Abstract:
A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.
Abstract:
A method and system for changing a pressure within at least one enclosure in a MEMS device are disclosed. In a first aspect, the method comprises applying a laser through one of the at least two substrates onto a material which changes the pressure within at least one enclosure when exposed to the laser, wherein the at least one enclosure is formed by the at least two substrates. In a second aspect, the system comprises a MEMS device that includes a first substrate, a second substrate bonded to the first substrate, wherein at least one enclosure is located between the first and the second substrates, a metal layer within one of the first substrate and the second substrate, and a material vertically oriented over the metal layer, wherein when the material is heated the material changes a pressure within the at least one enclosure.
Abstract:
A microelectromechanical structure and device and methods of forming and using the structure and device are disclosed. The structure includes a mechanical element, an ion conductor and a plurality of electrodes. Mechanical properties of the structure are altered by applying a bias across the electrodes. Such structures can be used to form devices such as resonators for RF applications.
Abstract:
A method for fabricating a sensor for chemical and/or biological materials, comprising steps of providing a wafer comprising a plurality of cantilever assemblies, each of the assemblies comprising a cantilever member and a micro-channel plate bonded to the cantilever member, the micro-channel plate further comprising a micro-channel, functionalizing each of the cantilevers by directing a flow of a plurality of functionalizing materials through the micro-channels, and dicing the wafer into a plurality of the sensors. Each of the cantilever assemblies comprises substrate comprising control and sense electrodes deposited on its top side and scribe marks etched on its back side; a cantilever member comprising a cantilever, a seed layer and a contact pad formed on top side of the cantilever member; and the micro-channel plate comprises a micro-channel housing defining the micro-channel etched through the housing, wherein the back side of the cantilever member is bonded to the substrate and the micro-channel plate is bonded to said top side of the cantilever member. Control electronics are incorporated into the substrate for a completely integrated design.
Abstract:
This disclosure provides systems, methods, and apparatus for a MEMS display incorporating extended height actuators. A light modulating component can be positioned between a substrate and an opposing surface coupled to the substrate. A suspended electrode can be coupled to the light modulating component and suspended between the substrate and the opposing surface. An extended-height electrode can be positioned immediately adjacent to the suspended electrode, and can extend from the substrate up to a height beyond the height of the suspended electrode. The suspended electrode and the extended-height electrode can be configured to move the light modulating component laterally with respect to the substrate.
Abstract:
A method for fabricating a sensor for chemical and/or biological materials, comprisingsteps of providing a wafer comprising a plurality of cantilever assemblies, each of theassemblies comprising a cantilever member and a micro-channel plate bonded to thecantilever member, the micro-channel plate further comprising a micro-channel, functionalizing each of the cantilevers by directing a flow of a plurality of functionalizingmaterials through the micro-channels, and dicing the wafer into a plurality of the sensors.Each of the cantilever assemblies comprises substrate comprising control and senseelectrodes deposited on its top side and scribe marks etched on its back side; a cantilevermember comprising a cantilever, a seed layer and a contact pad formed on top side of thecantilever member; and the micro-channel plate comprises a micro-channel housing defining the micro-channel etched through the housing, wherein the back side of the cantilevermember is bonded to the substrate and the micro-channel plate is bonded to said top side ofthe cantilever member. Control electronics are incorporated into the substrate for a completely integrated design.
Abstract:
A method for fabricating a sensor for chemical and/or biological materials, comprisingsteps of providing a wafer comprising a plurality of cantilever assemblies, each of theassemblies comprising a cantilever member and a micro-channel plate bonded to thecantilever member, the micro-channel plate further comprising a micro-channel, functionalizing each of the cantilevers by directing a flow of a plurality of functionalizingmaterials through the micro-channels, and dicing the wafer into a plurality of the sensors.Each of the cantilever assemblies comprises substrate comprising control and senseelectrodes deposited on its top side and scribe marks etched on its back side; a cantilevermember comprising a cantilever, a seed layer and a contact pad formed on top side of thecantilever member; and the micro-channel plate comprises a micro-channel housing defining the micro-channel etched through the housing, wherein the back side of the cantilevermember is bonded to the substrate and the micro-channel plate is bonded to said top side ofthe cantilever member. Control electronics are incorporated into the substrate for a completely integrated design.