公开(公告)号：US5047279A

公开(公告)日：1991-09-10

申请号：US433132

申请日：1989-11-08

Applicant: Yoshihiro Nasu ,  Kazuyuki Mitsuhashi

Inventor： Yoshihiro Nasu ,  Kazuyuki Mitsuhashi

IPC: B32B15/08 ,  B29B15/08 ,  B29C70/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/46

CPC classification number: B29B15/08 ,  B29C70/08 ,  H05K3/0052 ,  H05K3/4626 ,  H05K3/4655 ,  B29C2793/0081 ,  B29K2105/0845 ,  B29K2105/0854 ,  B29K2309/08 ,  H05K1/0366 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/09827 ,  H05K3/4611 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T428/24479 ,  Y10T428/24917

Abstract: A multilayer printed circuit board comprising a laminate of at least one glass fiber nonwoven cloth layer impregnated with thermosetting resin and glass fiber woven cloth layers impregnated with thermosetting resin, the laminate having a pair of V-cut grooves formed therein so that only the glass fiber nonwoven cloth layer remains uncut whereby the multilayer printed circuit board can be divided at the uncut glass fiber nonwoven cloth layer along the V-cut grooves into a plurality of printed circuit board portions which can be mounted having a practical size.

Abstract translation: 一种多层印刷电路板，其包括浸渍有热固性树脂的至少一层玻璃纤维无纺布层和浸渍有热固性树脂的玻璃纤维织布层的层压体，所述层压体具有形成在其中的一对V形切槽，使得仅玻璃纤维 非织造布层保持未切割，由此可以将多层印刷电路板沿未切割的玻璃纤维无纺布层沿着V形切割槽划分成多个能够安装具有实际尺寸的印刷电路板部分。

公开(公告)号：US4897301A

公开(公告)日：1990-01-30

申请号：US821304

申请日：1986-01-22

Applicant: Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

Inventor： Keiichi Uno ,  Yoshimi Ishinami ,  Masaaki Nakamura ,  Tomohiko Nakao

IPC: D04H1/42 ,  D04H1/64 ,  H05K1/03

CPC classification number: H05K1/0326 ,  D04H1/4342 ,  D04H1/4382 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10S428/902 ,  Y10S428/92 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/27 ,  Y10T428/31681 ,  Y10T428/31736 ,  Y10T442/2861 ,  Y10T442/656

Abstract: A flexible sheet which comprises a non-woven fabric made predominantly from a poly(aromatic amide) component which is impregnated with a heat- and/or light-curable resin, wherein the non-woven fabric satisfies the following conditions:5 g/m.sup.2

Abstract translation: 一种柔性片材，其包含主要由浸渍有热和/或光可固化树脂的聚（芳香族酰胺）成分制成的无纺织物，其中所述无纺布满足以下条件：5g / m 2 单位面积重量<35g / m 2，0.15g / cm 3密度<0.8g / cm 3，具有良好的平衡性，例如优异的热尺寸稳定性，耐热性（耐焊接性），耐水性 ，耐溶剂性，电绝缘性能和机械性能，并且可用于制备柔性印刷电路板，以及其用于柔性覆金属层压板和柔性印刷电路板的用途。

公开(公告)号：US4876120A

公开(公告)日：1989-10-24

申请号：US40981

申请日：1987-04-21

Applicant: Robert E. Belke ,  Louis Zakraysek ,  Walter O. Pillar

Inventor： Robert E. Belke ,  Louis Zakraysek ,  Walter O. Pillar

IPC: B32B27/06 ,  C09K19/38 ,  H05K1/03 ,  H05K3/46

CPC classification number: B32B27/06 ,  C09K19/3823 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/036 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  H05K3/4611 ,  H05K3/4626 ,  Y10S428/901 ,  Y10T428/1077 ,  Y10T428/2481 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(paraphenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. The presently preferred liquid crystal polymer comprises poly(para-phenylene benzobisthiazole). The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/.degree. C. MLPWBs constructed of polymeric core layers also are possible utilizing the preferred liquid crystal polymers of the present invention.

Abstract translation: 公开了可用于制造多层印刷线路板（MLPWB）和层压板的改进的层压板。 这种改进的复合材料包含至少一层，其由选自聚（对亚苯基苯并噻唑），聚（对苯撑苯并异恶唑），聚（2,5-苯并噻唑），聚（2,5） 苯并恶唑）及其混合物。 目前优选的液晶聚合物包括聚（对亚苯基苯并噻唑）。 液晶聚合物的负膨胀系数和高弹性模量使得能够制造层压板和MLPWB，其具有大致为约0至15ppm /℃的约定热膨胀系数。由聚合物芯构成的MLPWB 利用本发明的优选液晶聚合物也可以使用层。

公开(公告)号：US4729921A

公开(公告)日：1988-03-08

申请号：US775577

申请日：1985-09-17

Applicant: Edward W. Tokarsky

Inventor： Edward W. Tokarsky

IPC: D21H13/26 ,  D01F6/60 ,  D21H20060101 ,  D21H17/46 ,  H05K20060101 ,  H05K1/03 ,  D21H5/12

CPC classification number: H05K1/0366 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10T428/25 ,  Y10T428/253 ,  Y10T428/268

Abstract: High density para-aramid papers comprising 5 to 25 percent, by weight, binder and an amount of para-aramid fibers selected from the group consisting of para-aramid pulp, para-aramid floc and mixtures thereof, compacted to provide a volume percent para-aramid fiber of at least 53 minus 0.13 times the volume percent floc in the paper are useful in the preparation of circuit board substrates having a low coefficient of thermal expansion.

Abstract translation: 包含5至25重量％的粘合剂和选自对位芳族聚酰胺纸浆，对位芳族聚酰胺絮凝物及其混合物的对位芳族聚酰胺纤维的高密度对位芳族聚酰胺纸，压制成提供体积百分比的对位芳族聚酰胺纸 纸的体积百分比絮体的至少53减去0.13倍的芳纶纤维可用于制备具有低热膨胀系数的电路板基材。

公开(公告)号：US4578308A

公开(公告)日：1986-03-25

申请号：US647638

申请日：1984-09-06

Applicant: Kiyoshi Hani ,  Takako Takei ,  Minekazu Kodama ,  Toshiyuki Sugano

Inventor： Kiyoshi Hani ,  Takako Takei ,  Minekazu Kodama ,  Toshiyuki Sugano

IPC: B32B15/092 ,  B32B5/28 ,  B32B15/08 ,  D21H13/02 ,  D21H13/10 ,  D21H13/46 ,  D21H17/38 ,  D21H17/46 ,  D21H17/67 ,  H05K1/03 ,  B32B5/22 ,  B32B15/12

CPC classification number: H05K1/0366 ,  B32B15/08 ,  D21H13/46 ,  D21H13/02 ,  D21H13/10 ,  D21H17/38 ,  D21H17/46 ,  D21H17/67 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/903 ,  Y10S428/904 ,  Y10T428/31703 ,  Y10T442/616 ,  Y10T442/693

Abstract: A laminated board lined with thermally and electrically conductive material, which comprises:(a) a prepreg sheet formed of an alumina paper made from a mixture of alumina fibril, as the principal component, having a fiber diameter of 100 microns or smaller and a fiber length which is ten times or more as long as the fiber diameter, and microfibrillar organic fiber as a binding agent, and a thermosetting resin; and(b) an electrically conductive material in foil such as copper or aluminum bonded to said prepreg sheet.

Abstract translation: 一种衬有导热材料的层压板，包括：（a）由氧化铝纸制成的预浸薄板，该氧化铝纸由氧化铝原纤维作为主要成分的混合物制成，纤维直径为100微米或更小，纤维 长度为纤维直径的十倍以上的长度，作为粘合剂的微原纤维有机纤维，以及热固性树脂; 和（b）结合到所述预浸料片上的诸如铜或铝的箔中的导电材料。

公开(公告)号：US4559264A

公开(公告)日：1985-12-17

申请号：US461566

申请日：1983-01-27

Applicant: Syed N. Hoda ,  Anthony R. Olszewski

Inventor： Syed N. Hoda ,  Anthony R. Olszewski

IPC: C04B35/16 ,  C01B33/26 ,  C01B33/40 ,  C01B33/42 ,  C01B33/44 ,  D21H13/36 ,  D21H13/44 ,  D21H17/67 ,  D21H19/24 ,  H01B3/04 ,  H01B3/52 ,  H05K1/03 ,  B32B19/00 ,  B32B27/38

CPC classification number: H05K1/0366 ,  D21H13/44 ,  H05K2201/0293 ,  H05K2201/068 ,  Y10S428/901 ,  Y10T428/251 ,  Y10T428/2911 ,  Y10T428/31518

Abstract: There are disclosed synthetic mica papers, substrates produced by laminating such papers, and use of the substrates in printed circuit assemblies. The mica paper is composed primarily of overlapping, ion-exchanged platelets of a synthetic, lithium and/or sodium, water-swelling mica, and is impregnated with an organic resin.

Abstract translation: 公开了合成云母纸，通过层压这样的纸制造的基板以及印刷电路组件中的基板的使用。 云母纸主要由合成，锂和/或钠水溶胀云母的重叠离子交换的血小板组成，并用有机树脂浸渍。

公开(公告)号：US4477512A

公开(公告)日：1984-10-16

申请号：US490061

申请日：1983-04-29

Applicant: Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

Inventor： Wilbur R. Thomas ,  Fred E. Hickman, III ,  George J. Knight

IPC: C08L61/00 ,  B32B15/08 ,  B32B15/092 ,  B32B27/04 ,  C08G59/00 ,  C08G59/30 ,  C08G59/32 ,  C08G59/38 ,  C08G59/40 ,  C08G59/62 ,  C08J5/10 ,  C08J5/24 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01B3/40 ,  H05K1/03 ,  B32B5/06

CPC classification number: C08G59/30 ,  B32B27/04 ,  C08G59/32 ,  C08G59/38 ,  C08G59/621 ,  H01B3/40 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/012 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T428/31989 ,  Y10T442/2992 ,  Y10T442/3439 ,  Y10T442/3813

Abstract: A prepreg useful as the core in flame resistant cooper clad, composite, printed circuit boards is made by impregnating a porous substrate with an impregnant containing: either a brominated epoxy or epoxy resin and reactive flame retarding additive containing bromine and phenolic hydroxyl groups (e.g., tetrabromobisphenol A), phenolic novolac oligomer as curing agent, unsaturated epoxidized oil, and optionally, a suitable catalyst; and then heating the impregnated substrate to the "B"-stage.

Abstract translation: 通过用含有溴化环氧树脂或环氧树脂的浸渍剂和含溴和酚羟基的反应性阻燃添加剂浸渍多孔基材来制备用作阻燃铜包层复合印刷电路板中的核心的预浸料坯（例如， 四溴双酚A），酚醛清漆低聚物作为固化剂，不饱和环氧化油和任选的合适的催化剂; 然后将浸渍的基材加热到“B”级。

公开(公告)号：US4456657A

公开(公告)日：1984-06-26

申请号：US314014

申请日：1981-10-22

Applicant: Robert Cassat ,  Bruno Vignando

Inventor： Robert Cassat ,  Bruno Vignando

IPC: H05K3/46 ,  B32B15/14 ,  H05K1/03 ,  B32B15/06 ,  B32B17/10 ,  B32B19/04

CPC classification number: H05K1/036 ,  B32B15/14 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31623 ,  Y10T428/31634 ,  Y10T428/31656 ,  Y10T428/31659 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T428/3188 ,  Y10T428/31949 ,  Y10T428/31975

Abstract: A metallized, laminated substrate well adapted for the production of printed circuits is comprised of:(A) an electrically insulating support element which comprises (a) a central core member comprising a major proportion by weight of a cellulosic or mica filler and a minor proportion by weight of a thermosetting resin, and (b) and (b') a pair of skin laminae coextensively secured to each face surface, respectively, of said central core (a) each of said skin laminae comprising a fibrous glass, asbestos or heat-stable synthetic polymer reinforcing filler, and a thermosetting resin impregnant, which thermosetting resin may either be the same as or different from the thermosetting resin comprising said central core member (a); and(B) an electrically conducting metal foil (c) coextensively adhered to the exposed face surface of one or the other of said skin laminae (b) or (b').

Abstract translation: 适用于生产印刷电路的金属化层压基板包括：（A）电绝缘支撑元件，其包括（a）包含主要重量比的纤维素或云母填料和较小比例的中心芯构件 （b）和（b'）分别固定到所述中心芯（a）的每个面表面的一对皮肤层，每个所述皮肤层包括纤维状玻璃，石棉或热 稳定的合成聚合物增强填料和热固性树脂浸渍剂，该热固性树脂可以与包含所述中心芯构件（a）的热固性树脂相同或不同; 和（B）与所述皮肤层（b）或（b'）中的一个或另一个的暴露的表面共同粘合的导电金属箔（c）。

公开(公告)号：US4327143A

公开(公告)日：1982-04-27

申请号：US228016

申请日：1981-01-23

Applicant: William M. Alvino ,  Janet L. Hammill ,  Martin P. Seidel

Inventor： William M. Alvino ,  Janet L. Hammill ,  Martin P. Seidel

IPC: B32B27/04 ,  C08G59/40 ,  C08J5/24 ,  H05K1/03 ,  B32B7/00 ,  B05D3/02 ,  C09J5/02 ,  H05K1/00

CPC classification number: C08J5/24 ,  B32B27/04 ,  C08G59/4021 ,  H05K1/0326 ,  H05K1/036 ,  C08J2363/00 ,  H05K1/0366 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T442/2992 ,  Y10T442/3415 ,  Y10T442/3431

Abstract: A resin impregnated, B-staged sheet material free of crystal formations, useful for metal clad and unclad laminate production, is made by impregnating a sheet containing a resin comprising epoxy resin and an amount of curing agent effective to cure the epoxy resin to the C-stage, where the curing agent consists essentially of the reaction product of dicyandiamide and an aminophylic reagent selected from the group consisting of aldehydes, alkyl monoglycidyl ethers having the formula: ##STR1## where R=an alkyl group having from 1 to 4 carbon atoms, styrene oxide, ethylene oxide, propylene oxide, acetic anhydride, benzoyl chloride, acetyl chloride, and mixtures thereof, and then heating the impregnated sheet until the resin is in the B-stage.

Abstract translation: 通过将含有环氧树脂的树脂和一定量的有效固化环氧树脂的固化剂的片浸渍到C中来制备可用于金属包覆和未包覆层压板生产的不含结晶形成的树脂浸渍的B阶片材 阶段，其中固化剂基本上由双氰胺和选自以下的氨基酚试剂的反应产物组成：醛，具有下式的烷基单缩水甘油醚：其中R =具有1至4个碳原子的烷基 ，氧化苯乙烯，环氧乙烷，环氧丙烷，乙酸酐，苯甲酰氯，乙酰氯及其混合物，然后加热浸渍的片材直到树脂处于B阶段。

公开(公告)号：US3972765A

公开(公告)日：1976-08-03

申请号：US448236

申请日：1974-03-05

Applicant: Terutake Kondo ,  Syunya Yokozawa

Inventor： Terutake Kondo ,  Syunya Yokozawa

IPC: B32B15/04 ,  B32B17/04 ,  C03C25/36 ,  C08J5/08 ,  C08J5/24 ,  H05K1/03 ,  H05K3/38 ,  C09J5/04

CPC classification number: C03C25/36 ,  H05K1/0366 ,  H05K2201/0166 ,  H05K2201/0239 ,  H05K2201/0293 ,  H05K3/389 ,  Y10S428/901 ,  Y10T428/2962 ,  Y10T428/2971 ,  Y10T428/31612 ,  Y10T428/31627 ,  Y10T428/31663 ,  Y10T442/67

Abstract: In preparing an epoxy resin laminate sheet by impregnating a nonwoven fabric of glass fiber with an epoxy resin to form a prepreg, laminating a predetermined number of so formed prepregs and pressing, while heating, the laminate, when the nonwoven fabric of glass fiber to be used as a substrate is treated with a liquid mixture containing a water-soluble phenol resin and a silane coupler prior to the impregnation step, a laminate sheet suitable for formation of a printed circuit board can be obtained at a low manufacturing cost. The so formed laminate sheet not only has excellent heat resistance, drilling workability and punching workability at room temperature but also is characterized by such an excellent property that when it is subjected to the boiling water treatment, the degree of reduction of electric properties such as the insulation resistance is very small and whitening of the substrate is not caused to occur.

Abstract translation: 在通过用环氧树脂浸渍玻璃纤维无纺布以形成预浸料坯来制备环氧树脂层压片材时，在加热时层叠预定数量的这样形成的预浸料坯并加压层压体，当玻璃纤维的无纺布为 在浸渍步骤之前用作含有水溶性酚醛树脂和硅烷偶联剂的液体混合物作为基材的处理可以以低的制造成本获得适于形成印刷电路板的层压片。 如此形成的层合板不仅在室温下具有优异的耐热性，钻孔加工性和冲压加工性，而且还具有如下优异的特性：当进行沸水处理时，电性能的降低程度 绝缘电阻非常小，不会发生基板的白化。