公开(公告)号：US20060033199A1

公开(公告)日：2006-02-16

申请号：US11195818

申请日：2005-08-03

Applicant: Yoshiteru Kawakami ,  Yasuharu Nakamura

Inventor： Yoshiteru Kawakami ,  Yasuharu Nakamura

IPC: H01L23/12

CPC classification number: H05K1/144 ,  H01L23/3677 ,  H01L23/42 ,  H01L23/467 ,  H01L23/49833 ,  H01L23/5385 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/16195 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0272 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2203/063 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic circuit device includes at least a first substrate and a second substrate, a spacer substrate interposed between the first substrate and the second substrate, an electronic component interposed between the first substrate and the second substrate, and at least one through-hole formed on the second circuit substrate opposing the first circuit substrate. The spacer substrate mutually connects the first substrate and the second substrate. The electronic component is connected to the first circuit substrate with the active surface of the electronic component. The through-hole penetrates from a first surface of the second circuit substrate opposing the first substrate to a second surface of the second circuit substrate. The first circuit substrate is connected to the electronic component.

Abstract translation: 电子电路装置至少包括第一基板和第二基板，插入在第一基板和第二基板之间的间隔基板，插入在第一基板和第二基板之间的电子部件，以及至少一个通孔，其形成在 所述第二电路基板与所述第一电路基板相对。 间隔基板相互连接第一基板和第二基板。 电子部件与电子部件的有源面连接到第一电路基板。 通孔从与第一基板相对的第二电路基板的第一表面穿透到第二电路基板的第二表面。 第一电路基板连接到电子部件。

公开(公告)号：US20060023436A1

公开(公告)日：2006-02-02

申请号：US11188005

申请日：2005-07-25

Applicant: Hiroto Sugahara

Inventor： Hiroto Sugahara

IPC: H05K7/08

CPC classification number: H01L23/3736 ,  B41J2/14233 ,  B41J2002/14491 ,  B41J2202/08 ,  H01L23/367 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/16 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/053 ,  H05K3/305 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/10674

Abstract: A substrate mounted with an electronic element thereon comprises a metal base, a ceramic insulator, and a radiator. The insulator is provided on a first side of the base. The insulator has a heat-generating electronic element mounted on a side thereof opposite to a side thereof facing the first side of the base. The radiator has a radiation capability higher than both of a radiation capability of the insulator and a radiation capability of the base, and radiates heat transmitted from the electronic element via the insulator to the base.

Abstract translation: 安装有电子元件的基板包括金属基底，陶瓷绝缘体和散热器。 绝缘体设置在基座的第一侧上。 绝缘体具有安装在其面向与基座的第一侧相对的一侧的发热电子元件。 散热器的辐射能力高于绝缘子的辐射能力和基座的辐射能力，并且辐射从电子元件经由绝缘体传递到基座的热量。

公开(公告)号：US20060022334A1

公开(公告)日：2006-02-02

申请号：US10900538

申请日：2004-07-28

Applicant: Bruce Myers ,  Darrel Peugh ,  Lester Wilkinson ,  Erich Gerbsch

Inventor： Bruce Myers ,  Darrel Peugh ,  Lester Wilkinson ,  Erich Gerbsch

IPC: H01L23/34

CPC classification number: H05K1/0272 ,  H01L23/4334 ,  H01L23/473 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/0203 ,  H05K2201/064 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.

公开(公告)号：US06977346B2

公开(公告)日：2005-12-20

申请号：US10458448

申请日：2003-06-10

Applicant: Vivek A. Jairazbhoy ,  Andrew Z. Glovatsky

Inventor： Vivek A. Jairazbhoy ,  Andrew Z. Glovatsky

IPC: H01L23/367 ,  H05K1/02 ,  H05K3/34 ,  H05K3/40 ,  H05K1/00

CPC classification number: H05K1/0203 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0361 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Abstract translation: 本发明提供了一种电路板，包括形成用于互连电子部件的多个导电电路迹线的第一导体层。 电路板包括用于支撑第一导体层的基板和由基板形成的基座，用于支撑多个电子部件中的至少一个。 基座提供用于将热量远离多个电子部件中的至少一个的热传导路径和邻近基座的基板中的孔，以允许流体通过基板。

公开(公告)号：US20030226688A1

公开(公告)日：2003-12-11

申请号：US10458448

申请日：2003-06-10

Applicant: Visteon Global Technologies, Inc.

Inventor： Vivek A. Jairazbhoy ,  Andrew Z. Glovatsky

IPC: H05K007/20

CPC classification number: H05K1/0203 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K3/341 ,  H05K3/4007 ,  H05K2201/0361 ,  H05K2201/064 ,  H05K2201/09063 ,  H05K2201/09736 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

Abstract: The present invention provides a circuit board including a first conductor layer forming a plurality of conductive circuit traces for interconnecting electronic components. The circuit board includes a substrate for supporting the first conductor layer and a pedestal formed from the substrate for supporting at least one of the plurality of electronic components. The pedestal provides a heat conduction path for conducting heat away from the at least one of the plurality of electronic components and a aperture in the substrate adjacent the pedestal for allowing a fluid to pass through the substrate.

Abstract translation: 本发明提供了一种电路板，包括形成用于互连电子部件的多个导电电路迹线的第一导体层。 电路板包括用于支撑第一导体层的基板和由基板形成的基座，用于支撑多个电子部件中的至少一个。 基座提供用于将热量远离多个电子部件中的至少一个的热传导路径和邻近基座的基板中的孔，以允许流体通过基板。

公开(公告)号：US06586783B2

公开(公告)日：2003-07-01

申请号：US10059359

申请日：2002-01-31

Applicant: Benoît Boursat ,  Emmanuel Dutarde ,  Nathalie Martin ,  Pierre Solomalala ,  José Saiz

Inventor： Benoît Boursat ,  Emmanuel Dutarde ,  Nathalie Martin ,  Pierre Solomalala ,  José Saiz

IPC: H01L2710

CPC classification number: H05K1/0265 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/538 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/181 ,  H05K3/244 ,  H05K2201/064 ,  H05K2201/098 ,  H01L2924/00

Abstract: An electronic power circuit substrate including a wafer of electrically insulating material, wherein said wafer presents a face supporting one or more conductive tracks directly connected to one or more electronic power components, said conductive tracks being obtained by fine metallization of said face to a thickness that is less than 150 &mgr;m.

Abstract translation: 一种包括电绝缘材料晶片的电子电路电路基板，其中所述晶片呈现一个支撑直接连接到一个或多个电子元件的一个或多个导电轨道的表面，所述导电轨迹是通过所述面的精细金属化得到的， 小于150妈妈。

公开(公告)号：US20020053720A1

公开(公告)日：2002-05-09

申请号：US09951391

申请日：2001-09-14

Applicant: ALSTOM

Inventor： Benoit Boursat ,  Emmanuel Dutarde ,  Luc Meysenc ,  Jose Saiz ,  Pierre Solomalala

IPC: H01L029/82

CPC classification number: H01L23/3735 ,  H01L23/147 ,  H01L23/538 ,  H01L2924/0002 ,  H01L2924/13055 ,  H05K1/0306 ,  H05K3/181 ,  H05K3/244 ,  H05K2201/064 ,  H05K2201/098 ,  H01L2924/00

Abstract: A substrate for an electronic circuit, the substrate comprising a wafer of silicon Si having a top face covered in an electrically insulating layer of silicon nitride SiN, said electrically insulating layer of silicon nitride supporting one or more conductive tracks obtained by metallizing the top face of said electrically insulating layer for the purpose of enabling one or more electronic components to be connected.

Abstract translation: 一种用于电子电路的衬底，所述衬底包括具有覆盖在氮化硅SiN的电绝缘层中的顶面的硅硅晶片，所述氮化硅的电绝缘层支撑一个或多个通过金属化 所述电绝缘层用于使一个或多个电子部件能够连接。

公开(公告)号：US5818692A

公开(公告)日：1998-10-06

申请号：US865811

申请日：1997-05-30

Applicant: Donald L. Denney, Jr. ,  Martinho R. Pais

Inventor： Donald L. Denney, Jr. ,  Martinho R. Pais

IPC: H01L23/473 ,  H05K1/18 ,  H05K7/20 ,  H65J7/20

CPC classification number: H01L23/473 ,  H05K1/189 ,  H05K7/20345 ,  H05K7/20927 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0272 ,  H05K2201/051 ,  H05K2201/064 ,  H05K2201/09109 ,  Y10S165/908

Abstract: The apparatus includes a flexible printed wiring device (18) having a region sized to receive the electronic component (10) and a channel (28) disposed within the flexible printed wiring device. The channel has an inlet end (32) and an outlet end (34) and has an orifice (36) disposed therein. The inlet end receives a fluid, the fluid is distributed to the orifice via the channel and the orifice directs the fluid toward the region, so that the fluid is in direct contact with the electronic component when the electronic component is disposed in the region.

Abstract translation: 该装置包括柔性印刷布线装置（18），其具有尺寸适于容纳电子部件（10）的区域和设置在柔性印刷布线装置内的通道（28）。 通道具有入口端（32）和出口端（34），并且在其中设置有孔口（36）。 入口端容纳流体，流体经由通道分配到孔口，并且孔口将流体引向区域，使得当电子部件设置在该区域中时，流体与电子部件直接接触。

公开(公告)号：US5724012A

公开(公告)日：1998-03-03

申请号：US682630

申请日：1996-08-01

Applicant: Petrus Johannus Stephanus Teunisse

Inventor： Petrus Johannus Stephanus Teunisse

IPC: H01P1/30 ,  H01P3/08 ,  H05K1/02

CPC classification number: H01P3/085 ,  H05K1/024 ,  H05K2201/0116 ,  H05K2201/064 ,  H05K2201/0715

Abstract: Transmission-line network of the foam stripline type. To reduce dielectric losses in the foam, part of the foam in the region of the stripline is removed so that the wave properties of the transmission-line network are not impaired. The removed foam forms ducts that may be used for the forced cooling of the stripline using air or other cooling agents.

Abstract translation: PCT No.PCT / EP95 / 00179 Sec。 371日期：1996年8月1日 102（e）日期1996年8月1日PCT提交1995年1月18日PCT公布。 WO95 / 21472 PCT出版物 日期1995年8月10日泡沫带状线的传输线网络。 为了减少泡沫中的介质损耗，去除了带状线区域中泡沫的一部分，使传输线网络的波特性不受损害。 去除的泡沫形成可用于使用空气或其它冷却剂强制冷却带状线的管道。

公开(公告)号：US5698299A

公开(公告)日：1997-12-16

申请号：US437375

申请日：1995-05-09

Applicant: Walter Schmidt ,  Marco Martinelli ,  Alexandra Frei

Inventor： Walter Schmidt ,  Marco Martinelli ,  Alexandra Frei

IPC: B01D39/16 ,  B01D67/00 ,  B01D69/12 ,  B07B1/46 ,  B81B1/00 ,  G02B6/122 ,  G02B6/36 ,  G02B6/42 ,  H05K1/02 ,  B32B9/00

CPC classification number: B07B1/4618 ,  B01D39/1692 ,  B01D67/0058 ,  B01D69/12 ,  B07B1/4663 ,  G02B6/122 ,  G02B6/4228 ,  H05K1/0272 ,  G02B6/423 ,  H05K2201/0166 ,  H05K2201/064 ,  H05K2201/09509 ,  H05K2203/0554 ,  Y10T29/49165 ,  Y10T428/24826 ,  Y10T428/24917

Abstract: A multilayer laminated body has a determinate system of hollow passages and is formed by an assembly of flat layers of polymeric materials having major dimensions in orthogonal X and Y directions and a thickness dimension in a Z direction perpendicular to the X and Y directions. Selected ones of the layers have openings extending through in the Z direction, and other layers have canals formed in an X-Y plane. The openings and canals form parts of hollow passages so that assembly of multiple layers joins openings and canals forms complete and continuous passages through the assembled layers. Layers joined in pre-laminate assemblies are assembled together in precise relative positions for desired alignment of the canals and openings. The passages can be filled with optically conductive material or electrically conductive material and electrodes can be appropriately positioned for acting on fluids passing through the body.

Abstract translation: 多层层叠体具有确定的中空通道系统，并且通过具有垂直于X和Y方向的主要尺寸的聚合物材料的平面组合和垂直于X和Y方向的Z方向上的厚度尺寸的组合形成。 所选择的层具有沿Z方向延伸的开口，而其它层具有在X-Y平面中形成的通道。 开口和沟渠形成中空通道的部分，使得多个层的组合连接开口和沟渠，形成通过组装层的完整且连续的通道。 连接在预层压组件中的层在精确的相对位置组装在一起，用于期望对准运河和开口。 通道可以用光学导电材料或导电材料填充，并且电极可以适当地定位以作用于穿过身体的流体。