公开(公告)号：EP2913584A1

公开(公告)日：2015-09-02

申请号：EP13849558.5

申请日：2013-09-03

Applicant: Toshiba Lighting & Technology Corporation

Inventor： HINO, Kiyokazu ,  KURIHARA, Takahiro

IPC: F21V23/00 ,  H01L33/00 ,  H01R4/02

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: A light emitting device according to the present embodiment includes a substrate on which a wiring portion is provided; a light emitting element which is provided on the substrate and is electrically connected to the wiring portion; a feeding portion to which an electric power is supplied from the outside; a first connection portion which is provided on the substrate and is electrically connected to the wiring portion; a second connection portion which is joined to the first connection portion through soldering and includes a first opening portion into which the feeding portion is inserted; and a soldering portion which is provided between the first opening portion and the feeding portion.

Abstract translation: 根据本实施例的发光器件包括其上设置有布线部分的基板; 发光元件，设置在所述基板上并电连接到所述配线部分; 供电部分，从外部向其供应电力; 第一连接部分，其设置在基板上并电连接到布线部分; 第二连接部分，所述第二连接部分通过焊接接合到所述第一连接部分并且包括供所述供给部分插入其中的第一开口部分; 以及设置在第一开口部分和供给部分之间的焊接部分。

公开(公告)号：EP0083503A3

公开(公告)日：1986-11-20

申请号：EP82306966

申请日：1982-12-24

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. ,  Berg, James G.

IPC: H01R04/04

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H01L2924/00

Abstract: A sheet material for providing electrical connections is provided which gives the needed degree of stability and low resistance with simplicity of application. Electrically conducted elements are dispersed in a polymeric layer and an adhesive is provided which is either the material of the layer or a coating over the elements which adhesive is non-tacky at room temperature but softens upon heating while reverting to a nonflowable condition on cooling. The electrically conductive elements can protrude above the surface of the polymer in which they are embedded. Electrically conductive layers can be provided over portions of the sheet with the polymeric layer containing electrically conductive elements extending over the whole of the sheet or over only those portions having electrically conductive lower layers.

公开(公告)号：EP2256801A3

公开(公告)日：2011-02-09

申请号：EP10003118.6

申请日：2010-03-24

Applicant: Semikron Elektronik GmbH & Co. KG Patentabteilung

Inventor： Mauer, Peter

IPC: H01L23/48 ,  H05K3/32

CPC classification number: H05K3/4015 ,  H01L23/48 ,  H01L2924/0002 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09745 ,  H05K2201/1025 ,  H01L2924/00

Abstract: Es wird eine Kontakteinrichtung für ein Leistungshalbleitermodul beschrieben, die ein federndes Kontaktelement mit einem Kontaktierungs-Endabschnitt (18) aufweist, der zur Kontaktierung mit einem Anschlusselement (14) eines ebenen Schaltungsträgers (12) des Leistungshalbleitermoduls vorgesehen ist. Der Kontaktierungs-Endabschnitt (18) ist geradlinig stiftförmig ausgebildet und das Anschlusselement (14) weist ein Chipbauteil (10) auf, das mit einer Zentriervertiefung (16) für den Kontaktierungs-Endabschnitt (18) des federnden Kontaktelementes ausgebildet ist.

公开(公告)号：EP1511367A2

公开(公告)日：2005-03-02

申请号：EP04254904.8

申请日：2004-08-16

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Mashino, Naohiro, c/o Shinko Electric Ind. Co. Ltd

IPC: H05K3/42 ,  H05K3/22 ,  H05K3/46

CPC classification number: H05K3/22 ,  H01L2924/0002 ,  H05K3/102 ,  H05K3/423 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1025 ,  H05K2203/107 ,  H05K2203/128 ,  H01L2924/00

Abstract: A process for manufacturing a wiring board comprising a substrate (10) made of an insulation material and having first and second surfaces, first and second conductor patterns formed on the first and second surfaces, respectively, and a via conductor penetrating the substrate to electrically connect the first conductor pattern with the second conductor pattern; the process comprising the following steps of: forming the substrate (10) with a through-hole (12) penetrating thereto and defining openings at the first and second surfaces, respectively; plating the substrate with a metal so that a metal layer (16) having a predetermined thickness is formed on the respective first and second surfaces of the substrate and the through-hole (12) is substantially filled with the metal to be the via conductor; irradiating a laser beam, as a plurality of spots; around a metal-less portion of the plated metal (16), such as a dimple or seam (20), at positions corresponding to the openings of the through-hole (12), so that a part of the plated metal (16) melts to fill the metal-less portion (20) with the molten metal (16). A filler of metal (26) or metal powder may also be provided and melted in to the metal-less portion (20) by the laser beam.

Abstract translation: 一种布线基板的制造方法，其特征在于，包括：由绝缘材料构成的基板（10），该基板具有第一面和第二面，分别形成在所述第一面和第二面上的第一导体图案和第二导体图案以及贯通所述基板而电连接的通孔导体 具有第二导体图案的第一导体图案; 该方法包括以下步骤：形成具有穿透其中的通孔（12）并分别在第一和第二表面处限定开口的衬底（10） 用金属镀覆衬底，使得在衬底的相应第一和第二表面上形成具有预定厚度的金属层（16），并且通孔（12）基本上填充有待成为通孔导体的金属; 照射激光束作为多个点; 在与通孔（12）的开口相对应的位置处围绕电镀金属（16）的无金属部分（诸如凹痕或接缝（20）），从而电镀金属（16）的一部分 熔化以用熔融金属（16）填充无金属部分（20）。 金属（26）或金属粉末的填料也可以通过激光束被提供并熔化到无金属部分（20）中。

公开(公告)号：JP2014086401A

公开(公告)日：2014-05-12

申请号：JP2012237204

申请日：2012-10-26

Applicant: Toshiba Lighting & Technology Corp ,  東芝ライテック株式会社

Inventor： HINO KIYOKAZU ,  KURIHARA TAKAHIRO

IPC: H01R4/02 ,  H01L33/00

CPC classification number: F21V23/002 ,  F21S43/195 ,  F21S43/37 ,  F21S45/50 ,  F21S48/212 ,  F21S48/232 ,  F21S48/33 ,  F21V19/0025 ,  F21V19/003 ,  F21V19/005 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21Y2101/00 ,  F21Y2105/00 ,  F21Y2115/10 ,  F21Y2115/15 ,  F21Y2115/30 ,  H01R12/58 ,  H01R43/0256 ,  H05K3/306 ,  H05K3/3447 ,  H05K2201/10106 ,  H05K2201/1025 ,  H05K2201/1031 ,  H05K2201/10401 ,  Y02P70/611

Abstract: PROBLEM TO BE SOLVED: To provide a light-emitting device capable of improving the reliability of a solder joint at a connection portion jointing a feeding section.SOLUTION: A light-emitting device includes: a substrate having a wiring section; a light-emitting element that is mounted on the substrate and electrically connected with the wiring section; a feeding section powered from the outside; a first connection section that is mounted on the substrate and electrically connected with the wiring section; a second connection section that is solder-jointed to the first connection section and has a first opening section for inserting the feeding section; and a solder section formed between the first opening section and the feeding section.

Abstract translation: 要解决的问题：提供一种能够提高接合供电部的连接部处的焊点的可靠性的发光装置。解决方案：发光装置包括：具有布线部的基板; 发光元件，其安装在所述基板上并与所述布线部电连接; 从外部供电的喂食部分; 第一连接部，安装在所述基板上并与所述布线部电连接; 第二连接部，其与所述第一连接部焊接接合，并具有用于插入所述供给部的第一开口部; 以及在所述第一开口部和所述供给部之间形成的焊料部。

公开(公告)号：JP2009049248A

公开(公告)日：2009-03-05

申请号：JP2007215189

申请日：2007-08-21

Applicant: Spansion Llc ,  スパンション エルエルシー

Inventor： TANAKA JUNJI ,  HARAYAMA MASAHIKO ,  ONODERA MASANORI

IPC: H01L21/60

CPC classification number: H05K3/38 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85201 ,  H01L2225/06568 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/20752 ,  H05K2201/094 ,  H05K2201/09472 ,  H05K2201/1025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving connection reliability of a solder bump; and its manufacturing method. SOLUTION: This semiconductor device 100 is characterized by comprising: a semiconductor chip 32; a plurality of solder bumps electrically connecting the semiconductor chip 32 to the outside; and metal bumps 20 formed on surfaces of first solder bumps 10 being at least a part of the plurality of solder bumps, and formed of a metal having a melting point higher than that of the first solder bump 10. The metal bumps 20 become cores in melting the first solder bumps 10, whereby wettability of the first solder bumps 10 is improved. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供能够提高焊料凸块的连接可靠性的半导体器件; 及其制造方法。 解决方案：该半导体器件100的特征在于包括：半导体芯片32; 将半导体芯片32电连接到外部的多个焊料凸块; 并且形成在第一焊料凸块10的表面上的金属凸块20是至少一部分多个焊料凸块，并由熔点高于第一焊料凸块10的金属形成。金属凸块20变成芯 熔化第一焊料凸块10，从而提高第一焊料凸块10的润湿性。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：EP0297511B1

公开(公告)日：2003-10-08

申请号：EP88110305.5

申请日：1988-06-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LIMITED

Inventor： Sasame, Akira c/o Itami Works of Sumitomo ,  Sakanoue, Hitoyuki c/o Itami works of Sumitomo ,  Tekeuchi, Hisao c/o Itami works of Sumitomo ,  Miyake, Masaya c/o Itami works of Sumitomo ,  Yamakawa, Akira c/o Itami works of Sumitomo ,  Yushio, Yasuhisa c/o Itami works of Sumitomo ,  Akazawa, Hitoshi c/o Itami works of Sumitomo

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/14 ,  H01L23/08 ,  H01L23/10

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  Y10T428/12576 ,  H01L2224/45099 ,  H01L2924/00

公开(公告)号：EP0297511A2

公开(公告)日：1989-01-04

申请号：EP88110305.5

申请日：1988-06-28

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LIMITED

Inventor： Sasame, Akira c/o Itami Works of Sumitomo ,  Sakanoue, Hitoyuki c/o Itami works of Sumitomo ,  Tekeuchi, Hisao c/o Itami works of Sumitomo ,  Miyake, Masaya c/o Itami works of Sumitomo ,  Yamakawa, Akira c/o Itami works of Sumitomo ,  Yushio, Yasuhisa c/o Itami works of Sumitomo ,  Akazawa, Hitoshi c/o Itami works of Sumitomo

IPC: H01L23/50 ,  H01L21/48 ,  H01L23/14 ,  H01L23/08 ,  H01L23/10

CPC classification number: H05K3/3405 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49582 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/12042 ,  H05K1/0306 ,  H05K3/246 ,  H05K3/3421 ,  H05K2201/0347 ,  H05K2201/1025 ,  H05K2201/1034 ,  H05K2201/10909 ,  H05K2201/10916 ,  Y10T428/12576 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A connection structure between lead frames (3) and a base plate (1) of aluminum nitride, to be applied as a connection structure between components of a semiconductor apparatus, comprises the base plate formed of a sintered body of aluminum nitride on which a semiconductor device is to be mounted, the lead frames including, as a main material, iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and silver solder (9) for joining the base plate and the lead frames. A surface of the lead frame to be joined to the base plate is formed of oxygen-free copper of a high plastic deformativity to relieve, by plastic deformation of itself, a thermal stress caused by a difference between a thermal expansion coefficient of the base plate and that of the lead frame in a cooling process at the time of soldering. Preferably, only a portion of each lead frame (3) to be joined to the base plate comprises an inner layer portion of iron alloy containing nickel in 29 wt.% and cobalt in 17 wt.%, and an outer layer portion of oxygen-free copper.

Abstract translation: 引线框架（3）和氮化铝的基板（1）之间的连接结构将被用作半导体装置的部件之间的连接结构，包括由氮化铝烧结体形成的基板，其上形成半导体 要安装的装置，引线框架包括作为主要材料的含有29重量％的镍和17重量％的钴的铁合金和用于连接基板和引线框架的银焊料（9）。 要连接到基板的引线框架的表面由具有高塑性变形性的无氧铜形成，以通过其自身的塑性变形来释放由基板的热膨胀系数之间的差异引起的热应力 以及在焊接时的冷却过程中的引线框架。 优选地，仅接合到基板的每个引线框架（3）的一部分包括含有29重量％的镍和17重量％的钴的铁合金的内层部分， 免费铜。

公开(公告)号：EP0083503A2

公开(公告)日：1983-07-13

申请号：EP82306966.1

申请日：1982-12-24

Applicant: MINNESOTA MINING AND MANUFACTURING COMPANY

Inventor： Reylek, Robert S. ,  Berg, James G.

IPC: H01R4/04

CPC classification number: H05K3/323 ,  H01L2924/0002 ,  H01R4/04 ,  H05K3/361 ,  H05K2201/09945 ,  H05K2201/1025 ,  H05K2203/1189 ,  H01L2924/00

Abstract: A sheet material for providing electrical connections is provided which gives the needed degree of stability and low resistance with simplicity of application. Electrically conducted elements are dispersed in a polymeric layer and an adhesive is provided which is either the material of the layer or a coating over the elements which adhesive is non-tacky at room temperature but softens upon heating while reverting to a nonflowable condition on cooling. The electrically conductive elements can protrude above the surface of the polymer in which they are embedded. Electrically conductive layers can be provided over portions of the sheet with the polymeric layer containing electrically conductive elements extending over the whole of the sheet or over only those portions having electrically conductive lower layers.

Abstract translation: 提供一种用于提供电连接的片材，其提供了所需的稳定性和低电阻，并且应用简单。 电导体元件分散在聚合物层中，并且提供粘合剂，其是层的材料或元件上的涂层，所述粘合剂在室温下是非粘性的，但在加热时软化，同时在冷却时还原为不可流动的状态。 导电元件可以突出在其嵌入其中的聚合物的表面之上。 可以在片材的一部分上提供导电层，聚合物层包含在整个片材上延伸的导电元件，或仅在具有导电下层的那些部分上。

公开(公告)号：US08878072B2

公开(公告)日：2014-11-04

申请号：US13527180

申请日：2012-06-19

Applicant: Stephen Gonya ,  Jim Patterson ,  Kenn Twigg

Inventor： Stephen Gonya ,  Jim Patterson ,  Kenn Twigg

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: H05K3/0061 ,  H05K2201/1025

Abstract: A method for forming a frame attachment interconnect between a substrate and a frame is disclosed. The method can include applying a composite material (e.g., epoxy-glass prepreg) to a surface of a substrate. The composite material can have one or more holes disposed to substantially align with a corresponding pad on the surface of the substrate. A metal disc is placed in each hole of the composite material on top of the corresponding pad. A frame member can be placed on top of the composite material and the metal discs. The frame member can have one or more pads disposed to substantially align with the metal discs. The substrate, composite material, metal discs and frame combination can be cured in a controlled atmosphere that can include a vacuum and a predetermined temperature to create discrete electrical connections between adjacent pads but with each encapsulated and electrically isolated.

Abstract translation: 公开了一种用于在基板和框架之间形成框架安装互连的方法。 该方法可以包括将复合材料（例如，环氧玻璃预浸料坯）施加到基材的表面。 复合材料可以具有一个或多个孔，其设置成基本上与衬底的表面上的相应衬垫对准。 金属盘被放置在复合材料的每个孔中，在相应的垫的顶部。 框架构件可以放置在复合材料和金属盘的顶部上。 框架构件可以具有设置成基本上与金属盘对准的一个或多个垫。 衬底，复合材料，金属盘和框架组合可以在可包括真空和预定温度的受控气氛中固化，以在相邻焊盘之间形成离散的电连接，但是每个密封和电隔离。