1 MPa

公开(公告)号：JP2000277572A

公开(公告)日：2000-10-06

申请号：JP8626799

申请日：1999-03-29

Applicant: TORAY INDUSTRIES

Inventor： KONISHI YUKITSUNA ,  OGURA MIKIHIRO ,  KIGOSHI SHOJI

IPC: H01L23/12 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a tape with an adhesive for a semiconductor device having excellent high lifetime and high adhesive properties and a substrate for connecting a semiconductor using the tape and the semiconductor device. SOLUTION: In the tape with the adhesive for the TAB having a protective film layer and an adhesive layer on an organic insulating film having flexibility, total calorific values are kept within the ranges of 0.5

公开(公告)号：JPH10178069A

公开(公告)日：1998-06-30

申请号：JP22170897

申请日：1997-08-18

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin, a thermoplastic resin, and a thermocuring type adhesive containing aluminum hydroxide as an adhesive composition for constituting and adhesive layer. SOLUTION: In substrate for connecting semiconductor integrated circuit with at least one layer of each of a wiring substrate layer 4 that consists of an insulator layer 3 and a conductor pattern, a layer 7 where no conductor patterns are formed, and an adhesive layer 6, an adhesive composition for constituting the adhesive layer 6 is an epoxy resin, a thermoplastic resin, and a thermosetting adhesive containing silica powder. Any epoxy resin with at least two epoxy groups in one molecule may be used. A copolymer with butadiene as an essential copolymerization constituent is preferable for the thermoplastic resin. Aluminum hydroxide is not limited particularly in terms of grain diameter and shape but one having an average grain size of at most 1μm is preferably used, and the amount of blend is preferably 2-40wt.% in the adhesive composition.

公开(公告)号：JPH10178064A

公开(公告)日：1998-06-30

申请号：JP21652297

申请日：1997-08-11

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin and a thermoplastic resin that contains a specific epoxy resin as an essential constituent as an adhesive composition which constitutes an adhesive layer. SOLUTION: An epoxy resin A that contains, as an essential constituent, an epoxy resin (a) indicated by an expression and a thermoplastic resin B are used as an adhesive composition which constitutes an adhesive layer. R1-R4 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. An example of the epoxy resin (a) is terpendiphenodiglycidylether. The epoxy resin (a) is contained in an epoxy resin A preferably by 60wt.% or hither and the epoxy resin A is preferably contained in the adhesive composition by 20-60wt.% A thermoplastic resin B contained in the adhesive layer preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, and methyol group as a functional group that can react with the epoxy resin.

公开(公告)号：JPH10178062A

公开(公告)日：1998-06-30

申请号：JP21652097

申请日：1997-08-11

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using an epoxy resin and a thermoplastic resin that contains a specific epoxy resin as an essential constituent as an adhesive composition which constitutes an adhesive layer. SOLUTION: An epoxy resin A that contains, as an essential constituent, an epoxy resin (a) indicated by an expression and a thermoplastic resin B are used as an adhesive composition which constitutes an adhesive layer. R1-R8 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. The epoxy resin (a) is contained in an epoxy resin A preferably by 60wt.% of higher and the epoxy resin A is contained in the adhesive composition preferably by 20-60wt.%. A thermoplastic resin B contained in the adhesive layer preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, methylol group, isocyanate group, vinyl group, and silanol group as a functional group that can react with the epoxy resin.

公开(公告)号：JPH10178056A

公开(公告)日：1998-06-30

申请号：JP21651497

申请日：1997-08-11

Applicant: TORAY INDUSTRIES

Inventor： SAWAMURA TAIJI ,  ANDO YOSHIO ,  KIGOSHI SHOJI

IPC: C09J7/00 ,  C09J11/04 ,  C09J109/00 ,  C09J163/00 ,  C09J201/00 ,  H01L21/60 ,  H01L23/12 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To improve reflow resistance property and thermal cycle property by using a thermoplastic resin and an epoxy resin that contains a specific epoxy resin as an essential constituent as an adhesive composition for a semiconductor integrated circuit. SOLUTION: Epoxy resin A that contains, as essential constituents, a thermoplastic resin and an epoxy resin (a) indicated by an expression is used as an adhesive composition for a semiconductor integrated circuit. R1-R8 in the expression indicate hydrogen atom, low-class alkyl group of C1-C4 or halogen atom. The epoxy resin (a) is contained in the epoxy resin A preferably by 60wt.% or higher and the epoxy resin A is contained in the adhesive composition preferably by 20-60wt.%. The thermoplastic resin preferably has, for example, amino group, carboxyl group, epoxy group, hydroxyl group, methylol group, isocyanate group, vinyl group, and silanal group as a functional group that can react with the epoxy resin A.

公开(公告)号：JPH10107093A

公开(公告)日：1998-04-24

申请号：JP10097097

申请日：1997-04-02

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  HATANO HIROSHI ,  KONISHI YUKITSUNA

IPC: B32B7/12 ,  C09J7/00 ,  C09J161/00 ,  C09J163/00 ,  C09J177/00 ,  C09J201/00 ,  H01L21/60 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To contrive the enhancement of the adhesiveness of a tape with a bonding agent for semiconductor use while the superior insulation properties of the tape are held by a method wherein a bonding agent layer subsequent to hot setting is provided with a microphase isolated structure comprising two phases or more to a plurality of continuous phases. SOLUTION: A laminated structure tape is constituted of an organic insulating film 1 having a flexibility, a bonding agent layer 2 formed on the film 1 and a protective film layer. After the layer 2 is subjected to hot setting, it has a microphase isolated structure, which is constituted of at least two continuous phases or more. Moreover, the components of the continuous phases are coupled with each other and are substantially in a state that they are mutually mixed into an indeterminate form or a layer type as a matrix component. In such a way, the two components or more of different characteristics are made to mix as microcontinuous phases, whereby characteristics higher than those of a simple mixture are revealed in the layer 2 and a tape with bonding agent for semiconductor device use, which can achieve simultaneously a superior adheveness while the tape holds superior insulation properties, can be obtained.

公开(公告)号：JPH10102025A

公开(公告)日：1998-04-21

申请号：JP26305496

申请日：1996-10-03

Applicant: TORAY INDUSTRIES

Inventor： TABATA AKIHIRO ,  KIGOSHI SHOJI

IPC: C09J163/00 ,  C09J109/02 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To industrially provide a new copper-clad laminated board for flexible printed circuit board and a flexible printed circuit board produced by using the laminated board having excellent electrical insulation and workability without deteriorating the adhesivity. SOLUTION: This copper-clad laminated board for flexible printed circuit board is produced by integrally laminating a copper foil to an insulation film interposing an adhesive composition containing the following essential components (A) 100 pts.wt. of an acrylonitrile butadiene rubber, (B) 20-180 pts.wt. of an epoxy resin, (C) 0.01-50 pts.wt. of a curing agent and (D) 0.30-5 pts.wt. of a polymer having a fluorine-containing alkyl group.

公开(公告)号：JPH09260439A

公开(公告)日：1997-10-03

申请号：JP661797

申请日：1997-01-17

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  KONISHI YUKITSUNA ,  HATANO HIROSHI

IPC: B32B27/00 ,  B32B27/34 ,  B32B27/42 ,  C09J7/02 ,  C09J161/06 ,  C09J177/00 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a TAB tape having excellent adhesiveness and insulating property, by causing an adhesive layer to contain a polyamide resin and a crosslinked phenol resin as essential components. SOLUTION: A TAB tape with an adhesive is made of a laminate body having an adhesive layer 2 and a protective film layer provided on a flexible organic insulating film 1. The adhesive layer 2 contains a polyamide resin and at least one or more kinds of crosslinked phenol resins as essential components. Since it is important that the phenol resin is dissolved well with the polyamide resin, it should have a soluble percentage of 30% or higher. The number average molecular weight of the crosslinked phenol resin is set to 1000-200000. In addition, the mixing ratio of the crosslinked phenol resin and the polyamide resin is normally set to 5-50 parts by weight of the crosslinked phenol resin for 100 parts by weight of the polyamide resin. Thus, a TAP tape having excellent adhesiveness and insulating property may be provided.

公开(公告)号：JPH07273434A

公开(公告)日：1995-10-20

申请号：JP6315094

申请日：1994-03-31

Applicant: TORAY INDUSTRIES

Inventor： KIGOSHI SHOJI ,  TABATA AKIHIRO

IPC: C09J163/00 ,  H05K3/28

Abstract: PURPOSE:To improve bondability, solder heat resistance, and workability of sticking process, by spreading thermosetting type adhesive agent containing specific NBR-C, epoxy resin, hardener mixture and hardening accelerator, as inevitable components. CONSTITUTION:A coverlay film consists of a laminate of an insulating plastic film and a release film. The plastic film is coated with thermosetting adhesive agent containing the following as inevitable components. That is, carboxyl group containing acrylonitorile butadiene rubber of 100wt.%, epoxy resin of 50-400wt.%, hardener mixture containing at least one or more kinds of aromatic polyamine whose reactive indexes Rg's are 3-13 and 15-30, and hardening accelerator of 0.1-5.0wt.%. Rg is equal to th/td where th is the gel time at 150 deg.C of mixture of bisphenol A diglycidylether and aromatic polyamine, and td is the gel time at 150 deg.C of mixture of bisphenol A diglycidylether and 4, 4' diaminodiphenyl methane.