Abstract:
A MEMS platform with four actuators and four corresponding actuation electrodes. Movement of the platform in the x-y lateral plane is controlled by voltages applied to the four actuation electrodes. Other embodiments are described and claimed.
Abstract:
The hinge (13) should preferably be formed to have a higher resistance than ever against the pivoting of the mirror body (12) to effectively prevent the hinge (13) from being damaged. By adopting a suitable one of a variety of production steps as necessary, the hinge (13) can be formed more finely and with a higher precision and thus the micro mirror unit can be produced more easily in a shorter time. To this end, the hinge (13) is formed from a different material, such as SiNx, from the mirror substrate material from which the frame (11) and mirror body (12) are formed.
Abstract translation:优选地,铰链(13)形成为具有比以往更高的抗反射镜主体(12)的枢转的阻力,以有效地防止铰链(13)被损坏。 通过根据需要采用各种生产步骤中的合适的一种,铰链(13)可以更精细地形成并且具有更高的精度,从而可以在更短的时间内更容易地制造微反射镜单元。 为此,铰链(13)由形成框架(11)和反射镜主体(12)的反射镜基板材料由不同的材料(例如SiN x x)形成。
Abstract:
A microelectromechanical compound stage microactuator assembly capable of motion along x, y, and z axes for positioning and scanning integrated electromechanical sensors and actuators is fabricated from submicron suspended single crystal silicon beams. The microactuator incorporates an interconnect system for mechanically supporting a central stage and for providing electrical connections to componants of the microactuator and to devices carried thereby. The microactuator is fabricated using a modified single crystal reactive etching and metallization process which incorporates an isolation process utilizing thermal oxidation of selected regions of the device to provide insulating segments which define conductive paths from external circuitry to the actuator components and to microelectronic devices such as gated field emitters carried by the actuator.
Abstract:
An electronic apparatus includes a first die, a second die, a third die, and a fourth die (101-104), wherein a portion of the second die (50) and a portion of the third die (150) are movably connected between the first die and the fourth die (101, 104).
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a micro-actuator with a media stage. SOLUTION: The method for manufacturing the micro-actuator with the media stage having a media loading surface and a coil for driving the media stage, on the bottom of the media loading surface is provided. The method for manufacturing the micro-actuator comprises: (a) a stage for forming a groove with a predetermined depth and area on a first substrate; (b) a stage for forming the coil on a second substrate; (c) a stage for bonding the surface in which the coil is formed on the second substrate to the surface in which the groove is formed on the first substrate; and (d) a stage for processing the rear surface of the surface bonded to the first substrate in the second substrate as the media loading surface. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
An actuator comprises a connection section having one end rotatably connected to a connection point (C1) of a fixed section and the other end rotatably connected to a connection point (C2) of a moving section, a connection section having one end rotatably connected to a connection point (C3) of the fixed section and the other end rotatably connected to a connection point (C4) of the moving sections a comb-teeth electrode having the root section connected to a comb-teeth base point (B1) and the fore-end section extending along the turning path, and a comb-teeth electrode having the root section connected to the fixed section and the other section extending along the curve of the comb-teeth electrode and opposed to the comb-teeth electrode with a predetermined gap.
Abstract:
An electronic apparatus includes a first die, a second die, a third die, and a fourth die (101-104), wherein a portion of the second die (50) and a portion of the third die (150) are movably connected between the first die and the fourth die (101, 104).
Abstract:
An electronic apparatus includes a first die, a second die, a third die, and a fourth die (101-104), wherein a portion of the second die (50) and a portion of the third die (150) are movably connected between the first die and the fourth die (101, 104).