Abstract:
PROBLEM TO BE SOLVED: To provide a micron-sized and submicron-sized gear incorporated into a micro-machine. SOLUTION: A gear having a projecting tooth on a peripheral surface, or a gear having a magnetic tooth on a peripheral surface, or a gear having a static electricity gear on a peripheral surface, and its manufacturing method form a gear such as a worm gear, a spur gear, and a bevel gear by applying the said either tooth, and a complicated-shaped gear by using a thin film forming technology such as deposition, sputtering, a plating technology, CVD, and an oxidation processing, and a fine processing technology such as photolithography and etching for collectively forming the tooth and the gear in the same process, and are characterized by particularly using an exposure quantity control exposure method and a transfer etching method. COPYRIGHT: (C)2003,JPO
Abstract:
PURPOSE: A complex micro-machine component and a manufacturing method thereof are provided so that directional etching is done on the whole horizontal parts of coated portion and thus an insulating layer exists only on one or more cavities and the outer walls of a part. CONSTITUTION: A manufacturing method of a complex micro-machine component comprises following steps. A substrate, which comprises a horizontal top layer(21) and a horizontal bottom layer is prepared. One or more patterns are etched in the top layer through a middle layer(22). The upper part of the substrate is coated with electric insulating coating agent. Directional etching is done on the coated layer and the middle layer and thus a layer exists only on each vertical wall, which is formed in the top layer. An electrode is connected to the conductive bottom layer of the substrate and electric deposition is performed. A complex component is released from the substrate.
Abstract:
The invention relates to a method for producing a silicon-metal composite micromechanical part, combining DRIE-type and LIGA-type processes. The invention also relates to a micromechanical part comprising a layer containing a silicon part (53) and a metal part in such a way as to form a composite-type micromechanical part. The invention can be used in the field of timekeeping movements.
Abstract:
The process comprises the following steps: a) a first element (3) or a plurality of said first elements (3) is/are machined in a first silicon wafer (1) keeping said elements (3) joined together via material bridges (5); b) step a) is repeated with a second silicon wafer (2) in order to machine a second element (4), differing in shape from that of the first element (3), or a plurality of said second elements (4); c) the first and second elements (3, 4) or the first and second wafers (1, 2) are applied, face to face, with the aid of positioning means (6, 7); d) the assembly formed in step c) undergoes oxidation; and e) the parts (10) are separated from the wafers (1, 2). Micromechanical timepiece parts obtained according to the process.
Abstract:
마이크로 부품의 제조에 있어서, 용제를 이용하여 용해 가능한 수지 기판(1)을 성형하고, 이 수지 기판(1)에 물리적 외력을 작용시켜 오목부(3)를 형성하고, 오목부(3)에 금속을 충전한 후, 잉여 금속을 연마에 의해 제거하고, 용제를 이용하여 수지 기판(1)을 용해시켜 마이크로 부품을 제조함으로써, 스테퍼, 에칭 장치 등의 리소그래피 장치를 불필요하게 하여 경제성을 향상시키고, 또, 리소그래피 기술에 따라서는 제조가 곤란한 복잡한 형상의 부품의 제조도 가능하게 한다.
Abstract in simplified Chinese:一种用于从硅基基底(1)开始制造微机械时计零件的方法,其依序包括以下的步骤:a)在硅基基底(1)的表面的至少一部分的表面上形成确定深度的细孔(2);b)以选自金刚石、类钻碳(DLC)、氧化硅、氮化硅、陶瓷、聚合物及其混合物之材料完全地填充细孔(2),以在细孔(2)中形成厚度至少相当于细孔(2)的深度的所述材料的层。 本发明亦关于一种微机械时计零件,其包括硅基基底(1),硅基基底(1)在硅基基底(1)的表面的至少一部分的表面上具有确定深度的细孔(2),细孔(2)被选自金刚石、类钻碳(DLC)、氧化硅、氮化硅、陶瓷、聚合物及其混合物之材料的层完全地填充,所述材料的层的厚度至少相当于细孔(2)的深度。
Abstract in simplified Chinese:本发明系关于一种制造机械零件(51)的方法(1),其包含以下步骤:a)提供(3)以可微机械加工材料制成之基板(53);b)借助光微影术,蚀刻(5)包括该零件之图案(50)穿过该整个基板。依据本发明,该方法进一步包含以下步骤:c)将夹片(91)组装(13)在该零件上以使该零件(51)随时被安装而不必要接触以可微机械加工材料制成之部份;d)使该零件(51)自该基板(53)脱离(11),以使该零件安装于诸如时计机心之设备。本发明关于时计制造的领域。
Abstract:
L'invention se rapporte à un procédé de fabrication d'une pièce mécanique (51) comportant les étapes suivantes : - se munir (3) d'un substrat (53) en un matériau micro-usinable ; - graver (5) par photolithographie, dans la totalité de l'épaisseur dudit substrat, un motif (50) comportant ladite pièce avec au moins un pont de matière (57) ; caractérisé en ce qu'il comporte en outre les étapes suivantes : - réaliser (13) une fragilisation à coeur du pont de matière (91) afin de former une amorce de rupture (91) le long d'une ligne de rupture (L) du pont de matière (57) ; - libérer (11) la pièce (51) du substrat (53) afin de la monter dans un dispositif.