公开(公告)号：US11778293B2

公开(公告)日：2023-10-03

申请号：US16999232

申请日：2020-08-21

Applicant: CANON KABUSHIKI KAISHA

Inventor： Dai Naito

IPC: H01L27/146 ,  H04N23/54 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/18 ,  H01L23/04

CPC classification number: H04N23/54 ,  H01L23/04 ,  H01L27/146 ,  H05K1/09 ,  H05K1/182 ,  H05K3/0017 ,  H05K3/181 ,  H05K2201/032 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.

公开(公告)号：US09949373B2

公开(公告)日：2018-04-17

申请号：US15409221

申请日：2017-01-18

Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.

Inventor： Dror Hurwitz ,  Alex Huang

IPC: H05K3/00 ,  H05K1/11 ,  H05K1/03 ,  H05K3/06

CPC classification number: H05K3/007 ,  C25D5/022 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K1/0313 ,  H05K1/115 ,  H05K3/0064 ,  H05K3/064 ,  H05K2201/032 ,  H05K2201/09609 ,  H05K2201/10242 ,  H01L2924/00

Abstract: An array of chip sockets defined by an organic matrix framework surrounding sockets through the organic matrix framework and further comprising a grid of metal vias through the organic matrix framework. In an embodiment, a panel includes an array of chip sockets, each surrounded and defined by an organic matrix framework including a grid of copper vias through the organic matrix framework. The panel includes at least a first region with sockets having a set of dimensions for receiving one type of chip and a second region with sockets and another set of dimensions for receiving a second type of chip.

公开(公告)号：US20180062611A1

公开(公告)日：2018-03-01

申请号：US15681153

申请日：2017-08-18

Applicant: WISOL CO., LTD.

Inventor： Jong Soo HA ,  Eun Tae PARK ,  Bong Soo KIM ,  Jung Hoon HAN ,  Chang Dug KIM

IPC: H03H9/02 ,  H05K1/18 ,  H03H3/02 ,  H05K3/32

CPC classification number: H03H9/02992 ,  H03H3/02 ,  H03H9/059 ,  H03H9/1085 ,  H05K1/181 ,  H05K3/28 ,  H05K3/32 ,  H05K2201/032 ,  H05K2201/10068 ,  H05K2201/10083 ,  H05K2201/10568 ,  H05K2201/10674 ,  H05K2201/2036

Abstract: Disclosed is a radiofrequency (RF) module including a surface acoustic wave (SAW) device that includes a piezoelectric substrate, an interdigital transducer (IDT) electrode and an input/output electrode formed on one surface of the piezoelectric substrate, and a bump joined to the input/output electrode, a printed circuit board (PCB) that includes a terminal corresponding to the input/output electrode and on which the SAW device is mounted to join the bump to the terminal, a molding portion that covers the SAW device, and a dam portion that surrounds the IDT electrode, the input/output electrode, and the bump not to allow a molding material that forms the molding portion to penetrate a space in which the IDT electrode, the input/output electrode, and the bump are arranged.

公开(公告)号：US09802275B2

公开(公告)日：2017-10-31

申请号：US15109352

申请日：2014-12-31

Applicant: Alpha Assembly Solutions Inc.

Inventor： Morgana de Avila Ribas ,  Rahul Raut ,  Traian Cornel Cucu ,  Shu Tai Yong ,  Siuli Sarkar ,  Ramakrishna Hosur Katagiriyappa

IPC: H05K1/09 ,  B23K35/362 ,  B23K35/26 ,  B23K35/36 ,  B23K35/02 ,  H05K1/11 ,  H05K9/00

CPC classification number: B23K35/362 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/3615 ,  B23K35/3618 ,  H05K1/09 ,  H05K1/111 ,  H05K9/0024 ,  H05K2201/032

Abstract: Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

公开(公告)号：US20170290150A1

公开(公告)日：2017-10-05

申请号：US15505619

申请日：2015-09-08

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.

Inventor： Takashi KASUGA ,  Yoshio OKA ,  Shigeaki UEMURA ,  Shigeyoshi NAKAYAMA ,  Jinjoo PARK ,  Sumito UEHARA ,  Hiroshi UEDA ,  Kousuke MIURA

IPC: H05K1/09 ,  C23C18/30 ,  H05K3/10 ,  H05K3/46 ,  H05K3/02 ,  C23C18/18 ,  C23C18/31

CPC classification number: H05K1/092 ,  B22F1/0018 ,  B22F1/0059 ,  B22F3/16 ,  B22F7/064 ,  B22F2998/10 ,  B22F2999/00 ,  C09D11/037 ,  C09D11/10 ,  C09D11/52 ,  C23C18/1653 ,  C23C18/1692 ,  C23C18/1879 ,  C23C18/2033 ,  C23C18/208 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/31 ,  C23C18/32 ,  C23C18/405 ,  C23C18/42 ,  H05K1/097 ,  H05K3/02 ,  H05K3/022 ,  H05K3/108 ,  H05K3/18 ,  H05K3/381 ,  H05K3/4661 ,  H05K2201/032 ,  H05K2203/0703 ,  H05K2203/1105 ,  C22C1/0425 ,  B22F7/08 ,  B22F1/0074 ,  C23C18/00 ,  B22F2003/248 ,  C25D7/00

Abstract: The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer.

公开(公告)号：US09578732B2

公开(公告)日：2017-02-21

申请号：US14467680

申请日：2014-08-25

Applicant: FUJIFILM Corporation

Inventor： Yasuhiro Mitamura ,  Masaya Nakayama ,  Yuki Matsunami

IPC: H05K1/02 ,  H05K1/09 ,  B32B15/08 ,  H05K3/28 ,  H01B3/44 ,  B32B5/02 ,  B32B7/12 ,  B32B27/20 ,  B32B27/28 ,  B32B27/30 ,  B32B27/32 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B3/08 ,  C08K5/378 ,  C08K5/47

CPC classification number: H05K1/0256 ,  B32B3/08 ,  B32B5/024 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/283 ,  B32B27/30 ,  B32B27/308 ,  B32B27/32 ,  B32B27/322 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  B32B2255/205 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/412 ,  B32B2457/00 ,  C08K5/378 ,  C08K5/47 ,  H01B3/447 ,  H05K1/092 ,  H05K3/285 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0206 ,  H05K2201/032 ,  H05K2201/0769 ,  Y10T428/2804

Abstract: A composition for forming a silver ion diffusion-suppressing layer includes an insulating resin and a compound including: a structure selected from the group consisting of a triazole structure, a thiadiazole structure and a benzimidazole structure; a mercapto group; and at least one hydrocarbon group optionally containing a heteroatom, with the total number of carbon atoms in the hydrocarbon group or groups being 5 or more. The composition for forming a silver ion diffusion-suppressing layer allows formation of a silver ion diffusion-suppressing layer capable of suppressing silver ion migration between metal interconnects containing silver or a silver alloy to improve the reliability on the insulation between the metal interconnects.

Abstract translation: 用于形成银离子扩散抑制层的组合物包括绝缘树脂和包含选自三唑结构，噻二唑结构和苯并咪唑结构的结构的化合物; 巯基; 和至少一个任选含有杂原子的烃基，烃基或碳原子数的总数为5以上。 用于形成银离子扩散抑制层的组合物允许形成能够抑制银或银合金的金属互连之间的银离子迁移的银离子扩散抑制层，以提高金属互连之间的绝缘的可靠性。

公开(公告)号：US09574091B2

公开(公告)日：2017-02-21

申请号：US14436565

申请日：2013-10-18

Applicant: NAMICS CORPORATION

Inventor： Yoshiaki Yoshii

IPC: H01B1/20 ,  H01B1/22 ,  C09D5/24 ,  C09D7/12 ,  C09D201/00 ,  H05K1/09 ,  H01B1/16 ,  H05K1/18 ,  H05K3/10

CPC classification number: C09D5/24 ,  C09D7/40 ,  C09D201/00 ,  H01B1/16 ,  H01B1/22 ,  H05K1/092 ,  H05K1/18 ,  H05K3/10 ,  H05K2201/032 ,  H05K2203/1126 ,  H05K2203/12

Abstract: A conductive paste including: (A) a silver powder; (B) a glass frit; (C) an organic binder; and (D) a powder containing copper, tin, and manganese.

Abstract translation: 导电浆料，包括：（A）银粉; （B）玻璃料; （C）有机粘合剂; 和（D）含有铜，锡和锰的粉末。

公开(公告)号：US20170034911A1

公开(公告)日：2017-02-02

申请号：US15290149

申请日：2016-10-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Daisuke TSURUGA

IPC: H05K1/09 ,  H05K3/46 ,  H05K3/40 ,  H05K1/11

CPC classification number: H05K1/09 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49822 ,  H01L23/49883 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/19105 ,  H05K1/113 ,  H05K1/115 ,  H05K3/3436 ,  H05K3/3442 ,  H05K3/4038 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/09472 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2203/06 ,  H01L2924/00

Abstract: A resin multilayer substrate includes a laminate including a plurality of resin layers and an interlayer connecting conductor which extends through at least one of the plurality of resin layers and is directly exposed to an outside of the laminate.

Abstract translation: 树脂多层基板包括多个树脂层和层间连接导体的层叠体，该层叠连接导体延伸穿过多个树脂层中的至少一个并且直接暴露于层压体的外部。

公开(公告)号：US09368261B2

公开(公告)日：2016-06-14

申请号：US14361057

申请日：2014-04-03

Applicant: Nuovo Film, Inc.

Inventor： Hakfei Poon

IPC: H01B13/30 ,  H01B1/22 ,  H01L31/0224 ,  G06F3/041 ,  H01L31/18 ,  H01B1/02

CPC classification number: H01B13/30 ,  G06F3/041 ,  G06F2203/04103 ,  G06F2203/04112 ,  H01B1/02 ,  H01B1/22 ,  H01L31/022466 ,  H01L31/1884 ,  H05K1/0274 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/09 ,  H05K2201/0302 ,  H05K2201/032

Abstract: Discloses herein is a method to make a transparent conductive electrode. The methods comprises providing a substrate, forming a film comprising a first region having a plurality of metal nanowires, wherein at least some of metal nanowires are surface functionalized and inert to oxidation or acid reactions; evaporating away the solvent in the metal nanowire film; exposing the nanowire film to a chemical reagent; forming a second region comprising nanowires, and annealing the film having the first and second region, wherein the resistivity difference between the first and second region is more than 1000.

公开(公告)号：US09307649B2

公开(公告)日：2016-04-05

申请号：US14257306

申请日：2014-04-21

Applicant: E I DU PONT DE NEMOURS AND COMPANY

Inventor： Kumaran Manikantan Nair ,  Scott E Gordon ,  Mark Frederick McCombs

IPC: H05K3/00 ,  H05K1/09 ,  H01B1/22 ,  H05K1/11 ,  H05K3/40

CPC classification number: H05K3/0094 ,  H01B1/22 ,  H05K1/09 ,  H05K1/092 ,  H05K1/095 ,  H05K1/115 ,  H05K3/4061 ,  H05K2201/032 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1126

Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.

Abstract translation: 公开了一种用于形成过渡通孔和过渡管线导体的组合物，用于最小化异种金属组合物之间电连接处的界面效应。 该组合物具有（a）选自（i）20-45wt％金和80-55wt％银和（ii）100wt％银 - 金固溶体合金的无机成分，和（b）有机 中。 该组合物还可以含有（c）基于组合物重量的1-5重量％的选自Cu，Co，Mg和Al的金属的氧化物或混合氧化物和/或主要含有 难熔氧化物。 组合物可以用作通孔填充物中的多层组合物。 也可以使用用于形成过渡通孔和过渡管线导体的组合物来形成诸如LTCC电路和器件的多层电路。