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公开(公告)号:DE60312109D1
公开(公告)日:2007-04-12
申请号:DE60312109
申请日:2003-09-29
Applicant: UNITED TECHNOLOGIES CORP
Inventor: MORAVSKY ROBERT J , VANDERMYN STEPHEN G , MARSZAL DEAN N
Abstract: A tool 10 for cleaning an anode 12 in a coating machine has a rotary brush 20 driven by a driver such as a cordless power drill 19. The rotary brush 20 and the driver 19 are connected to a support structure 16 and an adapter 14 which allows the tool 10 to be joined to a shaft 18 associated with the coating machine. The tool 10 further includes a light source 24 connected to the support structure 16 for enabling an operator to see an anode 12 as it is being cleaned.
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公开(公告)号:SG67548A1
公开(公告)日:1999-09-21
申请号:SG1998003324
申请日:1998-08-27
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , NOETZEL ALLAN A , WRIGHT ROBERT J
Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.
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公开(公告)号:DE69835324T2
公开(公告)日:2007-08-23
申请号:DE69835324
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSEL A , HENDRICKS ROBERT E , MARSZAL DEAN N , WRIGHT ROBERT J , NOETZEL ALLAN A
Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.
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公开(公告)号:DE69835324D1
公开(公告)日:2006-09-07
申请号:DE69835324
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSEL A , HENDRICKS ROBERT E , MARSZAL DEAN N , WRIGHT ROBERT J , NOETZEL ALLAN A
Abstract: According to the present invention, an apparatus (10) for applying material by cathodic arc vapor deposition to a substrate (12) is provided which includes a vessel (14), apparatus (16) for maintaining a vacuum in the vessel, an annular cathode (18) having a bore (46) and an evaporative surface (44) extending between first (40) and second (42) end surfaces, apparatus (24) for selectively sustaining an arc of electrical energy between the cathode and a anode, and apparatus for driving the arc around the evaporative surface. The apparatus for driving the arc is positioned within the cathode bore, and produces a magnetic field that runs substantially parallel to the evaporative surface. The annular cathode is disposed radially inside of, and aligned with, the substrates inside the vessel.
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公开(公告)号:DE69832016T2
公开(公告)日:2006-07-13
申请号:DE69832016
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP HARTF
Inventor: BEERS RUSSELL A , MARSZAL DEAN N , NOETZEL ALLAN A , SILEO GERARD A , HENDRICKS ROBERT E , WRIGHT ROBERT J , ERVIN DAVID R
Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.
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公开(公告)号:SG67546A1
公开(公告)日:1999-09-21
申请号:SG1998003308
申请日:1998-08-27
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , NOETZEL ALLAN A , WRIGHT ROBERT J , ROYAL TYRUS E
Abstract: An apparatus (10) for applying material by cathodic arc deposition to a substrate (12) is provided which includes a vessel (14), means (16) for maintaining a vacuum in the vessel, a cathode (18), a contactor (20), means (24) for selectively sustaining an arc of electrical energy between the cathode and an anode (26), and an actuator (22). The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.
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公开(公告)号:DE602004019471D1
公开(公告)日:2009-04-02
申请号:DE602004019471
申请日:2004-05-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: MARSZAL DEAN N , AGLI WILLIAM A
IPC: B23B31/107 , B23Q1/00 , C23C14/50
Abstract: The locator has a dual wedge (31) with two wedge prongs that have its ends symmetrically disposed about a wedge centerline. A wedge bridge connects one end of the prongs. A fastening unit removably fastens the other end of the prongs. The prongs are adapted to extend in contact with base wedge slots of a fixture base (11) and mount wedge slots of a machine tool mount (21).
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公开(公告)号:AT422985T
公开(公告)日:2009-03-15
申请号:AT04253201
申请日:2004-05-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: MARSZAL DEAN N , AGLI WILLIAM A
IPC: B23B31/107 , B23Q1/00 , C23C14/50
Abstract: The locator has a dual wedge (31) with two wedge prongs that have its ends symmetrically disposed about a wedge centerline. A wedge bridge connects one end of the prongs. A fastening unit removably fastens the other end of the prongs. The prongs are adapted to extend in contact with base wedge slots of a fixture base (11) and mount wedge slots of a machine tool mount (21).
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公开(公告)号:DE69840142D1
公开(公告)日:2008-12-04
申请号:DE69840142
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , HENDRICKS ROBERT E , MARSZAL DEAN N , WRIGHT ROBERT J , NOETZEL ALLAN A , ROYAL TYRUS E
Abstract: An apparatus (10) for applying material by cathodic arc deposition to a substrate (12) is provided which includes a vessel (14), means (16) for maintaining a vacuum in the vessel, a cathode (18), a contactor (20), means (24) for selectively sustaining an arc of electrical energy between the cathode and an anode (26), and an actuator (22). The cathode and contactor are positioned inside the vessel, and the contactor is electrically connected to the means for selectively sustaining an arc of electrical energy. The actuator selectively actuates the contactor into electrical contact with the cathode, and thereby electrically connects the cathode to the means for sustaining an arc of electrical energy.
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公开(公告)号:DE69832016D1
公开(公告)日:2005-12-01
申请号:DE69832016
申请日:1998-08-28
Applicant: UNITED TECHNOLOGIES CORP
Inventor: BEERS RUSSELL A , MARSZAL DEAN N , NOETZEL ALLAN A , SILEO GERARD A , HENDRICKS ROBERT E , WRIGHT ROBERT J , ERVIN DAVID R
Abstract: A vapor deposition production system (10) for coating substrates (12) is provided which includes a plurality of vapor deposition coaters (14), a plurality of platters (16), a platter docking station (18), a shuttle track (20), and apparatus for transporting the platters between the coaters and the platter docking station. The shuttle track connects the platter docking station and the coaters. Platters selectively removed from the coaters are transported along the shuttle track to the platter docking station where processed substrates are unloaded from the platters and unprocessed substrates loaded on to the platters.
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