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    METHOD FOR IMPROVING THE POLYSILICON STRUCTURES OF A MEMS DEVICE BY MASKING TO INHIBIT ANODIC ETCHING OF THE MEMS POLYSILICON STRUCTURES
    192.
    发明申请
    METHOD FOR IMPROVING THE POLYSILICON STRUCTURES OF A MEMS DEVICE BY MASKING TO INHIBIT ANODIC ETCHING OF THE MEMS POLYSILICON STRUCTURES 审中-公开
    通过掩蔽抑制MEMS多晶硅结构的阳极蚀刻来改善MEMS器件的多晶硅结构的方法

    公开(公告)号：WO02048023A2

    公开(公告)日：2002-06-20

    申请号：PCT/US2001/051334

    申请日：2001-10-25

    IPC: B81C1/00 ,  B81B7/00

    CPC classification number: B81C1/00801 ,  B81C2201/0133 ,  B81C2201/016

    Abstract: A method is provided for fabricating a MEMS device on a workpiece by forming a mercaptain mask (306) on a gold structure (309). The mask (306) is used to inhibit anodic etching of polysilicon structures (303) during the acid etch process that is used to remove the oxide dielectric layer from the workpiece to expose the polysilicon structures of the MEMS device (303) to allow their movement. The mercaptain can be utilised to adhere to the exposed gold surface (309) to form a self-mask (306) on the gold surface (309). As such, a workpiece having numerous gold surfaces, such as numerous optomechanical switches, each having various types of gold structures, can be placed in a mercaptain solution. The mercaptain selectively coats the gold surfaces to form self-adhering mercaptain masks on all the exposed gold surfaces.

    Abstract translation: 提供了一种通过在金结构（309）上形成巯基掩模（306）来在工件上制造MEMS器件的方法。 掩模（306）用于在酸蚀刻工艺期间抑制多晶硅结构（303）的阳极蚀刻，所述酸蚀刻工艺用于从工件去除氧化物介电层以暴露MEMS器件（303）的多晶硅结构以允许其移动 。 可以使用巯基粘附到暴露的金表面（309）以在金表面（309）上形成自掩模（306）。 因此，可以将具有多个金表面的工件，例如各种具有各种类型的金结构的多个光学机械开关放置在巯基溶液中。 巯基选择性地涂覆金表面以在所有暴露的金表面上形成自粘的巯基掩模。

    MERGED-MASK MICRO-MACHINING PROCESS
    193.
    发明申请
    MERGED-MASK MICRO-MACHINING PROCESS 审中-公开
    合成掩模微加工工艺

    公开(公告)号：WO01004638A1

    公开(公告)日：2001-01-18

    申请号：PCT/US2000/019127

    申请日：2000-07-13

    IPC: G02B26/10 ,  B81B3/00 ,  B81C1/00 ,  C23F1/02 ,  G01P9/04 ,  G02B26/08 ,  G03F7/20 ,  C23F1/00 ,  G01P15/135 ,  G02B26/00 ,  G03F7/26

    CPC classification number: G02B26/0816 ,  B81B2201/042 ,  B81C1/00396 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2203/0109 ,  C23F1/02

    Abstract: The present invention provides merged-mask processes for fabricating micro-machined devices in general and mirrored assemblies for use in optical scanning devices in particular. The process includes (a) providing a substrate having a predetermined thickness; (b) applying a first masking layer on a first portion of the substrate and a second masking layer on a second portion of the substrate, said second masking layer being at least as thick as the first masking layer; (c) etching a portion of the second masking layer to provide a first exposed portion of the substrate; (d) etching the first exposed portion of the substrate to a first depth; (e) etching the second masking layer to provide a second exposed portion of the substrate; and (f) etching simultaneously the first exposed portion of the substrate to a second depth and the second exposed portion of the substrate to a first depth. The process further comprises patterning the first masking layer before applying the second masking layer to provide the second portion of the substrate for etching and etching the first masking layer to expose the second portion of the substrate. The first and second masking layers are applied prior to etching the substrate.

    Abstract translation: 本发明提供了用于一般地制造微加工装置和特别是用于光学扫描装置的镜面组件的合并掩模工艺。 该方法包括（a）提供具有预定厚度的基底; （b）在衬底的第一部分上施加第一掩模层和在衬底的第二部分上施加第二掩模层，所述第二掩模层至少与第一掩模层一样厚; （c）蚀刻第二掩模层的一部分以提供衬底的第一暴露部分; （d）将衬底的第一暴露部分蚀刻到第一深度; （e）蚀刻第二掩模层以提供衬底的第二暴露部分; 和（f）同时将衬底的第一暴露部分蚀刻到第二深度，将衬底的第二暴露部分蚀刻到第一深度。 该方法还包括在施加第二掩模层之前图案化第一掩模层以提供用于蚀刻和蚀刻第一掩模层的衬底的第二部分以暴露衬底的第二部分。 在蚀刻基板之前施加第一和第二掩模层。

    KR20210027419A - Method for manufacturing microstructures
    194.
    发明专利
    KR20210027419A - Method for manufacturing microstructures 审中-公开

    公开(公告)号：KR20210027419A

    公开(公告)日：2021-03-10

    申请号：KR1020217002984A

    申请日：2019-07-31

    Applicant: 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트

    Inventor： 로만 오슈트홀트 ,  노르베르트 암브로지우스

    IPC: B81C1/00

    CPC classification number: B81C1/00158 ,  B81C2201/0133 ,  B81C2201/0143

    Abstract: 본 발명에 따르는 방법은 멤브레인 (2) 을 포함하는 기판 (1) 내에 미세 구조물을 제조하는 것에 관한 것이다. 멤브레인 (2) 은 에칭 방법에 의해 야기되는 재료 약화 및 기판 내에 리세스 (3) 를 생성하기 위한 재료 제거에 의하여 생성된다. 이를 위해 제 1 방법 단계에서 유리로 구성된 기판 (1) 내에는 레이저 방사선을 이용하여 둘레 윤곽 (5) 을 따라 개질부들 (4) 이 기판 (1) 내에 도입된다. 이와 같이 개질된 기판 (1) 상에는 제 1 단계에서 습식 화학 에칭조에 대하여 비저항성인 희생층 (6) 이 적용되고 그 위에 에칭 매질에 대해 저항성인 멤브레인층 (7) 이 적용된다. 이후, 추가적으로 도시되지 않은 에칭 매질에 의한 에칭 부식이 수행된다. 이때 에칭 부식은 둘레 윤곽 (5) 을 따라서 기판 재료의 선형, 그루브형 제거를 야기한다. 희생층 (6) 에 도달한 이후, 희생층은 둘레 윤곽 (5) 에 상응하여 횡방향으로 붕해된다. 이를 통해 둘레 윤곽 (5) 에 의하여 에워싸이는 영역은 점착성 또는 결합성을 상실하고 기판 (1) 으로부터 부분적으로 분리될 수 있다.

    Actuator, optical scanner, and image forming apparatus
    197.
    发明专利
    Actuator, optical scanner, and image forming apparatus 有权
    执行器，光学扫描仪和图像形成装置

    公开(公告)号：JP2012218098A

    公开(公告)日：2012-11-12

    申请号：JP2011084839

    申请日：2011-04-06

    Applicant: Seiko Epson Corp ,  セイコーエプソン株式会社

    Inventor： HINO MAKIKO ,  MIZOGUCHI YASUSHI

    IPC: B81B3/00 ,  G02B26/08 ,  G02B26/10

    CPC classification number: G02B26/085 ,  B81B2201/042 ,  B81B2203/058 ,  B81C1/00626 ,  B81C2201/0133

    Abstract: PROBLEM TO BE SOLVED: To provide an actuator, an optical scanner, and an image forming apparatus capable of decreasing a moment of inertia when a movable portion is swung by further decreasing variations in the shape of the movable portion during manufacturing as compared with a prior art.SOLUTION: The optical scanner 1 includes a light reflection portion 211 having light reflection characteristics, a plate-like movable portion 21 having the light reflection portion 211 and swingable around the swing center axis, connection portions 23 and 24 connected to the movable portion 21 and twisted accompanied by the swing of the movable portion 21, and a support portion 22 for supporting the connection portions 23 and 24. The movable portion 21 is formed into a shape (cross shape) where four corners of a square are notched to be rectangular when seen from a plane in the plate thickness direction of the movable portion 21. A section perpendicular to the swing center axis of the connection portions 23 and 24 is formed into a shape where a width increases and decreases from the first surface of the movable portion 21 to a second surface facing the first surface.

    Abstract translation: 要解决的问题：提供一种致动器，光学扫描器和图像形成装置，其能够通过在制造期间进一步减小可动部分的形状的变化而使可动部分摆动时减小转动惯量，相比之下 与现有技术 解决方案：光学扫描仪1包括具有光反射特性的光反射部分211，具有光反射部分211并围绕摆动中心轴线摆动的板状可动部分21，连接到可移动的连接部分23和24 部分21并且伴随着可动部分21的摆动而扭转，以及用于支撑连接部分23和24的支撑部分22.可动部分21形成为正方形的四个角被切口的形状（十字形） 从可动部21的板厚方向的平面观察时为矩形。与连接部23,24的摆动中心轴垂直的部分形成为宽度从第一面的宽度增大和减小的形状 可移动部分21到面对第一表面的第二表面。 版权所有（C）2013，JPO＆INPIT

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