公开(公告)号：US09883578B1

公开(公告)日：2018-01-30

申请号：US15386234

申请日：2016-12-21

Applicant: Deere & Company

Inventor： Thomas J. Roan ,  Brij N. Singh

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/06 ,  H05K2201/064 ,  H05K2201/09036

Abstract: An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.

公开(公告)号：US20170273217A1

公开(公告)日：2017-09-21

申请号：US15617123

申请日：2017-06-08

Applicant: Coriant Operations, Inc.

Inventor： Zhen Lei ,  Qinzhen Ba ,  Zongxian Duan ,  HuiHui Yu

IPC: H05K7/20 ,  H01L23/40 ,  B23P15/26 ,  H05K1/02 ,  H01L23/367

CPC classification number: H05K7/20409 ,  B23P15/26 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/06 ,  H01L2924/00

Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

公开(公告)号：US20170245373A1

公开(公告)日：2017-08-24

申请号：US15434466

申请日：2017-02-16

Applicant: DENSO CORPORATION

Inventor： Akito IWAMA ,  Shinichi AWANO ,  Seiji TACHIBANA

IPC: H05K3/22 ,  B05D5/00 ,  H05K1/02

CPC classification number: H05K3/22 ,  B05D1/26 ,  B05D5/00 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/06 ,  H05K2201/10166 ,  H05K2203/0126

Abstract: There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.

公开(公告)号：US20170137674A1

公开(公告)日：2017-05-18

申请号：US15319160

申请日：2015-06-25

Applicant: AMOGREENTECH CO., LTD.

Inventor： Seung Jae HWANG

IPC: C09J11/04 ,  C09J7/00 ,  C09J7/02 ,  H05K1/18 ,  B32B27/20 ,  B32B27/08 ,  H05K1/02 ,  C09J9/00 ,  B32B7/12

CPC classification number: H05K7/20 ,  B32B7/12 ,  B32B27/08 ,  B32B27/20 ,  B32B2307/302 ,  B32B2457/08 ,  C08K7/04 ,  C08K7/18 ,  C09J7/00 ,  C09J7/20 ,  C09J9/00 ,  C09J11/04 ,  C09J2203/326 ,  C09J2205/102 ,  H05K1/0203 ,  H05K1/028 ,  H05K1/18 ,  H05K2201/06 ,  H05K2201/10128 ,  H05K2201/10159

Abstract: Provided are a heat-radiating adhesive member, a heat-radiating sheet using the heat-radiating adhesive member, and an electronic apparatus having the heat-radiating sheet. The heat-radiating adhesive member includes: an adhesive layer; first thermally conductive fillers that are dispersed inside the adhesive layer and spreads heat generated from a heat-generating component of an electronic apparatus in a horizontal direction of the adhesive layer; and second thermally conductive fillers that are dispersed inside the adhesive layer and transfer the heat generated from the heat-generating component of the electronic apparatus to the first thermally conductive fillers.

公开(公告)号：US09655238B2

公开(公告)日：2017-05-16

申请号：US14698276

申请日：2015-04-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazutaka Kobayashi

IPC: H05K1/05 ,  H05K1/02 ,  H05K7/20 ,  H05K1/11 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K1/056 ,  H05K1/0206 ,  H05K1/0256 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/181 ,  H05K7/205 ,  H05K2201/0195 ,  H05K2201/06 ,  H05K2201/09227 ,  H05K2201/10106 ,  H05K2201/10969

Abstract: A wiring board includes a heat dissipation plate, a heat-conductive adhesive layer, an insulating layer, a thermal via, a heat dissipation metal terminal, and electrodes. The heat-conductive adhesive layer is disposed on the heat dissipation plate. The insulating layer is disposed on the heat-conductive adhesive layer. The insulating layer is formed with an opening portion. The thermal via is disposed in the opening portion of the insulating layer. The heat dissipation metal terminal is disposed on the thermal via and electrically connected to the heat dissipation plate. The electrodes are disposed on the insulating layer. The electrodes are to be connected to an electronic component.

公开(公告)号：US09648736B2

公开(公告)日：2017-05-09

申请号：US14528346

申请日：2014-10-30

Applicant: A.B. Mikroelektronik Gesellschaft mit beschraenkter Haftung

Inventor： Robert Christopher Burns ,  Wolfgang Tusler ,  Bernd Haegele

IPC: H05K7/00 ,  H05K1/05 ,  H01L23/492 ,  H01L25/07 ,  H05K1/02 ,  H02M7/00 ,  H05K7/02 ,  H05K7/04 ,  H01L25/18

CPC classification number: H05K1/05 ,  H01L23/492 ,  H01L25/072 ,  H01L25/18 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/021 ,  H05K1/0263 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/4644 ,  H05K7/023 ,  H05K7/04 ,  H05K2201/0326 ,  H05K2201/04 ,  H05K2201/06 ,  H05K2201/10166 ,  H01L2924/00

Abstract: The invention relates to a circuit board, particularly for a power-electronic module, comprising an electrically-conductive substrate which consists, at least partially and preferably entirely, of aluminium and/or an aluminium alloy. On at least one surface of the electrically-conductive substrate, at least one conductor surface is arranged in the form of an electrically-conductive layer applied preferably using a printing method and more preferably using a screen-printing method, said conductor surface being in direct electrical contact with the electrically-conductive substrate.

公开(公告)号：US20170075083A1

公开(公告)日：2017-03-16

申请号：US15295269

申请日：2016-10-17

Applicant: Lumentum Operations LLC

Inventor： David Moore ,  Dean Flockton

IPC: G02B6/42 ,  H05K3/30 ,  H05K1/18 ,  H05K7/20

CPC classification number: G02B6/4269 ,  B32B7/12 ,  B32B27/06 ,  B32B27/281 ,  G02B6/428 ,  H05K1/18 ,  H05K3/301 ,  H05K7/20 ,  H05K7/2039 ,  H05K7/20409 ,  H05K7/20418 ,  H05K9/0058 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/10121 ,  H05K2201/10962

Abstract: Present thermal solutions to conduct heat from pluggable optical modules into heat sinks use a metal heat sink attached with a spring clip. The interface between the pluggable module and the heat sink is simple metal-on-metal contact, which is inherently a poor thermal interface and limits heat dissipation from the optical module. Heat dissipation from pluggable optical modules is enhanced by the application of thermally conductive fibers, such as an advanced carbon nanotube velvet. The solution improves heat dissipation while preserving the removable nature of the optical modules.

Abstract translation: 目前，将可插拔光模块传导热量的热解决方案使用附有弹簧夹的金属散热器。 可插拔模块和散热器之间的接口是简单的金属对金属接触，这本质上是一个差的热接口，并限制了光学模块的散热。 通过使用诸如先进的碳纳米管天鹅绒的导热纤维来增强可插拔光学模块的散热。 该解决方案可以改善散热，同时保持光学模块的可拆卸性。

公开(公告)号：US09521738B1

公开(公告)日：2016-12-13

申请号：US14560898

申请日：2014-12-04

Applicant: Flextronics AP, LLC

Inventor： Dennis Willie ,  Richard Loi ,  David Geiger ,  Anwar Mohammed ,  Murad Kurwa ,  Hector Rene Marin Hernandez

IPC: H05K7/20 ,  H05K1/02 ,  H01L23/473

CPC classification number: H05K1/0201 ,  H01L23/373 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/115 ,  H05K1/181 ,  H05K3/3494 ,  H05K7/20209 ,  H05K7/2039 ,  H05K2201/0323 ,  H05K2201/06 ,  H05K2201/062 ,  H05K2201/10371 ,  H05K2203/304

Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology.

Abstract translation: 形成的石墨片的形状和尺寸被设计为位于耦合到PCB的电子部件上方的保护屏蔽。 形成的石墨片用于保护电子部件的主体免受在电子部件组装到PCB期间所施加的热，例如在SMT和通孔技术中使用的加热步骤。

公开(公告)号：US20160242270A1

公开(公告)日：2016-08-18

申请号：US15027177

申请日：2014-09-29

Applicant: SOCIÉTÉ FRANÇAISE DE DÉTECTEURS INFRAROUGES-SOFRADIR

Inventor： David ROBERT ,  Yves ROYER

IPC: H05K1/02 ,  G01J5/10 ,  G01J5/06 ,  H05K1/11 ,  H01R12/77

CPC classification number: H05K1/0201 ,  G01J5/06 ,  G01J5/061 ,  G01J5/10 ,  H01R12/77 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/147 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/0715

Abstract: A flexible printed circuit of low emissivity including first and second ends and a flexible central portion extending between the first and second ends and including electrically-conductive tracks, coated with a polymer material, to electrically connect the first and second ends. The flexible central portion is at least partly covered with a heat shield formed in a material having an emissivity smaller than those of the polymer material and of the electrically-conductive tracks.

Abstract translation: 一种低发射率的柔性印刷电路，包括第一端和第二端以及在第一和第二端之间延伸的柔性中心部分，并且包括被涂覆有聚合物材料的电导轨道，以电连接第一端和第二端。 柔性中心部分至少部分地被形成在具有小于聚合物材料和导电轨道的发射率的材料中形成的热屏蔽覆盖。

公开(公告)号：US20160174357A1

公开(公告)日：2016-06-16

申请号：US14565744

申请日：2014-12-10

Applicant: RAYTHEON COMPANY

Inventor： Waid Paine ,  James S. Wilson ,  Cary C. Kyhl ,  Robert S. Isom

IPC: H05K1/02 ,  H05K1/18 ,  H01R12/72 ,  H05K1/11

CPC classification number: H05K1/0204 ,  H01Q21/0025 ,  H01R12/72 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/183 ,  H05K7/20509 ,  H05K2201/06 ,  H05K2201/09036 ,  H05K2201/10098

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 衬底，其布置在所述散热器的表面上，使得所述散热片的锥形边缘延伸超过所述衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器为RF信号部件提供接地平面，并为设置在基板中的发热电路提供热路径。