公开(公告)号：US20070053051A1

公开(公告)日：2007-03-08

申请号：US10539388

申请日：2003-11-20

Applicant: Dirk Broer ,  Grietje Mol ,  Christiane De Witz

Inventor： Dirk Broer ,  Grietje Mol ,  Christiane De Witz

IPC: G02F1/01

CPC classification number: B29C37/0053 ,  B29C33/42 ,  B29C43/021 ,  B29C2035/0827 ,  B29L2011/0016 ,  B29L2031/756 ,  B81B3/0035 ,  B81B2201/047 ,  B81C2201/034

Abstract: The invention relates to a micro-mechanical thermal structure for modulating a light beam and a method for manufacturing such a structure. The micro-mechanical structure comprises two layers of material with different thermal expansion coefficients in a first direction and a second direction respectively, in which the first direction is transverse to the second direction and the two layers comprise an oriented polymer and the director of the molecules of the oriented polymer of the first layer is transverse to the director of the molecules of the oriented polymer of the second layer. An array of such micro-mechanical structures may form a thermo-optical modulator for modulating light. The method comprises a step of providing a mold with an orientation-inducing layer to obtain a molecular orientation in a mono-meric state of liquid crystalline monomers and a step of fixing the molecular orientation by photo-polymerization.

Abstract translation: 本发明涉及用于调制光束的微机械热结构及其制造方法。 微机械结构包括在第一方向和第二方向上分别具有不同热膨胀系数的两层材料，其中第一方向横向于第二方向，并且两层包括取向聚合物和分子的导向体 的第一层的取向聚合物横向于第二层的取向聚合物的分子的导向体。 这种微机械结构的阵列可以形成用于调制光的热光调制器。 该方法包括提供具有取向诱导层以获得液晶单体的单体状态的分子取向的模具和通过光聚合固定分子取向的步骤的步骤。

公开(公告)号：US07067306B2

公开(公告)日：2006-06-27

申请号：US10032280

申请日：2001-12-21

Applicant: Rahul Singhvi ,  Amit Kumar ,  George M. Whitesides ,  Donald E. Ingber ,  Gabriel P. Lopez ,  Daniel I. C. Wang ,  Gregory N. Stephanopoulos

Inventor： Rahul Singhvi ,  Amit Kumar ,  George M. Whitesides ,  Donald E. Ingber ,  Gabriel P. Lopez ,  Daniel I. C. Wang ,  Gregory N. Stephanopoulos

IPC: C12Q1/02 ,  C12Q1/04 ,  C12N11/02 ,  C12N11/08

CPC classification number: C12N1/00 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00385 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00619 ,  B01J2219/00621 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00659 ,  B01J2219/0072 ,  B81B2201/0214 ,  B81C1/00206 ,  B81C2201/034 ,  B82Y5/00 ,  B82Y30/00 ,  C12N5/0068 ,  C12N5/067 ,  C12N2535/10 ,  C12Q1/02 ,  C40B60/14

Abstract: The invention provides a device for adhering cells in a specific and predetermined position, and associated methods. The device includes a plate defining a surface and a plurality of cytophilic islands that adhere cells, isolated by cytophobic regions to which cells do not adhere, contiguous with the cytophilic islands. The islands or the regions or both may be formed of a self-assembled monolayer (SAM).

Abstract translation: 本发明提供一种用于将细胞粘附在特定和预定位置的装置以及相关方法。 该装置包括限定表面的板和多个细胞亲和岛，其附着细胞，由细胞不粘附的细胞渗透区隔离，与细胞色素岛邻接。 岛或区域或两者可以由自组装单层（SAM）形成。

公开(公告)号：US20050258571A1

公开(公告)日：2005-11-24

申请号：US11089101

申请日：2005-03-24

Applicant: Jarrett Dumond ,  Hong Low

Inventor： Jarrett Dumond ,  Hong Low

IPC: B28B11/08 ,  B29C59/02 ,  B81C1/00 ,  B81C99/00 ,  B82B3/00 ,  G03C5/00 ,  G03F7/00

CPC classification number: A61M25/00 ,  B27N3/08 ,  B28B3/06 ,  B81C99/0085 ,  B81C2201/034 ,  B81C2203/032 ,  B81C2203/038 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  Y10T428/24479 ,  Y10T428/254

Abstract: The present invention is directed to micro- and nano-scale imprinting methods and the use of such methods to fabricate supported and/or free-standing 3-D micro- and/or nano-structures of polymeric, ceramic, and/or metallic materials, particularly for pixel segregation in OLED-based displays. In some embodiments, a duo-mold approach is employed in the fabrication of these structures. In such methods, surface treatments are employed to impart differential surface energies to different molds and/or different parts of the mold(s). Such surface treatments permit the formation of three-dimensional (3-D) structures through imprinting and the transfer of such structures to a substrate. In some or other embodiments, such surface treatments and variation in glass transition temperature of the polymers used can facilitate separation of the 3-D structures from the molds to form free-standing micro- and/or nano-structures individually and/or in a film. In some or other embodiments, a “latch-on” assembly technique is utilized to form supported and/or free-standing stacked micro- and/or nano-structures that enable the assembly of polymers without a glass transition temperature and eliminate the heating required to assemble thermoplastic polymers.

Abstract translation: 本发明涉及微尺度和纳米级压印方法，并且使用这种方法来制造聚合物，陶瓷和/或金属材料的负载和/或独立的3-D微观和/或纳米结构 特别是用于基于OLED的显示器中的像素分离。 在一些实施例中，在制造这些结构中采用双模方法。 在这种方法中，使用表面处理以将不同的表面能赋予模具的不同模具和/或模具的不同部分。 这种表面处理允许通过压印形成三维（3-D）结构并将这种结构转移到基底上。 在一些或其它实施方案中，所使用的聚合物的这种表面处理和玻璃化转变温度的变化可促进3-D结构与模具的分离，以单独形成独立的和/或纳米结构，并且/ 电影。 在一些或其它实施方案中，使用“闭锁”组装技术来形成支撑和/或独立堆叠的微结构和/或纳米结构，其能够组装聚合物而不具有玻璃化转变温度并消除所需的加热 组装热塑性聚合物。

公开(公告)号：US20050142686A1

公开(公告)日：2005-06-30

申请号：US11064005

申请日：2005-02-24

Applicant: Kia Silverbrook

Inventor： Kia Silverbrook

IPC: B29C35/08 ,  B29C43/36 ,  B81B7/00 ,  B81C1/00 ,  G01P1/02 ,  G01P15/08 ,  H01L23/02 ,  H01L23/08 ,  H01L23/16 ,  H01L23/31 ,  H01L21/00

CPC classification number: H01L23/315 ,  B29C33/0022 ,  B29C43/36 ,  B29C2035/0822 ,  B29C2043/503 ,  B81B2201/0235 ,  B81B2207/056 ,  B81C1/00269 ,  B81C1/00333 ,  B81C1/00904 ,  B81C2201/034 ,  B81C2203/0127 ,  G01P1/023 ,  G01P15/0802 ,  H01L23/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/10253 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention relates to a method for forming a protective cap for a device. Typically, the device would be formed on a silicon wafer and is, for example, a MEMS device. The method involves the steps of locating thermosplastic material between a first wafer including a first recess and a second wafer including two second recesses. The first and second wafers are positioned relative to one another so that the first recess is in register with the two second recesses and the thermoplastic material is heated. The first and second wafers are pressed together so that heated thermosplastic material enters the first and second recesses and thereby forms the cap. A method for forming a plurality of protective caps for devices is also provided.

Abstract translation: 本发明涉及一种用于形成装置的保护盖的方法。 通常，器件将形成在硅晶片上，并且例如是MEMS器件。 该方法包括将热塑性材料定位在包括第一凹部的第一晶片和包括两个第二凹槽的第二晶片之间的步骤。 第一和第二晶片相对于彼此定位，使得第一凹槽与两个第二凹部对准，热塑性材料被加热。 将第一和第二晶片压在一起，使得加热的热塑性材料进入第一和第二凹槽，从而形成盖。 还提供了一种用于形成用于装置的多个保护盖的方法。

公开(公告)号：US20050112882A1

公开(公告)日：2005-05-26

申请号：US10945737

申请日：2004-09-20

Applicant: Marc Unger ,  Hou-Pu Chou ,  Todd Thorsen ,  Axel Scherer ,  Stephen Quake

Inventor： Marc Unger ,  Hou-Pu Chou ,  Todd Thorsen ,  Axel Scherer ,  Stephen Quake

IPC: G03F7/20 ,  B01L3/00 ,  B81B1/00 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  C12Q1/68 ,  F04B17/00 ,  F04B35/04 ,  F04B43/04 ,  F15C5/00 ,  F16K7/00 ,  F16K17/02 ,  F16K99/00 ,  H01L21/302 ,  H01L21/461

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US20040178537A1

公开(公告)日：2004-09-16

申请号：US10739721

申请日：2003-12-18

Inventor： Quentin F. Polosky

IPC: B29C045/40 ,  B29C045/73

CPC classification number: B81C99/0085 ,  B01L3/502707 ,  B01L2200/12 ,  B29C33/76 ,  B29C45/2628 ,  B81B2201/058 ,  B81B2203/0338 ,  B81C2201/019 ,  B81C2201/034

Abstract: Injection molding techniques to form a microfluidic structure or substrate having at least one flash-free aperture. A method comprises injecting a polymeric material into a cavity of a mold. The mold includes at least one pin extending a length into the cavity wherein the length is greater than a depth of the cavity such that the pin is compressed when the mold is closed. Material injected into the cavity is shut off from the space occupied by the pin and consequently, undesirable flash is avoided. The mold is opened and the substrate is removed from the mold. The pin may be integral with the mold, discrete, or be comprised of individual components which can be combined together when the mold is closed to form a solid body. Preferably, the length of the pin is at least about 60 microns greater than the depth of the cavity.

Abstract translation: 注射成型技术以形成具有至少一个无闪光孔的微流体结构或基底。 一种方法包括将聚合物材料注入模具的空腔中。 模具包括至少一个将长度延伸到空腔中的销，其中长度大于空腔的深度，使得当模具关闭时销被压缩。 注入空腔的材料与销钉占据的空间切断，因此避免了不期望的闪光。 打开模具，将基材从模具中取出。 销可以与模具成一体，离散的，或由单独的部件组成，当模具关闭以形成固体时，该部件可以组合在一起。 优选地，销的长度比空腔的深度大至少大约60微米。

公开(公告)号：US20040164454A1

公开(公告)日：2004-08-26

申请号：US10373251

申请日：2003-02-24

Applicant: The Procter & Gamble Company

Inventor： Vladimir Gartstein ,  Faiz Feisal Sherman

IPC: B29C043/22

CPC classification number: B81C1/00111 ,  A61M37/0015 ,  A61M2037/003 ,  A61M2037/0053 ,  B26F1/24 ,  B26F1/26 ,  B81B2201/055 ,  B81C2201/034 ,  B81C2201/036

Abstract: A method is provided for manufacturing microstructures of the type which contain a substrate and an array of protruding microelements with through-holes, which are used in penetrating layers of skin. The microelements are embossed or pressed into an initial substrate structure, which in some embodiments is formed from extruded polymeric material, and in some cases from two layers of polymer that are co-extruded. The through-holes are formed from filled through-cylinders of a second material that is removed after the embossing or pressing step; in other instances, the through-holes are left hollow during the embossing or pressing step.

Abstract translation: 提供了一种用于制造包含基底的微结构的方法和具有通孔的突出微元件阵列，其用于穿透皮肤层。 微元件被压花或压制成初始的基底结构，其在一些实施方案中由挤出的聚合物材料形成，并且在一些情况下由共挤出的两层聚合物形成。 通孔由在压花或压制步骤之后被去除的第二材料的填充的通孔形成; 在其他情况下，在压花或压制步骤期间，通孔留空。

公开(公告)号：US06660192B1

公开(公告)日：2003-12-09

申请号：US09634201

申请日：2000-08-09

Applicant: Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca J. Jackman ,  Xiao-Mei Zhao ,  Stephen P. Smith ,  Mara G. Prentiss ,  George M. Whitesides ,  Christian Marzolin

Inventor： Enoch Kim ,  Younan Xia ,  Milan Mrksich ,  Rebecca J. Jackman ,  Xiao-Mei Zhao ,  Stephen P. Smith ,  Mara G. Prentiss ,  George M. Whitesides ,  Christian Marzolin

IPC: B29D1100

CPC classification number: B81C1/00206 ,  A61K47/6957 ,  B01J19/0046 ,  B01J2219/00382 ,  B01J2219/00416 ,  B01J2219/0043 ,  B01J2219/00466 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00619 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00648 ,  B01J2219/00659 ,  B01J2219/00713 ,  B29C31/04 ,  B29C33/42 ,  B29C37/0053 ,  B29C39/24 ,  B29C43/021 ,  B29C67/246 ,  B29D11/00346 ,  B29D11/00663 ,  B29K2105/0002 ,  B29L2011/0016 ,  B81B2201/0214 ,  B81C1/00031 ,  B81C99/0085 ,  B81C2201/034 ,  B82Y30/00 ,  C40B60/14 ,  G01N21/7703 ,  G01N2021/7776 ,  G02B6/138 ,  H05K3/0079 ,  H05K3/061

Abstract: Chemically or biochemically active agents or other species are patterned on a substrate surface by providing a micromold having a contoured surface and forming, on a substrate surface, a chemically or biochemically active agent or fluid precursor of a structure. A chemically or biochemically active agent or fluid precursor also can be transferred from indentations in an applicator to a substrate surface. The substrate surface can be planar or non-planar. Fluid precursors of polymeric structures, inorganic ceramics and salts, and the like can be used to form patterned polymeric articles, inorganic salts and ceramics, reactive ion etch masks, etc. at the surface. The articles can be formed in a pattern including a portion having a lateral dimension of less than about 1 millimeter or smaller. The indentation pattern of the applicator can be used to transfer separate, distinct chemically or biochemically active agents or fluid precursors to separate, isolated regions of a substrate surface. Waveguide arrays, combinatorial chemical or biochemical libraris, etc. can be made. Differences in refractive index of waveguide and cladding can be created by subjecting the waveguide and cladding, made of indentical prepolymeric material, to different polymerization or cross-linking conditions. Interferometers are defined by coupling arrays of waveguides, where coupling can be controlled by altering the difference in refractive index between cladding and waveguide at any desired location of the array. Alteration and refractive index can be created photochemically, chemically, or the like. Sensors also are disclosed, including biochemical sensors.

Abstract translation: 化学或生物化学活性剂或其它物质通过提供具有轮廓表面的微胶体并在基底表面上形成结构的化学或生物化学活性剂或流体前体而在基底表面上图案化。 化学或生物化学活性剂或流体前体也可以从敷料器中的凹陷转移到基底表面。 衬底表面可以是平面的或非平面的。 聚合物结构，无机陶瓷和盐等的流体前体可用于在表面形成图案化聚合物制品，无机盐和陶瓷，反应离子蚀刻掩模等。 制品可以形成为包括横向尺寸小于约1毫米或更小的部分的图案。 涂抹器的压痕图案可以用于将单独的，不同的化学或生物化学活性剂或流体前体转移到基底表面的分离的，分离的区域。 可以制作波导阵列，组合化学或生化图谱等。 波导和包层的折射率差异可以通过将由凹凸预聚物材料制成的波导和包层进行不同的聚合或交联条件来产生。 干涉仪通过耦合波导阵列来定义，其中可以通过改变阵列的任何所需位置处的包层和波导之间的折射率差来控制耦合。 改变和折射率可以通过光化学，化学等方式产生。 还公开了传感器，包括生化传感器。

公开(公告)号：US6408878B2

公开(公告)日：2002-06-25

申请号：US79666601

申请日：2001-02-28

Applicant: CALIFORNIA INST OF TECHN

Inventor： UNGER MARC A ,  CHOU HOU-PU ,  THORSEN TODD A ,  SCHERER AXEL ,  QUAKE STEPHEN R

IPC: G03F7/20 ,  B01L3/00 ,  B81B1/00 ,  B81B3/00 ,  B81B7/00 ,  B81C1/00 ,  B81C99/00 ,  C12Q1/68 ,  F04B17/00 ,  F04B35/04 ,  F04B43/04 ,  F15C5/00 ,  F16K7/00 ,  F16K17/02 ,  F16K99/00 ,  F16K11/20

CPC classification number: B29C51/00 ,  B01L3/502707 ,  B01L3/50273 ,  B01L3/502738 ,  B01L2300/0861 ,  B01L2300/0887 ,  B01L2300/123 ,  B01L2400/046 ,  B01L2400/0481 ,  B01L2400/0655 ,  B33Y80/00 ,  B81B5/00 ,  B81B2201/036 ,  B81B2201/054 ,  B81C1/00119 ,  B81C2201/019 ,  B81C2201/034 ,  C12Q1/6874 ,  F04B43/043 ,  F15C1/06 ,  F15C5/00 ,  F16K11/20 ,  F16K13/00 ,  F16K31/126 ,  F16K99/0001 ,  F16K99/0015 ,  F16K99/0046 ,  F16K99/0048 ,  F16K99/0051 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0076 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0094 ,  Y10T137/0491 ,  Y10T137/0497 ,  Y10T137/2224 ,  Y10T137/87249 ,  Y10T156/10 ,  Y10T428/24479 ,  Y10T428/24744 ,  C12Q2535/125

Abstract: A method of fabricating an elastomeric structure, comprising: forming a first elastomeric layer on top of a first micromachined mold, the first micromachined mold having a first raised protrusion which forms a first recess extending along a bottom surface of the first elastomeric layer; forming a second elastomeric layer on top of a second micromachined mold, the second micromachined mold having a second raised protrusion which forms a second recess extending along a bottom surface of the second elastomeric layer; bonding the bottom surface of the second elastomeric layer onto a top surface of the first elastomeric layer such that a control channel forms in the second recess between the first and second elastomeric layers; and positioning the first elastomeric layer on top of a planar substrate such that a flow channel forms in the first recess between the first elastomeric layer and the planar substrate.

公开(公告)号：US06372542B1

公开(公告)日：2002-04-16

申请号：US09622398

申请日：2000-10-19

Applicant: Hans Göran Evald Martin ,  Per Ove Öhman

Inventor： Hans Göran Evald Martin ,  Per Ove Öhman

IPC: H01L2166

CPC classification number: B81C1/0046 ,  B81B2201/0214 ,  B81B2203/0136 ,  B81C2201/034 ,  G01J5/12 ,  G01N21/3504 ,  G02B6/3652 ,  G02B6/3696 ,  G02B6/4219 ,  G02B6/423 ,  G02B6/4246 ,  H01L21/4803 ,  H01L35/08 ,  H01L35/34

Abstract: The present invention relates to a method of producing an electric, electronic, electromechanical and/or mechanical component (12), where the component substrate is given a three-dimensional structure (3″) or configuration, and where said substrate is adapted for further treatment or processing to form the component (12). The substrate is formed by shaping said substrate against a die or mold, such as by molding, pressing, extruding or embossing said substrate, wherewith the precision necessary with respect to said component in the three-dimensional structure is achieved by means of a micromechanical working process when producing the die or mold.

Abstract translation: 本发明涉及一种制造电气，电子，机电和/或机械部件（12）的方法，其中部件基板被给予三维结构（3“）或构造，并且其中所述基板适于 进一步处理或加工以形成组分（12）。 通过将所述基板抵靠模具或模具成形，例如通过模制，压制，挤压或压印所述基板而形成基板，其中相对于所述三维结构中的所述部件所需的精度通过微机械加工 生产模具或模具时的过程。