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公开(公告)号：US11410940B2
公开(公告)日：2022-08-09
申请号：US17170736
申请日：2021-02-08
Applicant: Unimicron Technology Corp.
Inventor： Pu-Ju Lin , Cheng-Ta Ko , Yu-Hua Chen , Tzyy-Jang Tseng , Ra-Min Tain
Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.
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公开(公告)号：US20210118839A1
公开(公告)日：2021-04-22
申请号：US16687557
申请日：2019-11-18
Applicant: Unimicron Technology Corp.
Inventor： Pu-Ju Lin , Cheng-Ta Ko , Ra-Min Tain , Tzyy-Jang Tseng
IPC: H01L23/00 , H01L23/538
Abstract: A chip package structure includes a substrate, at least two chips, a plurality of first pads, a plurality of first micro bumps, and a bridging element. The substrate has a first surface and a second surface opposite to the first surface. The two chips are disposed on the first surface of the substrate and are horizontally adjacent to each other. Each chip has an active surface. The first pads are disposed on the active surface of each of the chips. The first micro bumps are disposed on the first pads and have the same size. The bridging element is disposed on the first micro bumps such that one of the chips is electrically connected to another of the chips through the first pads, the first micro bumps, and the bridging element.
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公开(公告)号：US10957658B2
公开(公告)日：2021-03-23
申请号：US16866530
申请日：2020-05-04
Applicant: Unimicron Technology Corp.
Inventor： Pu-Ju Lin , Cheng-Ta Ko , Yu-Hua Chen , Tzyy-Jang Tseng , Ra-Min Tain
Abstract: A package structure includes a redistribution structure, a chip, one or more structural reinforcing elements, and a protective layer. The redistribution structure includes a first circuit layer and a second circuit layer disposed over the first circuit layer. The first circuit layer is electrically connected to the second circuit layer. The chip is disposed over the redistribution structure and electrically connected to the second circuit layer. The one or more structural reinforcing elements are disposed over the redistribution structure. The structural reinforcing element has a Young's modulus in a range of 30 to 200 GPa. The protective layer overlays the chip and a sidewall of the structural reinforcing element.
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公开(公告)号：US20210074606A1
公开(公告)日：2021-03-11
申请号：US16952080
申请日：2020-11-19
Applicant: Unimicron Technology Corp.
Inventor： Pei-Wei Wang , Ching Sheng Chen , Ra-Min Tain , Ming-Hao Wu , Hsuan-Wei Chen
IPC: H01L23/373 , H01L23/498 , H01L21/48
Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.
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公开(公告)号：US20210014963A1
公开(公告)日：2021-01-14
申请号：US16533808
申请日：2019-08-07
Applicant: Unimicron Technology Corp.
Inventor： Ra-Min Tain , Chi-Chun Po , Po-Hsiang Wang
Abstract: A circuit board structure includes a carrier and a patterned circuit layer. The patterned circuit layer is disposed on the carrier, and the patterned circuit layer has at least one fluid channel therein. The fluid channel has a heat absorption section and a heat dissipation section relative to the heat absorption section. A heat source is electrically connected to the patterned circuit layer, and the heat absorption section is adjacent to the heat source. The heat generated by the heat source is transferred from the patterned circuit layer to the heat absorption section of the fluid channel, and is transferred from the heat absorption section to the heat dissipation section for heat dissipation.
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Patent Agency Ranking
公开(公告)号：US10515870B1
公开(公告)日：2019-12-24
申请号：US16029659
申请日：2018-07-09
Applicant: Unimicron Technology Corp.
Inventor： Chin-Sheng Wang , Pei-Chang Huang , Ra-Min Tain
IPC: H01L23/367 , H01L23/467 , H01L23/498
Abstract: A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-permeable structure.
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公开(公告)号：US20190371704A1
公开(公告)日：2019-12-05
申请号：US16029659
申请日：2018-07-09
Applicant: Unimicron Technology Corp.
Inventor： Chin-Sheng Wang , Pei-Chang Huang , Ra-Min Tain
IPC: H01L23/467 , H01L23/498 , H01L23/367
Abstract: A package carrier includes a multilayer circuit structure, at least one gas-permeable structure, a first outer circuit layer, a second outer circuit layer, a first solder mask and a second solder mask. The multilayer circuit structure has an upper surface and a lower surface opposite to each other and a plurality of through holes. The gas-permeable structure is in the form of a mesh and disposed in at least one of the through holes. The first and the second outer circuit layers respectively at least cover the upper and the lower surfaces. At least one first opening of the first solder mask exposes a portion of the first outer circuit layer and is disposed corresponding to the gas-permeable structure. At least one second opening of the second solder mask exposes a portion of the second outer circuit layer and is disposed corresponding to the gas-peiuieable structure.
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公开(公告)号：US12200861B2
公开(公告)日：2025-01-14
申请号：US17979754
申请日：2022-11-02
Applicant: Unimicron Technology Corp.
Inventor： Guang-Hwa Ma , Chin-Sheng Wang , Ra-Min Tain
Abstract: A circuit board structure includes a dielectric substrate, at least one embedded block, at least one electronic component, at least one first build-up circuit layer, at least one second build-up circuit layer, at least one conductive through hole, and a fine redistribution layer (RDL). The embedded block is fixed in a through cavity of the dielectric substrate. The electronic component is disposed in an opening of the embedded block. The first build-up circuit layer is disposed on a top surface of the dielectric substrate and electrically connected with the electronic component. The second build-up circuit layer is disposed on a bottom surface of the dielectric substrate and covers the embedded block. The conductive through hole is disposed in a via of the embedded block and electrically connects the first and the second build-up circuit layers. The fine RDL is disposed on and electrically connected to the first build-up circuit layer.
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公开(公告)号：US20230335506A1
公开(公告)日：2023-10-19
申请号：US18338273
申请日：2023-06-20
Applicant: Unimicron Technology Corp.
Inventor： Chin-Sheng Wang , Ra-Min Tain , Chih-Kai Chan
IPC: H01L23/552 , H01L23/66 , H01L21/52 , H01Q1/22 , H01L21/48
CPC classification number: H01L23/552 , H01L21/4817 , H01L21/52 , H01L23/66 , H01Q1/2283 , H01L23/49822
Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The first circuit structure includes a bottom conductive plate having at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.
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公开(公告)号：US20230137841A1
公开(公告)日：2023-05-04
申请号：US18089465
申请日：2022-12-27
Applicant: Unimicron Technology Corp.
Inventor： John Hon-Shing Lau , Ra-Min Tain , Cheng-Ta Ko , Tzyy-Jang Tseng , Chun-Hsien Chien
Abstract: A circuit carrier includes a substrate, a first build-up circuit structure, a second build-up circuit structure, a fine redistribution structure and at least one conductive through hole. The substrate has a top surface and a bottom surface opposite to each other. The first build-up circuit structure is disposed on the top surface of the substrate and electrically connected to the substrate. The second build-up circuit structure is disposed on the bottom surface of the substrate and electrically connected to the substrate. The fine redistribution structure is directly attached on the first build-up circuit structure, wherein a line width and a line spacing of the fine redistribution structure are smaller than those of the first build-up circuit structure. The conductive through hole penetrates the fine redistribution structure and a portion of the first build-up circuit structure and is electrically connected to the fine redistribution structure and the first build-up circuit structure.
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