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    CIRCUIT CARRIER BOARD
    12.
    发明公开
    CIRCUIT CARRIER BOARD 审中-公开

    公开(公告)号：US20240292517A1

    公开(公告)日：2024-08-29

    申请号：US18481097

    申请日：2023-10-04

    Applicant: Asia Pacific Microsystems, Inc.

    Inventor： Jer-Wei HSIEH ,  Hung-Lin YIN

    IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18

    CPC classification number: H05K1/0233 ,  H05K1/024 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/184 ,  H05K2201/0183 ,  H05K2201/0206 ,  H05K2201/083

    Abstract: A carrier board includes a substrate having a first substrate surface, a second substrate surface, and a substrate hole that penetrates the first substrate surface and the second substrate surface; a magnet sheath disposed in the substrate hole to cover a hole boundary of the substrate hole, and including a first magnetic surface, a second magnetic surface, and an inner periphery that interconnects the first magnetic surface and the second magnetic surface; a first dielectric isolation layer and a second dielectric isolation layer respectively having outer surfaces facing away from the substrate; and a conductive metal layer covering the inner periphery of the magnet sheath and extending to overlie the outer surfaces of the first dielectric isolation layer and the second dielectric isolation layer.

    PACKAGE SUBSTRATE AND COMMUNICATION DEVICE
    14.
    发明公开
    PACKAGE SUBSTRATE AND COMMUNICATION DEVICE 审中-公开

    公开(公告)号：US20230299018A1

    公开(公告)日：2023-09-21

    申请号：US18324329

    申请日：2023-05-26

    Applicant: HUAWEI TECHNOLOGIES CO., LTD.

    Inventor： Chen KANG ,  Chao SHEN ,  Xiaojing LIAO ,  Junhe WANG

    IPC: H01L23/00 ,  H01L23/552 ,  H01L23/31 ,  H05K1/18 ,  H01L23/498

    CPC classification number: H01L23/564 ,  H01L23/552 ,  H01L23/31 ,  H05K1/185 ,  H01L23/49822 ,  H05K2201/0206

    Abstract: This application provides a package substrate and a communication device. The package substrate includes a package body, a first circuit layer, a second circuit layer, an electronic component, and a moisture-proof structure. The package body includes a top surface and a bottom surface that are oppositely disposed, the first circuit layer is disposed on the top surface of the package body, and the second circuit layer is disposed on the bottom surface of the package body. The electronic component is packaged inside the package body. The moisture-proof structure is disposed on the package body and is connected between the first circuit layer and the second circuit layer, and the moisture-proof structure surrounds the electronic component. According to technical solutions of this application, external water vapor can be prevented from entering the package substrate from a peripheral side of the package substrate, to effectively prevent moisture absorption.

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