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    Connection structure between substrate and component and its manufacturing method
    225.
    发明专利
    Connection structure between substrate and component and its manufacturing method 审中-公开
    基板与元件之间的连接结构及其制造方法

    公开(公告)号：JP2005340177A

    公开(公告)日：2005-12-08

    申请号：JP2005113557

    申请日：2005-04-11

    Applicant: Alps Electric Co Ltd ,  アルプス電気株式会社

    Inventor： TAKAI DAISUKE ,  SOEDA KAORU

    IPC: H01R33/76 ,  H01R12/00 ,  H01R13/24 ,  H05K1/18 ,  H05K3/32

    CPC classification number: H01R13/2435 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10628

    Abstract: PROBLEM TO BE SOLVED: To provide a connection structure between a substrate and a component, whereby the electronic component can be mounted to an electronic component with a simple connection structure in comparison with a conventional structure, the connection structure can be miniaturized, and the electronic component can be fixed and held on the substrate after electrically inspecting the electronic component, and its manufacturing method. SOLUTION: Connector members 3, 7 have fixed parts 3a, 7a and arm portions 3b, 7b, and the electronic component 2 is fixed and held on the substrate 1 by deforming the arm portions 3b, 7 so as to rise upward from the fixed parts 3a, 7a, and sandwiching the electronic component 2 between the arm portions 3b, 7b of the connector members 3, 7 to fix and hold the electronic component 2 on the substrate 1. By this structure, the connection structure can be miniaturized in comparison with the case in which an IC socket or the like is used, and the electronic component 2 can be surely and simply mounted to the substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI

    Abstract translation: 要解决的问题：为了提供基板和部件之间的连接结构，由此与常规结构相比，电子部件可以以简单的连接结构安装到电子部件，可以使连接结构小型化， 并且电子部件可以在电气检查电子部件之后固定并保持在基板上及其制造方法。

    解决方案：连接器构件3,7具有固定部分3a，7a和臂部分3b，7b，并且电子部件2通过使臂部3b，7变形而被固定并保持在基板1上，以便从 固定部分3a，7a，并且将电子部件2夹在连接器部件3,7的臂部3b，7b之间，以将电子部件2固定并保持在基板1上。通过这种结构，连接结构可以小型化 与使用IC插座等的情况相比，电子部件2能够可靠且简单地安装到基板1上。（C）2006年，JPO＆NCIPI

    Formation of inductance element
    226.
    发明专利
    Formation of inductance element 失效
    形成电感元件

    公开(公告)号：JPS61105810A

    公开(公告)日：1986-05-23

    申请号：JP22746784

    申请日：1984-10-29

    Applicant: Sanyo Electric Co Ltd ,  Tokyo Sanyo Electric Co Ltd

    Inventor： MIURA YOSHIO

    IPC: H01F27/29 ,  H01F41/04 ,  H05K3/32

    CPC classification number: H01F27/292 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285

    Abstract: PURPOSE:To form inductance elements without a break in an optional position on a circuit substrate by forming insulating coils into the inductance elements without a break directly on an insulating substrate with a supersonic bonding device. CONSTITUTION:After plural conductive routes 2, 2', 3 and 3' are formed on a circuit substrate 1 and plural bobbins 4 and 5 are arranged in both the first position and the second position, an end of a coil 7 is supersonically bonded on the conductive route 2 of the substrate 1 in the first position provided with another bobbin 4 with a supersonic bonding device. After the insulating coil 7 is wound on another bobbin 4 with revolving the circuit substrate 1, another end of the coil 7 is supersonically bonded to the other conductive route 2 in the first position provided with one bobbin 4. After the end of the insulating coil 7 is bonded on the conductive route 3 of the substrate 1 in the second position provided with another bobbin 5 through moving the table, the insulating coil 7 is wound on another bobbin 5 by predetermined number of turns, the second inductance element of a desired value is formed and another end of the insulating coil 7 is supersonically bonded to the other conductive route 3' in the second position.

    Abstract translation: 目的：通过在绝缘基板上直接用超音速接合装置形成绝缘线圈来形成绝缘线圈而在电路基板上的任选位置形成电感元件而不中断。 构成：在电路基板1上形成多个导电路线2,2'，3，3'之后，在第一位置和第二位置配置多个线轴4,5，将线圈7的端部超声波接合在 在第一位置的基板1的导电路径2设置有具有超音速接合装置的另一线轴4。 在使电路基板1旋转后，将绝缘线圈7卷绕在另一线轴4上之后，在设置有一个线轴4的第一位置，线圈7的另一端与另一方的导电路径2进行超声波接合。在绝缘线圈 7通过移动工作台而在设置有另一个线轴5的第二位置处接合在基板1的导电路径3上，绝缘线圈7以预定匝数卷绕在另一个线轴5上，第二电感元件为期望值 并且在第二位置中绝缘线圈7的另一端与另一导电路径3'超声结合。

    Inductance element
    227.
    发明专利
    Inductance element 失效
    电感元件

    公开(公告)号：JPS6197809A

    公开(公告)日：1986-05-16

    申请号：JP21994184

    申请日：1984-10-18

    Applicant: Sanyo Electric Co Ltd ,  Tokyo Sanyo Electric Co Ltd

    Inventor： MIURA YOSHIO

    IPC: H01F27/29 ,  H05K3/32 ,  H01F15/10

    CPC classification number: H05K3/328 ,  H01F27/292 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285

    Abstract: PURPOSE:To enable the incorporation of a coil in a hybrid IC or the like without heating the coil and to prevent the rare short of windings of a coil at assembly by fixing the end of a winding to a conductive path by supersonic oscillation. CONSTITUTION:After a conductive path 2 is formed into the desired pattern by etching after applying a copper foil over the whole surface of one of main planes of an insulating substrate 1. The coil 3 is formed by winding an insulating winding 5 around a drum core 4 made of ferrite. The insulating winding 5 is composed of a copper thin wire 6 and an insulating coat 7 covering a surface of said wire 6 and which consists of urethane or fluorinated ethylene. The connection of the end of winding of the coil 3 and the conductive path 2 is made by supersonic oscillation. Namely the end of winding of coil 3 is extended over the conductive path 2 and supersonic oscillation is applied to the winding 5 by arranging a capillary chip 9 for supplying supersonic oscillation of 20KHz-60KHz on the winding 5. At this time, the insulating coat 7 on a surface of the winding 5 is broken due to supersonic oscillation and the copper thin wire 6 is exposed partly. Because the material of which is the same as the copper of conductive path 2, the both can be bonded by supersonic oscillation.

    Abstract translation: 目的：为了能够在混合IC等中加入线圈，而不加热线圈，并且通过用超声波振荡将绕组的端部固定在导电路径上，防止组装时线圈的极少的短路。 构成：在绝缘基板1的一个主平面的整个表面上施加铜箔之后，通过蚀刻将导电路径2形成为期望的图案。线圈3通过将绝缘绕组5卷绕在鼓芯 4铁素体。 绝缘绕组5由铜细线6和覆盖所述线6的表面并由氨基甲酸乙酯或氟化乙烯组成的绝缘涂层7组成。 线圈3的绕组端与导电路径2的连接通过超音速振荡进行。 即，线圈3的绕组结束在导电路径2上延伸，并且通过在绕组5上设置用于提供20KHz-60KHz的超音速振荡的毛细管芯片9，向绕组5施加超音速振荡。此时，绝缘涂层 绕组5的表面7由于超音速振荡而断裂，部分地露出铜细线6。 由于其材料与导电路径2的铜相同，因此可以通过超音速振荡来结合二者。

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