PRINTED CIRCUIT BOARD
    13.
    发明申请
    PRINTED CIRCUIT BOARD 有权
    印刷电路板

    公开(公告)号:US20130279135A1

    公开(公告)日:2013-10-24

    申请号:US13863631

    申请日:2013-04-16

    Inventor: Hiroshi Isono

    Abstract: A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path from a signal terminal on an inner circumference side of the first semiconductor package via a via hole and the second surface layer to a signal terminal on an outer circumference side of the second semiconductor package and a second bus wiring path from a signal terminal on an outer circumference side of the first semiconductor package via the second surface layer and a via hole to a signal terminal on an inner circumference side of the second semiconductor package are provided, thus securing a return current path for a signal current and realizing a high density wiring while suppressing radiation noise.

    Abstract translation: 印刷电路板包括印刷线路板的第一表面层上的第一半导体封装和第二表面层上的第二半导体封装,其中总线信号从第一半导体封装传输到第二半导体封装。 从第一半导体封装的内周侧的信号端子经由通孔和第二表面层到第二半导体封装的外周侧的信号端子的第一总线布线路径和从第二总线布线路径 提供经由第二表面层的第一半导体封装的外周侧的信号端子和到第二半导体封装的内周侧的信号端子的通孔,从而确保用于信号电流的返回电流路径并实现 高密度布线,同时抑制辐射噪声。

    Printed circuit board
    14.
    发明公开
    Printed circuit board 审中-公开
    印刷电路板

    公开(公告)号:EP2654387A3

    公开(公告)日:2017-07-19

    申请号:EP13162056.9

    申请日:2013-04-03

    Inventor: Isono, Hiroshi

    Abstract: A printed circuit board includes a first semiconductor package (1) on a first surface layer (102) of a printed wiring board (101) and a second semiconductor package (2) on a second surface layer (103) where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path (17) from a signal terminal (12) on an inner circumference side of the first semiconductor package via a via hole (16) and the second surface layer to a signal terminal (14) on an outer circumference side of the second semiconductor package and a second bus wiring path (18) from a signal terminal (13) on an outer circumference side of the first semiconductor package via the second surface layer and a via hole (19) to a signal terminal (15) on an inner circumference side of the second semiconductor package are provided, thus securing a return current path and realizing a high density wiring while suppressing radiation noise.

    Abstract translation: 印刷电路板包括在印刷线路板(101)的第一表面层(102)上的第一半导体封装件(1)和在其中传输总线信号的第二表面层(103)上的第二半导体封装件(2) 从第一半导体封装到第二半导体封装。 从第一半导体封装的内周侧上的信号端子(12)经由通孔(16)和第二表面层到第一半导体封装的外周侧上的信号端子(14)的第一总线布线路径(17) 所述第二半导体封装和第二总线布线路径从所述第一半导体封装的外周侧上的信号端子经由所述第二表面层和过孔从所述第二半导体封装的第一总线布线路径延伸到所述第一半导体封装上的信号端子; 设置第二半导体封装的内周侧,由此确保返回电流路径并实现高密度布线同时抑制辐射噪声。

    Printed circuit board
    15.
    发明公开
    Printed circuit board 审中-公开
    Leiterplatte

    公开(公告)号:EP2654387A2

    公开(公告)日:2013-10-23

    申请号:EP13162056.9

    申请日:2013-04-03

    Inventor: Isono, Hiroshi

    Abstract: A printed circuit board includes a first semiconductor package (1) on a first surface layer (102) of a printed wiring board (101) and a second semiconductor package (2) on a second surface layer (103) where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path (17) from a signal terminal (12) on an inner circumference side of the first semiconductor package via a via hole (16) and the second surface layer to a signal terminal (14) on an outer circumference side of the second semiconductor package and a second bus wiring path (18) from a signal terminal (13) on an outer circumference side of the first semiconductor package via the second surface layer and a via hole (19) to a signal terminal (15) on an inner circumference side of the second semiconductor package are provided, thus securing a return current path and realizing a high density wiring while suppressing radiation noise.

    Abstract translation: 印刷电路板包括位于印刷电路板(101)的第一表面层(102)上的第一半导体封装(1)和传输总线信号的第二表面层(103)上的第二半导体封装(2) 从第一个半导体封装到第二个半导体封装。 第一总线布线路径(17)从第一半导体封装的内周侧的信号端子(12)经由通孔(16)和第二表面层到信号端子(14)的外周侧 所述第二半导体封装和第二总线布线路径(18)从所述第一半导体封装的外周侧的信号端子(13)经由所述第二表面层和通孔(19)连接到信号端子(15)上 提供第二半导体封装的内周侧,从而确保返回电流路径并实现高密度布线,同时抑制辐射噪声。

    Printed circuit board
    18.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号:US09185804B2

    公开(公告)日:2015-11-10

    申请号:US13863631

    申请日:2013-04-16

    Inventor: Hiroshi Isono

    Abstract: A printed circuit board includes a first semiconductor package on a first surface layer of a printed wiring board and a second semiconductor package on a second surface layer where a bus signal is transmitted from the first to the second semiconductor package. A first bus wiring path from a signal terminal on an inner circumference side of the first semiconductor package via a via hole and the second surface layer to a signal terminal on an outer circumference side of the second semiconductor package and a second bus wiring path from a signal terminal on an outer circumference side of the first semiconductor package via the second surface layer and a via hole to a signal terminal on an inner circumference side of the second semiconductor package are provided, thus securing a return current path for a signal current and realizing a high density wiring while suppressing radiation noise.

    Abstract translation: 印刷电路板包括印刷线路板的第一表面层上的第一半导体封装和第二表面层上的第二半导体封装,其中总线信号从第一半导体封装传输到第二半导体封装。 从第一半导体封装的内周侧的信号端子经由通孔和第二表面层到第二半导体封装的外周侧的信号端子的第一总线布线路径和从第二总线布线路径 提供经由第二表面层的第一半导体封装的外周侧的信号端子和到第二半导体封装的内周侧的信号端子的通孔,从而确保用于信号电流的返回电流路径并实现 高密度布线,同时抑制辐射噪声。

Patent Agency Ranking