公开(公告)号：US5769996A

公开(公告)日：1998-06-23

申请号：US464733

申请日：1995-06-29

Applicant: Ciaran Bernard McArdle ,  Joseph Burke

Inventor： Ciaran Bernard McArdle ,  Joseph Burke

IPC: H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  B32B31/20

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01R4/04 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347

Abstract: The invention provides a composition comprising: (i) a ferrofluid comprising a colloidal suspension of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles are described. Application of a substantially uniform magnetic field by magnet means to the composition causes the electrically-conductive particles to form a regular pattern. The composition is used for providing anisotropic conductive pathways between two sets of conductors in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

Abstract translation: PCT No.PCT / IE95 / 00009 Sec。 371日期：1995年6月29日 102（e）1995年6月29日PCT PCT 1995年1月26日PCT公布。 公开号WO95 / 20820 PCT 日期1995年8月3日本发明提供一种组合物，其包含：（i）包含非磁性载体液体中的铁磁颗粒的胶态悬浮液的铁磁流体，和（ii）具有基本均匀尺寸和形状的多个导电颗粒， 分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒。 通过磁体将施加大致均匀的磁场的组合物导致导电颗粒形成规则图案。 该组合物用于在电子工业中的两组导体之间提供各向异性导电通路。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：US5710612A

公开(公告)日：1998-01-20

申请号：US851659

申请日：1992-03-16

Applicant: Akira Mase

Inventor： Akira Mase

IPC: G02F1/13 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36 ,  G02F1/1345 ,  G02F1/1333

CPC classification number: G02F1/13452 ,  H01R4/04 ,  H05K3/323 ,  H05K3/361 ,  G02F2203/69 ,  H05K1/0306 ,  H05K1/148 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/0272 ,  H05K2201/0326 ,  H05K2201/2036 ,  H05K3/368

Abstract: A liquid crystal device and a manufacturing method thereof are described. The device comprises a liquid crystal panel and an auxiliary panel formed with an IC circuit for supplying driving signals to the liquid crystal device. The auxiliary substrate is separately provided with the circuit and the function thereof is tested in advance of the assembling with the liquid crystal panel. By this procedure, the yield is substantially improved.

Abstract translation: 对液晶装置及其制造方法进行说明。 该装置包括液晶面板和形成有用于向液晶装置提供驱动信号的IC电路的辅助面板。 辅助基板分别设置有电路，其功能在与液晶面板的组装之前进行测试。 通过该程序，产率大大提高。

公开(公告)号：US5679928A

公开(公告)日：1997-10-21

申请号：US403779

申请日：1995-03-24

Applicant: Akihiko Okano ,  Terutaka Okano

Inventor： Akihiko Okano ,  Terutaka Okano

IPC: H01R43/02 ,  G02F1/13 ,  H01R4/04 ,  H01R11/01 ,  H01R43/00 ,  H05K3/32 ,  H05K3/36 ,  H05K1/02

CPC classification number: H01R4/04 ,  H05K3/323 ,  G02F1/13452 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2203/0425 ,  H05K3/361 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A connection terminal portion of a substrate and a terminal portion of an external circuit substrate or a terminal portion of a part are electrically connected together using an anisotropic electrically conducting film. A structure in which a first substrate having a connection terminal portion and a second substrate having a connection terminal portion or a connection terminal portion of a part are connected together with an anisotropic electrically conducting adhesive containing electrically conducting particles, wherein the thickness of the electrically conducting film provided for the connection terminal of the first substrate, the second substrate or the part is smaller than the diameter of the electrically conducting particles. The invention is further concerned with a method of accomplishing the electrical connection.

Abstract translation: PCT No.PCT / JP94 / 01240 Sec。 371日期：1995年3月24日 102（e）1995年3月24日PCT PCT 1994年7月27日PCT公布。 公开号WO95 / 04387 日期1995年2月9日使用各向异性导电膜将基板的连接端子部分和外部电路基板的端子部分或部分的端子部分电连接在一起。 一种结构，其中具有连接端子部分的第一基板和具有连接端子部分或部分的连接端子部分的第二基板与包含导电颗粒的各向异性导电粘合剂连接在一起，其中导电 提供给第一基板，第二基板或部分的连接端子的薄膜小于导电颗粒的直径。 本发明还涉及一种完成电连接的方法。

公开(公告)号：US5180888A

公开(公告)日：1993-01-19

申请号：US713822

申请日：1991-06-12

Applicant: Kazuhiro Sugiyama ,  Yoshinori Atsumi

Inventor： Kazuhiro Sugiyama ,  Yoshinori Atsumi

IPC: G02F1/13 ,  G02F1/1339 ,  G02F1/1345 ,  H01R4/04 ,  H05K3/32 ,  H05K3/36

CPC classification number: H01R4/04 ,  G02F1/1345 ,  H05K3/323 ,  G02F1/1339 ,  G02F1/13452 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/0224 ,  H05K2201/0233 ,  H05K2201/09036 ,  H05K2201/10681 ,  H05K3/361

Abstract: In a conductive connecting structure for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch, a conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness.

Abstract translation: 在用于电连接具有以小间距布置的多个连接端子的第一和第二电子部件的导电连接结构中，在第一和第二电子部件的多个连接端子之间插入导电粘接剂。 通过在绝缘粘合剂中混合多个细连接颗粒来制备导电剂。 每个细连接颗粒被设计成使得在其表面上形成有镀层的细导电颗粒或细绝缘颗粒被由热压接合断裂的材料构成的绝缘层覆盖。 当导电粘合剂在第一和第二电子部件的连接端子之间经受热压接时，由各个精细连接端子推动的细连接颗粒的部分被破坏。 然而，平面方向上的细连接颗粒的绝缘层不会断裂并保持原样。 在该导电连接结构中，即使细连接粒子的比例增加，相邻的细连接粒子彼此接触，也可以在平面方向上保持绝缘性，而仅在厚度方向上获得传导 。

公开(公告)号：EP3086411A4

公开(公告)日：2017-12-20

申请号：EP14871737

申请日：2014-12-10

Applicant: DEXERIALS CORP

Inventor： YAMADA YASUNOBU ,  SEKIGUCHI MORIO ,  KUMAKURA SUSUMU

IPC: H01R11/01 ,  H01R43/00

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf / mm 2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6 ‰¦ B / A ‰¦ 1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100°C; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

公开(公告)号：EP3121237A1

公开(公告)日：2017-01-25

申请号：EP15764663.9

申请日：2015-02-13

Applicant: Dexerials Corporation

Inventor： NAMIKI, Hidetsugu ,  KANISAWA, Shiyuki ,  ISHIGAMI, Akira ,  AOKI, Masaharu

IPC: C09J201/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/00 ,  H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34

CPC classification number: C09J9/02 ,  C08K3/22 ,  C08K7/16 ,  C08K9/02 ,  C08K2003/0806 ,  C08K2003/2241 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/005 ,  C09J11/04 ,  C09J163/00 ,  C09J201/00 ,  H01B1/22 ,  H01L24/29 ,  H01L24/81 ,  H01L24/83 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/81203 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K3/323 ,  H05K2201/0221 ,  H05K2201/0272 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/05341 ,  H01L2924/05432

Abstract: Provided is an anisotropic conductive adhesive in which excellent optical characteristics and heat dissipation characteristics are obtainable. The anisotropic conductive adhesive contains conductive particles (31) each comprising a metal layer having Ag as a primary constituent formed on an outermost surface of a resin particle, solder particles (32) having a smaller average particle diameter than the conductive particles, reflective insulating particles having a smaller average particle diameter than the solder particles and a binder into which the conductive particles (31) solder particles (32) and reflective insulating particles are dispersed. The conductive particles and the reflective insulating particles efficiently reflect light, thereby improving light-extraction efficiency of an LED mounting body. Additionally, inter-terminal solder bonding of the solder particles (32) during compression bonding increases contact area between opposing terminals, thereby enabling achievement of high heat dissipation characteristics.

Abstract translation: 提供可获得优异的光学特性和散热特性的各向异性导电粘合剂。 各向异性导电粘合剂含有导电粒子（31），每个导电粒子包含在树脂粒子的最表面上形成的Ag作为主要成分的金属层，平均粒径小于导电粒子的焊料粒子（32），反射绝缘粒子 具有比焊料颗粒更小的平均粒径和分散导电粒子（31）焊料颗粒（32）和反射绝缘颗粒的粘合剂。 导电颗粒和反射绝缘颗粒有效地反射光，从而提高LED安装体的光提取效率。 此外，焊接粒子（32）在压接期间的端子间焊接增加了相对端子之间的接触面积，从而能够实现高的散热特性。

公开(公告)号：EP3086411A1

公开(公告)日：2016-10-26

申请号：EP14871737.4

申请日：2014-12-10

Applicant: Dexerials Corporation

Inventor： YAMADA, Yasunobu ,  SEKIGUCHI, Morio ,  KUMAKURA, Susumu

IPC: H01R11/01 ,  H01R43/00

CPC classification number: H05K3/225 ,  H05K1/0353 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/0133 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2203/176

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf / mm 2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6 ≦ B / A ≦ 1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100°C; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract translation: 一种安装体的制造方法，包括：安装步骤，通过包含具有环氧树脂作为主要成分的粘合剂的各向异性导电膜和压缩硬度（K）为500kgf的导电颗粒将电子部件安装到布线板上 压缩变形10％以上时，粘合剂的厚度（A）与平均粒径（B）之间的关系为0.6‰| B / A‰| 1.5，粘合剂的弹性模量为 在100℃下固化为50MPa或更高; 以及在安装安装步骤时发生问题的情况下机械剥离以拆卸电子部件和布线板的重新安装步骤，并重新使用布线板以进行安装步骤。

公开(公告)号：EP2792721A1

公开(公告)日：2014-10-22

申请号：EP12857139.5

申请日：2012-12-10

Applicant: Dexerials Corporation

Inventor： ODAKA, Ryosuke ,  SATO, Daisuke

IPC: C09J4/02 ,  C09J5/06 ,  C09J163/10 ,  H05K1/14 ,  H01R11/01 ,  H01R43/00

CPC classification number: C09J4/00 ,  C08F220/32 ,  C09J4/06 ,  C09J163/10 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent comprising a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

Abstract translation: 提供一种能够对已经施加了前路处理的基板提供足够的电连续性的粘合剂和用于连接电子部件的方法。 使用包含一分子中具有环氧基的（甲基）丙烯酸酯和1分钟半衰期为110℃以上的自由基聚合引发剂的粘合剂。 端子之间的剩余粘合剂组分流动，由此从外表面除去预流中的咪唑组分，与含环氧基丙烯酸酯的环氧基结合的组分。

公开(公告)号：EP2057006B1

公开(公告)日：2014-02-12

申请号：EP06844998.2

申请日：2006-12-08

Applicant: Trillion Science, Inc.

Inventor： LIANG, Rong-chang ,  HO, Shih-wei ,  LIU, Eric, H. ,  XU, Qianfei

IPC: H05K3/32 ,  B32B27/00 ,  H01B1/22 ,  H01B1/24 ,  H01R13/24

CPC classification number: H05K3/323 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01R13/2414 ,  H05K2201/0221 ,  H05K2201/10378 ,  H05K2203/0113 ,  H05K2203/0338 ,  Y10T428/24612 ,  Y10T428/2462 ,  H01L2924/00

公开(公告)号：EP2495732A2

公开(公告)日：2012-09-05

申请号：EP12003885.6

申请日：2001-04-27

Applicant: Sekisui Chemical Co., Ltd.

Inventor： Kuroda, Hiroshi ,  Okinaga, Nobuyuki

IPC: H01B5/00 ,  H01B5/16 ,  C08J7/06 ,  H01R11/01 ,  H05K1/09 ,  H05K3/32 ,  H01L21/60 ,  H01L21/311 ,  C25D7/12 ,  H05K3/34

CPC classification number: H01R4/00 ,  H01R4/02 ,  H01R4/04 ,  H01R13/035 ,  H05K3/321 ,  H05K3/3436 ,  H05K3/3473 ,  H05K3/3484 ,  H05K2201/0212 ,  H05K2201/0221 ,  H05K2201/068 ,  H05K2203/0425 ,  Y02P70/613 ,  Y10T428/12181 ,  Y10T428/2991

Abstract: This invention provides a conductive fine particle for soldering two or more electrodes of an electric circuit, the conductive fine particle having an ability of relaxing the force applied to a circuit of a substrate or the like.
A conductive fine particle, comprising a core fine particle made of resin with its surface covered with at least one metal layer, wherein the resin has a coefficient of linear expansion of from 3 × 10 -5 to 7 × 10 -5 (1/K).

Abstract translation: 本发明提供一种用于焊接电路的两个或更多个电极的导电细颗粒，导电细颗粒具有放松施加到基板的电路等的力的能力。 一种导电性细颗粒，其包含由表面被至少一个金属层覆盖的树脂制成的核心微粒，其中所述树脂的线性膨胀系数为3×10 -5至7×10 -5（1 / K ）。