公开(公告)号：US20130141873A1

公开(公告)日：2013-06-06

申请号：US13324770

申请日：2011-12-13

Applicant: Toni Wald ,  Sven Liborius

Inventor： Toni Wald ,  Sven Liborius

IPC: H05K7/20 ,  F28F7/00 ,  H05K3/10

CPC classification number: H05K1/0209 ,  H05K1/0207 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10204

Abstract: The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.

Abstract translation: 本发明涉及使用表面贴装装置（SMD）冷却电子电路板的方法，该方法包括以下步骤：在电路板布局之后或期间填充空的空间V1，V2，V3，V4，V5，V6，V7， V8，V9，V10，其中多个散热装置1,2,3,4,5在热热点附近并将多个散热装置1,2,3,4,5连接到导热路径25 ，N号分别为27,29,31,33,35。 此外，本发明涉及适于实现根据本发明的方法的散热设备1,2,3,4,5。

公开(公告)号：US08420953B2

公开(公告)日：2013-04-16

申请号：US12941985

申请日：2010-11-08

Applicant: Meng-Che Yu

Inventor： Meng-Che Yu

IPC: H05K1/11

CPC classification number: H05K3/4015 ,  G11C29/24 ,  H05K1/141 ,  H05K3/4046 ,  H05K2201/10204 ,  H05K2201/10409 ,  H05K2203/162

Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.

Abstract translation: 虚拟存储卡包括电路板和金手指板。 电路板包括连接到第一电负载的第一导电元件和第二导电元件。 金手指板从电路板延伸并插入主板的存储槽中。 金指板包括第一电源引脚和第一接地引脚。 第一导电元件电连接到第一电源引脚。 第二导电元件电连接到第二电源引脚。

公开(公告)号：US08102660B2

公开(公告)日：2012-01-24

申请号：US12343563

申请日：2008-12-24

Applicant: Mitsuhiko Sugane ,  Kazuya Nishida ,  Akira Okada

Inventor： Mitsuhiko Sugane ,  Kazuya Nishida ,  Akira Okada

IPC: H05K1/00

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K3/341 ,  H05K2201/0715 ,  H05K2201/10204 ,  Y10T29/49124

Abstract: There is provided a multi-layer printed wiring board that can perform impedance control, concurrently maintaining the flexibility of a flexible portion with one or more signal lines. Such a multi-layer printed wiring board includes a plurality of rigid board units; and a flexible board unit, connecting outer layers or inner layers of the plurality of rigid board units and extending over the outer layers or the inner layers of the plurality of rigid board units. The flexible board unit includes a signal layer sending signals between the plurality of rigid board units; ground layers sandwiching the signal layer; and intermediate layers each interposed between the signal layer and one of the ground layers.

Abstract translation: 提供了可以执行阻抗控制的多层印刷线路板，同时保持具有一个或多个信号线的柔性部分的柔性。 这种多层印刷线路板包括多个刚性板单元; 以及柔性板单元，连接所述多个刚性板单元的外层或内层，并且在所述多个刚性板单元的外层或内层上延伸。 柔性板单元包括在多个刚性板单元之间发送信号的信号层; 夹层信号层的接地层; 以及每个介于信号层和一个接地层之间的中间层。

公开(公告)号：US20110253788A1

公开(公告)日：2011-10-20

申请号：US13087562

申请日：2011-04-15

Applicant: Andrew Campbell ,  Brian Docherty ,  James Churchman ,  Kevin Maidment ,  Nick McGarvey

Inventor： Andrew Campbell ,  Brian Docherty ,  James Churchman ,  Kevin Maidment ,  Nick McGarvey

IPC: G06K7/06

CPC classification number: G06K7/0013 ,  G06K7/0008 ,  H05K1/0219 ,  H05K1/0275 ,  H05K2201/09263 ,  H05K2201/10204

Abstract: The present invention detects the current flowing through the contacts of the smart card reader due to the presence of a “shim”. Small value resistors are connected in series with either the Power connection or the Ground connection, or both. Values are typically 47 milliohms to 100 milliohms. The use of such small values ensures that little voltage is dropped across the resistors and that the card is therefore adequately powered. With no card present, the current through these resistors should be zero and therefore the voltage across the resistors will also be zero. Amplifier circuits are employed to monitor and amplify the voltage across the resistors and in the “PayPod” design the amplifier outputs are connected to analogue to digital inputs on the microprocessor. Where the microprocessor (or other processing electronics) used has no analogue to digital inputs, separate analogue to digital circuits may be used. The microprocessor may then monitor the current flowing into the power supply contacts of the card reader.

Abstract translation: 本发明由于存在“垫片”而检测流过智能卡读卡器的触头的电流。 小值电阻器与电源连接或接地连接或两者连接。 值通常为47毫欧至100毫欧。 使用这样小的值确保电阻器上的电压几乎没有下降，因此卡片被充分供电。 没有存在卡，通过这些电阻的电流应为零，因此电阻两端的电压也将为零。 采用放大器电路来监视和放大电阻两端的电压，而在“PayPod”设计中，放大器输出端连接到微处理器上的模拟数字输入端。 在使用微处理器（或其他处理电子设备）没有模数转换器的情况下，可以使用单独的模数转换电路。 然后，微处理器可以监测流入读卡器的电源触点的电流。

公开(公告)号：US20110249416A1

公开(公告)日：2011-10-13

申请号：US13079940

申请日：2011-04-05

Applicant: Kiyofumi TAKAI

Inventor： Kiyofumi TAKAI

IPC: H05K7/00 ,  H05K3/30

CPC classification number: H05K3/284 ,  H01L21/561 ,  H01L23/3107 ,  H01L23/552 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/1531 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/023 ,  H05K3/0052 ,  H05K2201/0715 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In a circuit module, a chip element is mounted on a mount electrode, with an outer electrode interposed therebetween. The chip element is arranged such that a cut surface thereof is oriented toward a side of a circuit module that is adjacent to the mount electrode. A gap that is observable from outside of the circuit module is provided between a bottom surface of a base of the chip element and a top surface of a circuit board.

Abstract translation: 在电路模块中，芯片元件安装在安装电极上，其中插入有外部电极。 芯片元件布置成使得其切割表面朝向邻近安装电极的电路模块的侧面。 从电路模块外部观察到的间隙设置在芯片元件的基座的底表面和电路板的顶表面之间。

公开(公告)号：US20110140731A1

公开(公告)日：2011-06-16

申请号：US12958869

申请日：2010-12-02

Applicant: Swen Weitemeier ,  Christian Oldendorf

Inventor： Swen Weitemeier ,  Christian Oldendorf

IPC: G01R31/28

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: An electronic device, and associated method, provided with a circuit board (10) with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM), and a controller. The controller carries out a real-time test of the circuit board using a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive network having a characteristic transfer function and provided with at least one inductive element, which is formed by a conductor wire (201) wound into a coil around a break (202) in the circuit board (10), which in the assembled condition, is penetrated by a ferromagnetic bar or fixing pin (203), such that the inductance of the inductive element in the assembled state differs from the inductance thereof in the disassembled state.

Abstract translation: 一种具有电路板（10）的电子设备和相关方法，所述电路板具有一组输入触点（IN / COM），一组输出触点（OUT / COM）和连接在输入触点之间的电路（18） （IN / COM）和输出触点（OUT / COM）和控制器。 控制器使用引入到电路中的测试信号来执行电路板的实时测试，电路（18）被设计为具有特征传递函数并具有至少一个电感元件的无源网络，其中 由绕在电路板（10）中的断路（202）周围卷绕成线圈的导体线（201）形成，在组装状态下，该导体线被铁磁棒或固定销（203）穿透，使得电感 在组装状态下的电感元件与其分解状态下的电感不同。

公开(公告)号：US07944711B2

公开(公告)日：2011-05-17

申请号：US12396108

申请日：2009-03-02

Applicant: Elio Marioni

Inventor： Elio Marioni

IPC: H05K7/02

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

Abstract translation: 本发明涉及一种基本上包装状的分立电子部件，其类型包括主电源电路，主体或壳体，基本上平行六面体的电连接销和连接在主体内的所述电路的电连接销，并从所述主体突出以进行电连接 在电子印刷电路板上。 主体具有散热头部，其具有至少一个从主体出来并放置在平面上的表面，而销从主体突出出来，第一部分最初平行于平面延伸。 有利的是，在第一部分平行于平面之后，一对销具有基本上U形的弯曲，以便在焊接到散热中间管芯的步骤期间允许部件的更稳定的轴承。

公开(公告)号：US20100207651A1

公开(公告)日：2010-08-19

申请号：US12707930

申请日：2010-02-18

Applicant: Anthony J. Suto

Inventor： Anthony J. Suto

IPC: G01R31/02

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K3/3442 ,  H05K2201/10022 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A reliable and durable method of testing of printed circuit boards is presented. Test access components are placed in contact regions for providing electrical connectivity between test probes and the printed circuit board. In some cases, a test access component may be a surface mount resistor. The test access component may provide two points of contact for test probes to make electrical and mechanical contact with the printed circuit board. Test access components may also provide for increased durability of testing, allowing for a greater number of test contacts to be made between test probes and printed circuit boards than were previously possible.

Abstract translation: 介绍了一种可靠耐用的印刷电路板测试方法。 测试访问组件放置在接触区域中，以提供测试探针与印刷电路板之间的电连接。 在某些情况下，测试访问组件可能是表面贴装电阻。 测试访问组件可以为测试探针提供两个接触点，以与印刷电路板进行电气和机械接触。 测试访问组件还可以提供更高的测试耐久性，允许在测试探针和印刷电路板之间进行比以前更多的测试接触。

公开(公告)号：US20090180263A1

公开(公告)日：2009-07-16

申请号：US12008836

申请日：2008-01-14

Applicant: Christopher Lee Eriksen ,  Howard David Goldberg ,  John Charles Meyer

Inventor： Christopher Lee Eriksen ,  Howard David Goldberg ,  John Charles Meyer

IPC: H05K5/00 ,  H05K7/00 ,  B23P11/00

CPC classification number: H05K1/147 ,  H05K1/0256 ,  H05K2201/10204 ,  H05K2201/2036 ,  Y10T29/49826

Abstract: A compliant circuit element spacing system comprises a circuit board, a dummy spacer component, and a compliant circuit element. One or more active components are mounted to the circuit board. The dummy spacer component is also mounted to the circuit board, such that the dummy spacer component is electrically isolated from each active component mounted to the circuit board. The compliant circuit element is positionable proximate the circuit board, and spaced from the circuit board by the dummy spacer component. The spacing component isolates the compliant circuit element from each active component mounted to the circuit board.

Abstract translation: 兼容电路元件间隔系统包括电路板，虚拟间隔件部件和兼容电路元件。 一个或多个有源部件被安装到电路板。 虚拟间隔器部件也安装到电路板，使得虚拟间隔件部件与安装到电路板的每个有源部件电隔离。 柔性电路元件可靠近电路板定位，并且通过虚拟间隔器部件与电路板间隔开。 间隔部件将兼容电路元件与安装到电路板的每个有源部件隔离。

公开(公告)号：US20070194446A1

公开(公告)日：2007-08-23

申请号：US11657387

申请日：2007-01-24

Applicant: Hermann Ruckerbauer

Inventor： Hermann Ruckerbauer

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K1/14 ,  G11C5/04 ,  H01L2924/15311 ,  H05K1/0295 ,  H05K1/117 ,  H05K3/222 ,  H05K2201/044 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10204

Abstract: A memory module is proposed which has a first contact bank at a first edge of its electronic printed circuit board and a second contact bank at a second edge. The printed circuit board has first lines that reach from the first contact bank as far as input connections of at least some of the semiconductor components. The printed circuit board has second conductor lines that reach from output connections of at least some of the semiconductor components as far as the first contact bank. The printed circuit board has third conductor lines that reach from output connections of at least some of the semiconductor components as far as the second contact bank. The printed circuit board has fourth conductor lines that reach from the second contact bank as far as input connections of at least some of the semiconductor components.

Abstract translation: 提出一种存储器模块，其在其电子印刷电路板的第一边缘处具有第一触点组，在第二边缘处具有第二触点组。 印刷电路板具有从第一触点组到达至少一些半导体部件的输入连接的第一线。 印刷电路板具有从至少一些半导体部件的输出连接到达第一触点组的第二导体线。 印刷电路板具有从至少一些半导体部件的输出连接到达第二触点组的第三导体线。 印刷电路板具有从第二触点组到达至少一些半导体部件的输入连接的第四导体线。