公开(公告)号：EP2768293A1

公开(公告)日：2014-08-20

申请号：EP14152093.2

申请日：2014-01-22

Applicant: Automotive Lighting Reutlingen GmbH

Inventor： Johann, Christian

IPC: H05K3/34 ,  H05K3/40

CPC classification number: H05K3/4007 ,  H05K3/3478 ,  H05K2201/0314 ,  H05K2201/0338 ,  H05K2201/035

Abstract: Die Erfindung betrifft eine Leiterplatte (10) für elektrische Schaltungen, wobei die Leiterplatte (10) auf mindestens einer Oberfläche eine Lötstopmaske (20) mit Aussparungen für Lötstellen (24) zum Kontaktieren von elektrischen Bauelementen (26), und Leiterbahnen aufweist, wobei mindestens eine der Lötstellen (24) mehrere Schichten (38, 40, 42) aus unterschiedlichen Materialien umfasst und der mehrschichtige Aufbau der Lötstellen (24) sich von dem Aufbau der restlichen Leiterplatte (10) unterscheidet.

Abstract translation: 板（10）具有阻焊掩模（20）和布置在表面上的导体路径，其中掩模包括用于焊接接头（24）的接触表面安装器件（SMD）（26）的开口。 其中一个接头包括导电弹性材料层（38），无电镍/浸金（ENIG）层（40）和无铅焊料（42），即InnoLot（RTM：无铅， 清洁焊膏）由不同的材料制成。 接头的多层结构不同于其余板的结构。 材料层布置在铜层（16）上。 弹性材料层含有树脂。

公开(公告)号：EP2284880A1

公开(公告)日：2011-02-16

申请号：EP10150506.3

申请日：2010-01-12

Applicant: HTC Corporation

Inventor： Lee, Chien-Liang

IPC: H01L21/98 ,  H01L25/10 ,  H01L25/18 ,  H05K3/34 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L25/18 ,  H01L21/4853 ,  H01L21/563 ,  H01L23/3128 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T428/24091 ,  Y10T428/2414 ,  Y10T428/24165 ,  Y10T428/24182 ,  Y10T428/2424 ,  H01L2924/00

Abstract: A package structure and a package process are provided. In the package process, firstly, a first electronic component having a plurality of first conductive bumps at a bottom thereof is provided. Then, a first insulation paste is coated on the first conductive bumps. The first electronic component is disposed on a circuit substrate having a plurality of substrate pads, and the first conductive bumps are respectively situated on the substrate pads. Next, a heating process is performed to both of the first conductive bumps and the first insulation paste, wherein the first conductive bumps is reflowed to bond the first electronic component and the substrate pads, and the first insulation paste is cured.

Abstract translation: 提供了封装结构和封装工艺。 在封装工序中，首先，设置在底部具有多个第一导电凸块的第一电子部件。 然后，在第一导电凸块上涂覆第一绝缘膏。 第一电子部件设置在具有多个基板焊盘的电路基板上，第一导电凸块分别位于基板焊盘上。 接下来，对第一导电凸块和第一绝缘膏进行加热处理，其中第一导电凸块被回流以接合第一电子部件和基板焊盘，并且第一绝缘膏被固化。

公开(公告)号：EP2234466A1

公开(公告)日：2010-09-29

申请号：EP08865333.2

申请日：2008-12-24

Applicant: Fujikura, Ltd.

Inventor： SAGAWA, Tomoharu ,  KUME, Atsushi

IPC: H05K3/34

CPC classification number: H05K3/3442 ,  H05K1/095 ,  H05K1/111 ,  H05K3/247 ,  H05K3/305 ,  H05K2201/035 ,  H05K2201/10636 ,  H05K2201/10977 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: A mounting board of the invention includes: an insulative base; a plurality of first conductive elements provided on the insulative base and having lands; a plurality of second conductive elements disposed on the lands; a plurality of solder pieces each disposed on each of the second conductive elements; and an electronic component which includes electrode sections each contacting each of the solder pieces, wherein the first conductive elements are made from a first element that contains at least silver; the second conductive elements are made from a second element that contains at least copper; and the solder pieces are made from a third element that contains at least tin.

Abstract translation: 本发明的安装板包括：绝缘基座; 多个第一导电元件，设置在所述绝缘基底上并具有平台; 设置在所述焊盘上的多个第二导电元件; 多个焊料片，各自设置在每个第二导电元件上; 以及电子部件，其包括各自接触每个焊料片的电极部分，其中所述第一导电元件由至少含有银的第一元件制成; 第二导电元件由至少包含铜的第二元件制成; 并且焊料片由至少含有锡的第三元件制成。

公开(公告)号：EP2009968A8

公开(公告)日：2009-03-18

申请号：EP08720606.6

申请日：2008-03-26

Applicant: Panasonic Corporation

Inventor： ASAHI, Toshiyuki c/o Panasonic Corporation IPROC ,  SHIMASAKI, Yukihiro c/o Panasonic Corporation IPROC ,  ECHIGO, Fumio c/o Panasonic Corporation IPROC

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0209 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/202 ,  H05K3/28 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0209 ,  H05K2201/035 ,  H01L2224/0401

Abstract: A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength λ = 0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component.

Abstract translation: 一种布线板包括：绝缘板，其具有安装有电子部件的顶表面，形成在绝缘板的顶表面上的导体图案以及覆盖导体图案的由发热材料制成的发热层。 对于波长λ= 0.002898 / T的电磁波，在293K至473K的温度T下，发射材料的发射率不小于0.8。 该布线板抑制电子部件的温度上升。

公开(公告)号：EP1989930A2

公开(公告)日：2008-11-12

申请号：EP07751245.7

申请日：2007-02-22

Applicant: Edwards Lifesciences Corporation

Inventor： CURRY, Kenneth, M.

IPC: H05K1/11

CPC classification number: H05K3/247 ,  A61B5/1486 ,  A61B2562/125 ,  A61N1/05 ,  G01N27/3271 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2203/0574 ,  Y10T29/4916 ,  H01L2924/00

Abstract: A method of creating an active electrode (10) that includes providing a flex circuit (100) having an electrode (120) made of a first material and providin a first mask (200) over the flex circuit, the first mask having an offset region (305) and an opening (220) that exposes the electrode. The method also includes depositing a second material (300) over the offset region and the opening, the second material being different from the first material an providing a second mask (400) over the second material, the second mask havin a opening (405) over a portion of the second material that is over the offset region.

公开(公告)号：EP1009205B1

公开(公告)日：2008-09-03

申请号：EP98923141.0

申请日：1998-06-05

Applicant: IBIDEN CO., LTD.

Inventor： ENOMOTO, Ryo, Ogaki-kita-kojou, Ibiden K.K. ,  HIRAMATSU, Yasuji, Ogaki-kita-kojou, Ibiden K.K.

IPC: H05K3/46

CPC classification number: H05K3/4617 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/382 ,  H05K3/386 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2203/0733 ,  H05K2203/1189 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: Holes (40a) are formed with a laser beam through an insulating substrate (40) on which a metallic layer (42) is formed and via holes (36a) are formed by filling up the holes (40a) with a metal (46). After the via holes (36a) are formed, a conductor circuit (32a) is formed by etching the metallic layer (42) and a single-sided circuit board (30A) is formed by forming projecting conductors (38a) on the surfaces of the via holes (36a). The projecting conductors (38a) on the circuit board (30A) are put on the conductor circuit (32b) of another single-sided circuit board (30B) with adhesive layers (50) composed of an uncured resin in between and heated and pressed against the circuit (32b). The projecting conductors (38a) get in the uncured resin by pushing aside the resin and are electrically connected to the circuit (32b). Since single-sided circuit boards (30A, 30B, 30C, and 30D) can be inspected for defective parts before the boards (30A, 30B, 30C, and 30D) are laminated upon one another, only defectless single-sided circuit can be used in the step of lamination.

公开(公告)号：EP1705971B1

公开(公告)日：2007-10-31

申请号：EP06013130.7

申请日：2005-06-21

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Sakai, Tadahiko ,  Maeda, Tadashi

IPC: H05K3/34

CPC classification number: H05K3/3436 ,  H01L24/11 ,  H01L24/81 ,  H01L2224/1182 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13164 ,  H01L2224/16 ,  H01L2224/29499 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/758 ,  H01L2224/81011 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K3/3489 ,  H05K2201/0215 ,  H05K2201/035 ,  H05K2203/0338 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099

公开(公告)号：EP1772876A3

公开(公告)日：2007-10-03

申请号：EP06018840.6

申请日：2006-09-08

Applicant: E.I. du Pont de Nemours and Company

Inventor： Akimoto, Hideki

IPC: H01C17/242

CPC classification number: H01C17/24 ,  H05K1/095 ,  H05K1/167 ,  H05K3/125 ,  H05K3/247 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2203/013 ,  H05K2203/0361 ,  H05K2203/171

Abstract: Described herein is a resistor (11) to which a trimming process is applied (hereinafter, also called a trimming resistor), a method for manufacturing a trimming resistor (11) and a circuit substrate (30a) using the trimming resistor (11).

公开(公告)号：EP1713170A2

公开(公告)日：2006-10-18

申请号：EP06007600.7

申请日：2006-04-11

Applicant: FANUC LTD

Inventor： Odaka, SHunichi ,  Kariya, Isao, Rm. 6-303

IPC: H02N1/00

CPC classification number: H05K1/0254 ,  H02N1/004 ,  H05K3/244 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2201/098 ,  Y10T29/49002 ,  Y10T29/49009

Abstract: A method of production of electrodes for an electrostatic motor generating electrostatic force between a facing stator and slider, including forming core electrodes on a board of at least one of the stator and the slider by patterning a conductive substance and depositing a conductive substance on the core electrodes so that the side edges become rounded. Any method selected from electroplating, electroless plating, electrostatic coating, or screen printing can be used to deposit the conductive substance on the core electrodes. The core electrodes may be patterned using non-etching means. Further, electrodes for an electrostatic motor generating an electrostatic force between a facing stator and slider provided with core electrodes patterned on the board of at least one of the stator and the slider and a conductive substance deposited on the core electrodes to form deposition layers so that the side edges become rounded.

Abstract translation: 生产电极的用于在静电马达产生面向定子和滑动件之间的静电力，其中包括在所述定子的至少一个的板以及通过对所述芯图案化的导电物质和沉积导电物质滑块形成芯电极的方法 电极所以没有侧边变得圆润。 从电镀，化学镀，静电涂装法，或丝网印刷中的任意方法可以被用来对导电电极芯沉积物质。 芯电极可以使用非蚀刻装置来形成图案。 此外，电极，用于在设置有图案化在所述定子的至少一个的板和滑块并沉积在芯电极的导电物质，以形成沉积层，从而做芯电极的面临定子和滑动件之间的静电力的静电马达产生 侧边缘变圆。

公开(公告)号：EP1488880A2

公开(公告)日：2004-12-22

申请号：EP04012883.7

申请日：2004-06-01

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Akamatsu, Hiroshi ,  Kawamura, Yukinori ,  Kai, Hiroshi ,  Kuramoto, Osamu ,  Iwasaki, Shigeru ,  Asai, Kenji ,  Hibino, Minoru

IPC: B23K1/19

CPC classification number: H05K3/3415 ,  B23K3/0638 ,  B23K2201/42 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/035 ,  H05K2201/10992 ,  H05K2203/0545 ,  H05K2203/111 ,  H05K2203/1121 ,  H05K2203/1476 ,  Y02P70/613 ,  Y10T428/12493

Abstract: A structure of solder joint structure formed of zinc-based lead-free solder having excellent characteristics is disclosed. Between a first lead-free solder layer and a soldering pad, the following layers are formed: a tin-copper alloy layer formed on the pad; a first alloy layer formed of second lead-free layer of which main ingredients are tin and silver; and a second alloy layer formed between the first alloy layer and the first lead-free solder. This structure allows forming the solder joint structure formed of zinc-based lead-free solder having high joint strength.

Abstract translation: 形成了具有优良特性的锌基无铅焊料的焊料接合结构体的结构是游离缺失盘。 第一无铅焊料层和焊接垫之间，下面的层是儿童：在形成于焊盘上的锡 - 铜合金层; 形成的第二无铅层的哪个主要成分是锡和银的第一合金层; 和第二合金层中的第一合金层和第一无铅焊料之间形成。 这种结构允许形成形成具有高接合强度的锌基无铅焊料的焊料接合结构。