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公开(公告)号：US20150040392A1
公开(公告)日：2015-02-12
申请号：US14458236
申请日：2014-08-12
Inventor： MING-JAAN HO , XIAN-QIN HU , ZHI-TIAN WANG
CPC classification number: H05K3/285 , H05K3/282 , H05K2203/013 , H05K2203/1105 , Y10T29/49156
Abstract: A PCB includes a base layer, a wiring pattern formed on a surface of the base layer, and a protecting layer formed on the wiring pattern. The protecting layer is formed by printing and solidifying an ink on the wiring pattern. The ink includes a cycloaliphatic epoxy resin, a phenoxyl resin solution, a solvent, a hardener, and an antifoaming agent.
Abstract translation: PCB包括基底层，形成在基底层的表面上的布线图案和形成在布线图案上的保护层。 通过在布线图案上印刷和固化墨来形成保护层。 油墨包括脂环族环氧树脂，苯氧基树脂溶液，溶剂，硬化剂和消泡剂。
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公开(公告)号：US20150034364A1
公开(公告)日：2015-02-05
申请号：US14162769
申请日：2014-01-24
Inventor： MING-JAAN HO , XIAN-QIN HU , SHAO-HUA WANG , FU-YUN SHEN
IPC: H05K1/02
CPC classification number: H05K1/0215 , H05K1/0216 , H05K1/0393 , H05K3/288 , H05K2201/0116 , H05K2201/0145 , H05K2201/0154 , H05K2201/2009 , H05K2203/0221 , H05K2203/095 , H05K2203/1194
Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.
Abstract translation: FPCB包括柔性基底，形成在基底的顶表面上的布线层，形成在布线层上的覆盖层和形成在覆盖层的一部分上的屏蔽层。 布线层包括接地线。 覆盖层限定了将接地线暴露于外部的开口。 屏蔽层的一部分填充到开口中。 屏蔽层通过开口与接地线电连接。
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13.发明申请POLYIMIDE, COPPER-CLAD LAMINATE, FLEXIBLE PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开聚酰亚胺，铜箔层压板，柔性印刷电路板以及制造柔性印刷电路板的方法公开(公告)号：US20140158410A1
公开(公告)日：2014-06-12
申请号：US14093669
申请日：2013-12-02
Applicant: Zhen Ding Technology Co., Ltd.
Inventor： MING-JAAN HO
CPC classification number: B32B15/08 , C08G73/10 , C08L79/08 , H05K1/0346 , H05K1/0393 , H05K3/022 , H05K3/281 , H05K2201/0108 , H05K2201/0145 , H05K2201/0154 , H05K2201/0355 , H05K2203/0108 , Y10T428/265 , Y10T428/31681
Abstract: A polyimide is formed by dehydrating a polyamic acid. The polyamic acid is formed by polymerizing a diamine and a fluorine dianhydride. The diamine is 2,2′-bis[4-(4-aminophenoxy) phenyl] propane, and the fluorine dianhydride is 2,2-bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride. When a color of the polyimide is defined by Lab color space, b component is set from about −10 to about +10. The disclosure further relates to a copper-clad laminate, a flexible printed circuit, and a method for manufacturing the flexible printed circuit.
Abstract translation: 通过使聚酰胺酸脱水形成聚酰亚胺。 通过聚合二胺和氟二酐形成聚酰胺酸。 二胺是2,2'-双[4-（4-氨基苯氧基）苯基]丙烷，氟二酐是2,2-双（3,4-二羧基苯基）六氟丙烷二酐。 当聚酰亚胺的颜色由Lab颜色空间定义时，b分量设定为约-10至约+10。 本发明还涉及覆铜层压板，柔性印刷电路和用于制造柔性印刷电路的方法。
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14.发明申请公开(公告)号：US20140027164A1
公开(公告)日：2014-01-30
申请号：US13953881
申请日：2013-07-30
Inventor： RUI-WU LIU , MING-JAAN HO , XIAN-QIN HU
CPC classification number: H05K1/09 , H05K1/02 , H05K3/00 , H05K3/06 , H05K3/067 , H05K3/068 , H05K3/10 , H05K3/243 , H05K3/244 , H05K3/26 , H05K3/282 , H05K3/288 , H05K2201/0108 , H05K2201/0355 , H05K2203/0307 , H05K2203/0315 , H05K2203/075 , H05K2203/1545 , H05K2203/1572 , Y10T29/49155
Abstract: This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure.
Abstract translation: 本公开涉及一种印刷电路板，其包括透光绝缘层，图案化导电层和透光覆盖层。 图案化导电层包括第一黑色氧化物层，铜层和第二黑色氧化物层。 铜层包括互连铜层的两个相对表面的两个相对表面和多个内表面。 第一黑色氧化物层形成在一个表面上，并且第二黑色氧化物层形成在另一个表面和内表面上。 图案化导电层设置在透光绝缘层上。 透光性覆盖层布置在第二黑色氧化物层上。 在本公开中还提供了制造印刷电路板的方法。
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公开(公告)号：US20170110244A1
公开(公告)日：2017-04-20
申请号：US14928530
申请日：2015-10-30
Applicant: FuKui Precision Component (Shenzhen) Co., Ltd. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： XIAN-QIN HU , FU-YUN SHEN , MING-JAAN HO , YI-QIANG ZHUANG
CPC classification number: H01F38/14 , H01F27/2804 , H01F41/041 , H01F2027/2809 , H05K1/0393 , H05K1/165 , H05K2201/09672 , H05K2201/10098
Abstract: A circuit board for radio transceiving includes a flexible base and an inductance unit. The flexible base has a first conductive hole. The inductance unit includes a first inductance coil located at a first side of the flexible base and a second inductance coil located at an opposite side of the flexible base from the first inductance coil. The first inductance coil surrounds the first conductive hole and extends in a spiral direction and turn-by-turn into the first conductive hole. The second inductance coil surrounds the first conductive hole and extends in a spiral direction and turn-by-turn out from the first conductive hole. The first inductance coil and the second inductance coil are electrically connected with each other via the first conductive hole through the flexible base.
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Patent Agency Ranking
公开(公告)号：US20170027054A1
公开(公告)日：2017-01-26
申请号：US14858953
申请日：2015-09-18
Applicant: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , FuKui Precision Component (Shenzhen) Co., Ltd. , Zhen Ding Technology Co., Ltd.
Inventor： XIAN-QIN HU , YAN-LU LI , WEN-HSIN YU , MING-JAAN HO
CPC classification number: H05K1/0228 , H05K1/0221 , H05K1/0237 , H05K1/0242 , H05K1/028 , H05K1/0393 , H05K3/10 , H05K3/243 , H05K3/28 , H05K3/281 , H05K2201/0355 , H05K2201/0715
Abstract: A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.
Abstract translation: 柔性电路板包括绝缘层，线性信号线，多个接地线，金属涂层，电路层和电磁屏蔽层。 绝缘层包括第一面和第二面。 金属涂层覆盖第一面上的线性信号线。 金属涂层的厚度小于线性信号线的厚度，并且电导率大于线性信号线的电导率。 接地线位于第一面上线性信号线的两侧。 电路层位于第二面。 电磁屏蔽层覆盖线性信号线和接地线。 线性信号线和接地线在电磁屏蔽层和电路层之间。 还提供了一种用于制造柔性电路板的方法。
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公开(公告)号：US20160061540A1
公开(公告)日：2016-03-03
申请号：US14691258
申请日：2015-04-20
Inventor： XIAN-QIN HU , FU-YUN SHEN , MING-JAAN HO
CPC classification number: F28F21/085 , F28D15/02 , F28F3/048 , F28F2275/025
Abstract: A heat dissipation device includes a first copper sheet and a second copper sheet. The first copper sheet includes a number of first recesses and the second copper sheet includes a number of corresponding second recesses. The second copper sheet is fixed on the first copper sheet and an airtight receiving cavity is formed by each first recess and each the second recess, a working fluid in the airtight receiving cavity carries unwanted heat away.
Abstract translation: 散热装置包括第一铜片和第二铜片。 第一铜片包括多个第一凹槽，第二铜片包括多个对应的第二凹槽。 第二铜片被固定在第一铜片上，并且每个第一凹部和每个第二凹部形成气密接收腔，气密接收腔中的工作流体携带不需要的热量。
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公开(公告)号：US20150189760A1
公开(公告)日：2015-07-02
申请号：US14583120
申请日：2014-12-25
Inventor： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN , ZHI-TIAN WANG
CPC classification number: G03F7/20 , H05K1/0274 , H05K1/0393 , H05K1/165 , H05K2201/0108
Abstract: A flexible printed circuit board (PCB) used for near field communication and a method for manufacturing the flexible PCB are provided. The flexible PCB includes an insulating layer; a first conductive circuit layer adhered on a surface of the insulating layer, the first conductive circuit layer includes at least one first conductive circuit arranged as spiral-shaped and defines a plurality of first spaces; a first resin layer is adhered on a surface of the insulating layer and fills the first spaces; and a first cover layer adhered on a surface of the first resin layer and a surface of the first conductive circuit layer away from the insulating layer.
Abstract translation: 提供用于近场通信的柔性印刷电路板（PCB）和制造柔性PCB的方法。 柔性PCB包括绝缘层; 第一导电电路层，其粘附在所述绝缘层的表面上，所述第一导电电路层包括布置成螺旋状的至少一个第一导电电路，并且限定多个第一空间; 第一树脂层粘附在绝缘层的表面上并填充第一空间; 以及附着在第一树脂层的表面上的第一覆盖层和远离绝缘层的第一导电电路层的表面。
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公开(公告)号：US20150189738A1
公开(公告)日：2015-07-02
申请号：US14586986
申请日：2014-12-31
Inventor： MING-JAAN HO , XIAN-QIN HU , FU-YUN SHEN , YI-QIANG ZHUANG
CPC classification number: H05K1/0218 , H05K1/0219 , H05K1/0393 , H05K2201/0715 , H05K2201/09509 , Y10T156/1057
Abstract: A flexible printed circuit board includes a flexible printed circuit unit and an electromagnetic shielding structure. The flexible printed circuit unit includes a base layer and a first circuit layer formed on a surface of the base layer. The electromagnetic shielding structure includes a first insulating layer and a copper layer. The first insulating layer is adhered on a surface of the first circuit layer away from the base layer. At least one blind hole is defined in the electromagnetic shielding structure. The copper layer is electrically connected to the first circuit layer by a plating structure filled in the blind hole.
Abstract translation: 柔性印刷电路板包括柔性印刷电路单元和电磁屏蔽结构。 柔性印刷电路单元包括基底层和形成在基底层的表面上的第一电路层。 电磁屏蔽结构包括第一绝缘层和铜层。 第一绝缘层粘附在远离基层的第一电路层的表面上。 在电磁屏蔽结构中至少定义一个盲孔。 铜层通过填充在盲孔中的电镀结构电连接到第一电路层。
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20.发明申请公开(公告)号：US20140144685A1
公开(公告)日：2014-05-29
申请号：US14082196
申请日：2013-11-18
Inventor： MING-JAAN HO , XIAN-QIN HU
CPC classification number: H05K3/281 , H05K1/11 , H05K3/202 , H05K2201/0145 , H05K2203/063 , H05K2203/068 , Y10T29/302
Abstract: A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.
Abstract translation: 具有电路可见的印刷电路板包括按照上述顺序堆叠的布线层，第一粘合剂层，第一介电层和覆盖膜，所述布线层包括至少一个电接触焊盘。 覆盖膜具有至少一个对应于电接触垫的开口。 覆盖膜包括第二介电层和第二粘合剂层。 第一粘合剂层的流动起始温度在85摄氏度到90摄氏度的范围内，第一粘合剂的硬化温度低于150摄氏度。
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