公开(公告)号：JP2013122786A

公开(公告)日：2013-06-20

申请号：JP2013025366

申请日：2013-02-13

Applicant: Gemalto Sa ,  ジェマルト エスアーGemalto S.A.

Inventor： JEAN-FRANCOIS MARTINENT ,  LAURENCE ROBLES ,  FRANCOIS ROUSSEL

IPC: G06K19/077 ,  G06K19/07

CPC classification number: H01Q1/2225 ,  G06K19/027 ,  G06K19/07749 ,  G06K19/0775 ,  H05K1/00 ,  H05K1/038 ,  H05K3/328 ,  H05K2201/029 ,  H05K2201/10628 ,  H05K2203/0278 ,  H05K2203/0285 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: PROBLEM TO BE SOLVED: To provide a radio frequency electron insert which exhibits excellent communication characteristics, is thin, and has a low cost.SOLUTION: In a method for manufacturing a device comprising a transponder antenna connected to contact pads, the method comprises the steps of: providing or manufacturing an antenna comprising connection terminal parts 7b and 8b mounted on a substrate; placing the contact pads 5 and 6 on the substrate and connecting the contact pads to the connection terminal parts 7b and 8b of the antenna in a form of welding 38 produced by introducing energy between the contact pads 5 and 6 and the connection terminal parts 7b and 8b. In the method, the contact pads 5 and 6 are disposed so as to comprise one surface facing the connection terminal parts 7b and 8b of the antenna, the connection terminal parts 7b and 8b are disposed on the substrate and welding energy is directly applied to the contact pads 5 and 6.

Abstract translation: 要解决的问题：提供具有优异的通信特性的射频电子插入件，薄且成本低。 解决方案：在用于制造包括连接到接触焊盘的应答器天线的设备的方法中，该方法包括以下步骤：提供或制造包括安装在基板上的连接端子部分7b和8b的天线; 将接触垫5和6放置在基板上，并将接触焊盘连接到天线的连接端子部分7b和8b，其形式为焊接38，其通过在接触垫5和6与连接端子部分7b之间引入能量而产生， 8b。 在该方法中，接触垫5和6被设置为包括面向天线的连接端子部分7b和8b的一个表面，连接端子部分7b和8b设置在基板上，并且焊接能量直接施加到 接触垫5和6.版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2011501870A

公开(公告)日：2011-01-13

申请号：JP2010507674

申请日：2008-05-08

Applicant: オッカム ポートフォリオ リミテッド ライアビリティ カンパニー

Inventor： チャールズ フジェルスタッド ジョセフ

IPC: H01L21/60 ,  H01L23/36 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3025 ,  H05K3/1241 ,  H05K3/4602 ,  H05K3/4664 ,  H05K2201/10628 ,  H05K2201/10689 ,  H05K2201/10719 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700 . The assembly 400 uses no solder. Components 406 , or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808 . The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412 . Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

公开(公告)号：JP2007005769A

公开(公告)日：2007-01-11

申请号：JP2006122359

申请日：2006-04-26

Applicant: Tdk Corp ,  Tdk株式会社

Inventor： YASUDA MASATOSHI ,  KUDO SHIN ,  SUZUKI HIROSHI ,  KOBAYASHI KAZUMI

IPC: H01F27/29 ,  H01F17/04

CPC classification number: H01F17/045 ,  H01F27/027 ,  H01F27/292 ,  H01F27/38 ,  H01F2017/0093 ,  H05K3/321 ,  H05K2201/10628

Abstract: PROBLEM TO BE SOLVED: To provide coil parts whose influence on other parts is reduced, when mounting on a circuit board, and further the mounting strength to the circuit board is improved, and to provide an electronic apparatus.
SOLUTION: The electronic apparatus 1 comprises the coil component 2 which is mounted on the circuit board 3 with a conductive paste. The coil part 2 comprises a drum core 4, and the drum core 4 has flanges 8A and 8B provided to both ends of the core. Winding wires 9 and 10 are wound around the cores of the drum core 4. The flanges 8A and 8B have terminal-forming regions 12 on both end sides. Two terminal fittings 13 and 14, electrically connected to both ends of the winding wires 9 and 10, are fixed to each terminal forming region 12, respectively. A grooved recess 16, having rectangular cross-sectional surface which opens in a mounting surface, is provided to the lower end of a region between the terminal-forming regions 12 in the flanges 8A and 8B. Consequently, progress of metal dendrite deposition due to ion migration is suppressed, at voltage application.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供对其他部件的影响减小的线圈部件，当安装在电路板上时，进一步提高对电路板的安装强度，并提供电子设备。 解决方案：电子设备1包括用导电浆料安装在电路板3上的线圈部件2。 线圈部分2包括鼓芯4，并且鼓芯4具有设置在芯的两端的凸缘8A和8B。 卷绕线9和10缠绕在鼓芯4的芯上。凸缘8A和8B在两端具有端子形成区域12。 电连接到绕组线9和10的两端的两个端子配件13和14分别固定到每个端子形成区域12。 在凸缘8A和8B中的端子形成区域12之间的区域的下端设置有在安装表面上开口的具有矩形横截面的凹槽16。 因此，在施加电压时，由于离子迁移导致的金属枝晶沉积的进展被抑制。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004264286A

公开(公告)日：2004-09-24

申请号：JP2003343970

申请日：2003-10-02

Applicant: Murata Mfg Co Ltd ,  株式会社村田製作所

Inventor： KOIKE MASAHITO ,  FUJIMOTO KATSUMI

IPC: G01C19/56 ,  G01C19/5663 ,  H01L41/053 ,  H01L41/08 ,  H01L41/09 ,  H01L41/22 ,  H01L41/313 ,  H05K3/32 ,  H05K3/34 ,  G01P9/04

CPC classification number: G01C19/5663 ,  H01L41/053 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/10083 ,  H05K2201/10628 ,  H05K2201/10757 ,  H05K2201/10848 ,  H05K2201/2045 ,  Y02P70/613

Abstract: PROBLEM TO BE SOLVED: To provide a vibrator support structure and support structure manufacturing method which is capable of absorbing vibrations and impacts which propagate via support pins. SOLUTION: In the support structure of the vibrator 1, the vibrator 1 is supported on a substrate 4 via the support pins 2, 3. Substrate connection portions 2b, 3b of the support pins 2, 3 and a pin connection portion 4a of the substrate 4 are jointed through a conductive adhesive 8, which is made of a resin including a conductive filler and has a pencil hardness of 4H or smaller, and the conductive adhesive 8 has a thickness which can absorb vibrations and impacts propagating via the support pins 2, 3. COPYRIGHT: (C)2004,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种能够吸收通过支撑销传播的振动和冲击的振动器支撑结构和支撑结构制造方法。 解决方案：在振动器1的支撑结构中，振动器1通过支撑销2,3支撑在基板4上。支撑销2,3的基板连接部分2b，3b和销连接部分4a 通过由包含导电填料的树脂制成并具有4H或更小的铅笔硬度的导电粘合剂8连接，并且导电粘合剂8具有能够吸收通过支撑件传播的振动和冲击的厚度 引脚2，3.版权所有（C）2004，JPO＆NCIPI

公开(公告)号：JPS61124118A

公开(公告)日：1986-06-11

申请号：JP24545084

申请日：1984-11-20

Applicant: Sanyo Electric Co Ltd ,  Tokyo Sanyo Electric Co Ltd

Inventor： MIURA YOSHIO

IPC: H01F41/06 ,  H01F27/29 ,  H01F41/04 ,  H01F41/10 ,  H05K3/32

CPC classification number: H01F27/292 ,  H01F41/10 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10628 ,  H05K2203/0285

Abstract: PURPOSE:To enable to reduce the size by forming an inductance element directly on an insulating substrate by a supersonic bonding unit with an insulating winding. CONSTITUTION:A conductive path 2 is formed on an insulating substrate 1, a bobbin 3 is disposed, and one end of a winding 5 contained in a reel is supersonically bonded onto one conductive path by a supersonic bonding unit. An insulated winding 5 fed by the reel is uniformly wound by fluctuating vertically the substrate 1 on the bobbin 3, and the other end of the winding 5 is supersonically bonded to the other path 2. Thus, an inductance element is formed with the bobbin 3, the winding 5 and the least parts to obtain very inexpensive one with small size. Since the winding 5 can be wound in the uniform thickness on the bobbin 3 by vibrating a table 8 elevationally, the inductance element having small size and large value can be formed.

Abstract translation: 目的：通过用绝缘绕组的超音速键合单元直接在绝缘基板上形成电感元件，可以减小尺寸。 构成：在绝缘基板1上形成导电路径2，设置绕线管3，并且包含在卷轴中的绕组5的一端通过超声波接合单元被超声波接合在一个导电路径上。 由卷线筒供给的绝缘绕组5通过使线轴3上的基板1垂直地波动而均匀地卷绕，并且绕组5的另一端被超声波接合到另一路径2.因此，电感元件形成有线轴3 ，绕组5和最小的部件，以获得非常便宜的小尺寸。 由于绕组5可以通过使工作台8向上振动而在绕线筒3上卷绕成均匀的厚度，所以可以形成具有小尺寸和大值的电感元件。

公开(公告)号：US20240357746A1

公开(公告)日：2024-10-24

申请号：US18326031

申请日：2023-05-31

Applicant: INNODISK CORPORATION

Inventor： CHIH-CHIEH KAO

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K1/182 ,  H05K1/189 ,  H05K2201/09072 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  H05K2201/10545 ,  H05K2201/10628

Abstract: A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.

公开(公告)号：US12080634B2

公开(公告)日：2024-09-03

申请号：US17756556

申请日：2020-11-25

Applicant: THE NOCO COMPANY

Inventor： James P. McBride ,  James Richard Stanfield

IPC: H05K1/18 ,  H01L23/495 ,  H01M10/42 ,  H01M50/519 ,  H05K1/14 ,  H05K3/34 ,  H01L25/11

CPC classification number: H01L23/49555 ,  H01L23/49562 ,  H01M10/4257 ,  H01M50/519 ,  H05K1/141 ,  H05K1/181 ,  H05K3/3426 ,  H01L25/115 ,  H01M2010/4271 ,  H05K2201/10166 ,  H05K2201/10522 ,  H05K2201/10628 ,  H05K2201/10659 ,  H05K2201/10757 ,  H05K2201/10818 ,  H05K2203/049

Abstract: Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

公开(公告)号：US20240277948A1

公开(公告)日：2024-08-22

申请号：US18645057

申请日：2024-04-24

Applicant: Norton (Waterford) Limited

Inventor： James Roche ,  Enrique Calderon Oliveras

IPC: A61M15/00 ,  G16H20/13 ,  G16H40/63 ,  H05K1/18

CPC classification number: A61M15/0001 ,  G16H20/13 ,  G16H40/63 ,  H05K1/181 ,  A61M2205/8206 ,  H05K2201/10037 ,  H05K2201/10628

Abstract: An electronic module for a medical device such as an inhaler is disclosed, the electronic module comprising a printed circuit board, and a damper configured to dampen energy transfer to and/or from a battery when a battery is connected to the electronic module and the electronic module is exposed to mechanical shock.

公开(公告)号：US11911825B2

公开(公告)日：2024-02-27

申请号：US16606310

申请日：2018-03-13

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Kristopher J. Erickson ,  David George ,  Sterling Chaffins ,  Lihua Zhao

IPC: B29C64/165 ,  B22F7/08 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  B29C64/194 ,  B29C64/112 ,  H05K1/18 ,  H05K3/28 ,  H05K3/32 ,  H05K3/46 ,  B29K105/16 ,  B29L31/34

CPC classification number: B22F7/08 ,  B29C64/112 ,  B29C64/165 ,  B29C64/194 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y70/00 ,  H05K1/186 ,  H05K3/284 ,  H05K3/32 ,  H05K3/4664 ,  B29K2105/162 ,  B29K2995/0005 ,  B29L2031/3425 ,  H05K2201/10022 ,  H05K2201/10628 ,  H05K2203/1131 ,  B22F2999/00 ,  B22F1/10 ,  B22F10/20

Abstract: In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.

公开(公告)号：US11785703B2

公开(公告)日：2023-10-10

申请号：US17473093

申请日：2021-09-13

Applicant: Kioxia Corporation

Inventor： Kazuya Nagasawa ,  Tomoaki Morita ,  Takahisa Funayama ,  Norihiro Ishii ,  Hidenori Tanaka

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10159 ,  H05K2201/10628 ,  H05K2201/10901

Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.