Abstract:
A bonded wafer fabrication mechanism for a micro-mirror structure provides f or oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.
Abstract:
A monolithically fabricated micromachined structure couples a reference fram e (56) to a dynamic plate (58). Performance of torsional oscillators or scanne rs benefits greatly by coupling the frame (56) to the plate (58) with folded torsional flexure hinges (96) rather than torsion bars. A folded torsion flexure hinge (96) for supporting the plate (58) from the frame (56) is made up of three basic hinge segments (102a, 102b, 102c). Each basic hinge segmen t (102a, 102b, 102c) has a longitudinal axis (98) which is not oriented perpendicular to the rotation axis (62) of the plate (58). An intermediaire region (104) of the folded torsional flexure hinge (96) couples together immediately adjacent ends (106) of the basic hinge segments (102a, 102b, 102c). A basic hinge segment (102b) may include a torsion sensor (108) for measuring angular rotation of the plate (58) about axis (62) with respect to the frame (56).
Abstract:
A monolithically fabricated micromachined structure couples a reference frame (56) to a dynamic plate (58). Performance of torsional oscillators or scanners benefits greatly by coupling the frame (56) to the plate (58) with folded torsional flexure hinges (96) rather than torsion bars. A folded torsion flexure hinge (96) for supporting the plate (58) from the frame (56) is made up of three basic hinge segments (102a, 102b, 102c). Each basic hinge segment (102a, 102b, 102c) has a longitudinal axis (98) which is not oriented perpendicular to the rotation axis (62) of the plate (58). An intermediaire region (104) of the folded torsional flexure hinge (96) couples together immediately adjacent ends (106) of the basic hinge segments (102a, 102b, 102c). A basic hinge segment (102b) may include a torsion sensor (108) for measuring angular rotation of the plate (58) about axis (62) with respect to the frame (56).
Abstract:
A monolithically fabricated micromachined structure couples a reference frame (56) to a dynamic plate (58). Performance of torsional oscillators or scanners benefits greatly by coupling the frame (56) to the plate (58) with folded torsional flexure hinges (96) rather than torsion bars. A folded torsion flexure hinge (96) for supporting the plate (58) from the frame (56) is made up of three basic hinge segments (102a, 102b, 102c). Each basic hinge segment (102a, 102b, 102c) has a longitudinal axis (98) which is not oriented perpendicular to the rotation axis (62) of the plate (58). An intermediaire region (104) of the folded torsional flexure hinge (96) couples together immediately adjacent ends (106) of the basic hinge segments (102a, 102b, 102c). A basic hinge segment (102b) may include a torsion sensor (108) for measuring angular rotation of the plate (58) about axis (62) with respect to the frame (56).
Abstract:
A fiber optic switch (400) includes a fiber optic switching module (100) that receives and fixes ends (104) of optical fibers (106). The module (100) includes numerous reflective light beam deflectors (172) which may be selected as pairs for coupling a beam of light (108) between a pair of optical fibers (106). The module (100) also produces orientation signals from each deflector (172) which indicate its orientation. A portcard (406) included in the switch (400) supplies drive signals to the module (100) for orienting at least one deflector (172). The portcard (406) also receives the orientation signals produced by that deflector (172) together with coordinates that specify an orientation for the deflector (172). The portcard (406) compares the received coordinates with the orientation signals received from the deflector (172) and adjusts the drive signals supplied to the module (100) to reduce any difference between the received coordinates and the orientation signals. The switch (400) also employs optical alignment to precisely orient pairs of deflectors (172) coupling a beam of light (108) between optical fibers (106).
Abstract:
An improved micromachined structure used for beam scanners, gyroscopes, etc. includes a reference member (154, 54) from which project a first pair of axially aligned torsion bars (156, 56). A first dynamic member (54 or 52), coupled to and supported from the reference member (154, 54) by the torsion bars (156, 56), oscillates in one-dimension about the torsion bar's axis. A second dynamic member (52) may be supported from the first dynamic member (54) by a second pair of axially aligned torsion bars (56) for two-dimensional oscillation. The dynamic members (54, 52) respectively exhibit a plurality of vibrational modes each having a frequency and a Q. The improvement includes means for altering a characteristic of the dynamic member's frequency and Q. Coupling between dynamic members (54, 52) permits altering the second dynamic member's frequency and Q by techniques applied to the first dynamic member (54). Some techniques disclosed also increase oscillation amplitude or reduce driving voltage, and also increase mechanical ruggedness of the structure.
Abstract:
A micro-mirror strip assembly having a plurality of two-dimensional micro-mirror structures with improved deflection and other characteristics is presented. In the micro-mirror structures, electrodes for electrostatic deflection are disposed on conical or quasi-conical entities that are machined, attached or molded into a substrate. Torsion sensors (244) are provided along the axes of rotation to control deflection of the quadrant deflection electrodes. The shielded sensor structure (240) includes a silicon layer (241), an insulating layer (242) and a metal layer (243). The structure further includes a sensor implant resistor (244) in the silicon layer (241) and a shield (245) that is applied over the sensor implant resistor (244) to stabilise sensor output and eliminate light sensitivity.
Abstract:
A bonded wafer fabrication mechanism for a micro-mirror structure provides for oxidizing a device wafer instead of a handle wafer or splitting thermal oxidation processing between the device wafer and the handle wafer prior to etching. The flatness of mirrors in micro-mirror structures fabricated according to such a mechanism is substantially improved.
Abstract:
A document transport for a scanner (100) has a flexible, elongated finger (226) disposed adjacent to a document (134), and a force applied to the finger (226) urges teeth (233) on the finger (226) into contact with the document (134) which urges the document (134) along a path through the scanner (100). A piezoelectric plate (222), which applies the force to the finger (226), requires only a small amount of electrical power. To traverse the scanner (100), a document (134) may also be manually fed along a guide (272). First and second speed-sensing detectors (276a and 276b), disposed along the path traversed by the document (134), permit the scanner (100) to determine a speed at which the manually fed document (134) traverses the scanner (100). To conserve electrical energy, the scanner (100) also includes a document-presence detector (274) for activating the scanner (100) when a document (134) to be scanned is present.
Abstract:
A document transport for a scanner (100) has a flexible, elongated finger (226) disposed adjacent to a document (134), and a force applied to the finger (226) urges teeth (233) on the finger (226) into contact with the document (134) which urges the document (134) along a path through the scanner (100). A piezoelectric plate (222), which applies the force to the finger (226), requires only a small amount of electrical power. To traverse the scanner (100), a document (134) may also be manually fed along a guide (272). First and second speed-sensing detectors (276a and 276b), disposed along the path traversed by the document (134), permit the scanner (100) to determine a speed at which the manually fed document (134) traverses the scanner (100). To conserve electrical energy, the scanner (100) also includes a document-presence detector (274) for activating the scanner (100) when a document (134) to be scanned is present.