公开(公告)号：EP2221863A1

公开(公告)日：2010-08-25

申请号：EP09180923.6

申请日：2009-12-30

Applicant: Empire Technology Development LLC

Inventor： Kruglick, Ezekiel

IPC: H01L21/768

CPC classification number: H01L21/76885 ,  B82Y30/00 ,  H01L21/288 ,  H01L21/76802 ,  H01L21/76817 ,  H01L21/76834 ,  H01L21/76877 ,  H01L2221/1094 ,  H05K3/1275 ,  H05K2201/026 ,  Y10S977/762

Abstract: Implementations of encapsulated nanowires are disclosed.
In one embodiment the nanowires are produced by patterning a surface layer to form nanometer-sized features, disposing conductive material in the features to form the nanowires, removing the surface layer and diposing insulating material on the nanowires.
In one embodiment, said patterning may include forming nanometer-sized cracks in said surface layer, wherein the surface layer comprises stressed silicon dioxide.
Said disposing conductive material may include using super critical carbon dioxide.
Said disposing insulating material may include one or more self-assembled monolayers.

Abstract translation: 公开了封装的纳米线的实现。 在一个实施例中，通过图案化表面层以形成纳米尺寸的特征，在特征中设置导电材料以形成纳米线，去除纳米线上的表面层和掺杂绝缘材料来制造纳米线。 在一个实施例中，所述图案化可以包括在所述表面层中形成纳米尺寸的裂纹，其中所述表面层包括应力二氧化硅。 所述设置的导电材料可以包括使用超临界二氧化碳。 所述配置绝缘材料可以包括一个或多个自组装单层。

公开(公告)号：EP1738378A4

公开(公告)日：2010-05-05

申请号：EP05760196

申请日：2005-03-08

Applicant: NANOSYS INC

Inventor： CHOW CALVIN ,  DUBROW ROBERT

IPC: H01G4/008 ,  H01G4/005 ,  H01G4/06 ,  H01G4/08

CPC classification number: H01G4/008 ,  H01G4/005 ,  H01G4/06 ,  H01G4/203 ,  H01G4/33 ,  H01G9/04 ,  H01G11/36 ,  H01G11/46 ,  H01L28/82 ,  H05K1/162 ,  H05K2201/026 ,  Y02E60/13

公开(公告)号：EP1976351A3

公开(公告)日：2009-07-15

申请号：EP08152161.9

申请日：2008-02-29

Applicant: Fujitsu Ltd.

Inventor： Nihei, Mizuhisa ,  Sato, Shintaro ,  Kondo, Daiyu ,  Awano, Yuji

IPC: H05K3/14 ,  H05K1/00 ,  H05K1/09 ,  H01L21/768 ,  H01L23/532

CPC classification number: B82Y10/00 ,  H01L21/76879 ,  H01L23/53276 ,  H01L2221/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0293 ,  H05K1/09 ,  H05K3/146 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/173 ,  Y10T29/49169 ,  Y10T29/49194 ,  Y10T29/49222 ,  H01L2924/00

Abstract: A CNT bundle is formed by growing a plurality of CNTs from opposing surfaces of contact blocks toward mutual opposing surfaces, and by contacting the CNTs so that they intersect to electrically connect with each other. Subsequently, a gap of the electrically connected CNT bundle is filled with a metal material, to thereby form a wiring being a composite state of the CNT bundle and the metal material.

公开(公告)号：EP1965438A2

公开(公告)日：2008-09-03

申请号：EP08103188.2

申请日：2006-08-14

Applicant: Cambrios Technologies Corporation

Inventor： Alden, Jonathan ,  Dai, Haixia ,  Knapp, Michael R ,  Na, Shuo ,  Pakbaz, Hash ,  Pschenitzka, Florian ,  Quan, Xina ,  Spaid, Michael, A ,  Wolk, Jeffrey ,  Winoto, Adrian

IPC: H01L31/0224 ,  H01B1/22 ,  G02F1/1333 ,  G02F1/1335 ,  G02B5/02 ,  H01L21/768

CPC classification number: H01B1/22 ,  B22F2998/00 ,  B82Y20/00 ,  B82Y30/00 ,  C03C17/007 ,  C03C17/008 ,  C03C2217/445 ,  C03C2217/479 ,  C09D11/52 ,  C23F11/02 ,  C30B7/02 ,  C30B29/02 ,  C30B29/60 ,  C30B33/00 ,  G02F1/13439 ,  H01L27/14623 ,  H01L31/02164 ,  H01L31/022466 ,  H01L2224/45139 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/12044 ,  H01L2924/3011 ,  H05K1/0269 ,  H05K1/097 ,  H05K3/048 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/026 ,  H05K2201/10128 ,  H05K2203/1545 ,  Y10S977/762 ,  B22F1/0025 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01039

Abstract: A Transparent conductor including a conductive layer coated on a substrate is described. More specifically, the conductive layer comprises a network of nanowires which may be embedded in a matrix. The conductive layer is optically transparent and flexible. It can be coated or laminated onto a variety of substrates, including flexible and rigid substrates.

Abstract translation: 描述了包括涂覆在基板上的导电层的透明导体。 更具体地说，导电层包括可嵌入矩阵中的纳米线网络。 导电层是光学透明且柔韧的。 它可以被涂覆或层压到各种基材上，包括柔性和刚性基材。

公开(公告)号：EP1810329A2

公开(公告)日：2007-07-25

申请号：EP05799869.2

申请日：2005-11-04

Applicant: Koninklijke Philips Electronics N.V.

Inventor： WYLAND, Chris

IPC: H01L23/373

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L23/14 ,  H01L23/3128 ,  H01L23/373 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners to provide structural support and/or thermal conductivity. In some instances, the carbon nanotube structure is arranged to provide substantially all structural support for an integrated circuit arrangement. In other instances, the carbon nanotube structure is arranged to dissipate heat throughout the substrate. In still other instances, the carbon nanotube structure is arranged to remove heat from selected portions of the carbon nanotube substrate.

公开(公告)号：EP1634342A2

公开(公告)日：2006-03-15

申请号：EP04821363.1

申请日：2004-02-17

Applicant: MacDermid, Incorporated

Inventor： CULLEN, Donald, P.

IPC: H01L51/40 ,  H01L51/00 ,  H01L35/24

CPC classification number: H05K3/02 ,  B82Y10/00 ,  H01L51/0015 ,  H01L51/0021 ,  H01L51/0048 ,  H05K1/0373 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/107 ,  H05K2203/1142 ,  Y10S977/932

Abstract: An improved method of fabricating an electronic interconnect device using direct imaging of dielectric composite material by the inclusion of a conducting material in the composite material that becomes non-conducting through exposure to electromagnetic radiation. The conducting material generally comprises single-wall carbon nanotubes.

公开(公告)号：EP1422563A1

公开(公告)日：2004-05-26

申请号：EP03256824.8

申请日：2003-10-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Park, Jong Jin ,  Lee, Jae Jun, 517/704 Sinnamusil ,  Jung, Myung Sup

IPC: G03F7/027

CPC classification number: H05K3/02 ,  B82Y10/00 ,  B82Y30/00 ,  G03F7/027 ,  H01L51/0048 ,  H01L51/0052 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/0514 ,  Y10S977/89

Abstract: Disclosed herein is a method of forming a negative pattern of carbon nanotubes through: modifying the surfaces of carbon nanotubes to have double bond-containing functional group capable of participating in radical polymerization; coating a substrate with a liquid coating composition prepared by dispersing the surface-modified carbon nanotubes in an organic solvent along with a photoinitiator; exposing the film to UV light through a photomask to induce radical polymerization of the carbon nanotubes; and developing the film. By virtue of the present invention, desired patterns of carbon nanotubes can be easily made on the surfaces of various substrates according to the conventional photolithography procedure.

Abstract translation: 公开的是通过在形成碳纳米管的负图案的方法：修饰碳纳米管的表面，以具有能够参与自由基聚合的双键的官能团; 涂布用的光引发剂沿所述表面改性的碳纳米管分散在有机溶剂中而制备的组合物的液体涂层的底物; 通过光掩模暴露所述膜于UV光以诱导碳纳米管的自由基聚合; 和发展电影。 凭借本发明的，碳纳米管的期望的图案可容易地各种基板gemäß的表面上以传统的光刻法过程上进行的。

公开(公告)号：EP3400264A1

公开(公告)日：2018-11-14

申请号：EP16882816.8

申请日：2016-04-19

Applicant: National Research Council of Canada

Inventor： DING, Jianfu ,  LI, Zhao ,  MALENFANT, Patrick

IPC: C09C3/10 ,  C08G61/00 ,  C09C1/44 ,  C09D11/52

CPC classification number: C09D11/52 ,  C01B32/159 ,  C01B32/172 ,  C01B2202/02 ,  C01B2202/22 ,  C08G61/02 ,  C08G61/122 ,  C08G2261/1424 ,  C08G2261/148 ,  C08G2261/3142 ,  C08G2261/3221 ,  C08G2261/411 ,  C09D11/037 ,  C09D11/102 ,  H05K1/095 ,  H05K1/097 ,  H05K2201/026 ,  H05K2201/0323 ,  C08K3/041 ,  C08L65/00

Abstract: A single-walled carbon nanotube composition includes single-walled carbon nanotubes substantially enriched in semiconducting single-walled carbon nanotubes in association with a polymer having one or more oligoether side groups. The oligoether side groups render the composition dispersable in polar organic solvents, for example alkyl carbitols, permitting formulation of ink compositions containing single-walled carbon nanotubes substantially enriched in semiconducting single-walled carbon nanotubes. Such ink compositions may be readily printed using common printing methods, such as inkjet, flexography and gravure printing.

公开(公告)号：EP2496661B1

公开(公告)日：2018-07-11

申请号：EP10790862.6

申请日：2010-11-02

Applicant: Yissum Research Development Company of the Hebrew University of Jerusalem, Ltd.

Inventor： MAGDASSI, Shlomo ,  GROUCHKO, Michael ,  LAYANI, Michael

IPC: H01B1/02 ,  C23C4/18 ,  C23C26/00 ,  H01B1/10 ,  H01L31/18 ,  H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

公开(公告)号：EP3318113A1

公开(公告)日：2018-05-09

申请号：EP16741177.6

申请日：2016-06-22

Applicant: 3M Innovative Properties Company

Inventor： STAY, Matthew S. ,  DODDS, Shawn C. ,  GILMAN, Ann Marie ,  PEKUROVSKY, Mikhail L. ,  THEIS, Daniel J. ,  SMITH, Matthew R.

IPC: H05K3/40 ,  H05K3/46 ,  H05K1/09 ,  G06F3/041 ,  B41N1/00 ,  H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/4679 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/097 ,  H05K1/115 ,  H05K3/0091 ,  H05K3/0097 ,  H05K3/10 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/4644 ,  H05K3/4664 ,  H05K2201/026 ,  H05K2203/1173 ,  H05K2203/1545 ,  H05K2203/166

Abstract: A composite article includes a conductive layer with nanowires on at least a portion of a flexible substrate, wherein the conductive layer has a conductive surface. A patterned layer of a low surface energy material is on a first region of the conductive surface. An overcoat layer free of conductive particulates is on a first portion of a second region of the conductive surface unoccupied by the patterned layer. A via is in a second portion of the second region of the conductive surface between an edge of the patterned layer of the low surface energy material and the overcoat layer. A conductive material is in the via to provide an electrical connection to the conductive surface.