Abstract:
PROBLEM TO BE SOLVED: To provide a radio frequency electron insert which exhibits excellent communication characteristics, is thin, and has a low cost.SOLUTION: In a method for manufacturing a device comprising a transponder antenna connected to contact pads, the method comprises the steps of: providing or manufacturing an antenna comprising connection terminal parts 7b and 8b mounted on a substrate; placing the contact pads 5 and 6 on the substrate and connecting the contact pads to the connection terminal parts 7b and 8b of the antenna in a form of welding 38 produced by introducing energy between the contact pads 5 and 6 and the connection terminal parts 7b and 8b. In the method, the contact pads 5 and 6 are disposed so as to comprise one surface facing the connection terminal parts 7b and 8b of the antenna, the connection terminal parts 7b and 8b are disposed on the substrate and welding energy is directly applied to the contact pads 5 and 6.
Abstract:
The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700 . The assembly 400 uses no solder. Components 406 , or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808 . The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412 . Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.
Abstract:
PROBLEM TO BE SOLVED: To provide coil parts whose influence on other parts is reduced, when mounting on a circuit board, and further the mounting strength to the circuit board is improved, and to provide an electronic apparatus. SOLUTION: The electronic apparatus 1 comprises the coil component 2 which is mounted on the circuit board 3 with a conductive paste. The coil part 2 comprises a drum core 4, and the drum core 4 has flanges 8A and 8B provided to both ends of the core. Winding wires 9 and 10 are wound around the cores of the drum core 4. The flanges 8A and 8B have terminal-forming regions 12 on both end sides. Two terminal fittings 13 and 14, electrically connected to both ends of the winding wires 9 and 10, are fixed to each terminal forming region 12, respectively. A grooved recess 16, having rectangular cross-sectional surface which opens in a mounting surface, is provided to the lower end of a region between the terminal-forming regions 12 in the flanges 8A and 8B. Consequently, progress of metal dendrite deposition due to ion migration is suppressed, at voltage application. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a vibrator support structure and support structure manufacturing method which is capable of absorbing vibrations and impacts which propagate via support pins. SOLUTION: In the support structure of the vibrator 1, the vibrator 1 is supported on a substrate 4 via the support pins 2, 3. Substrate connection portions 2b, 3b of the support pins 2, 3 and a pin connection portion 4a of the substrate 4 are jointed through a conductive adhesive 8, which is made of a resin including a conductive filler and has a pencil hardness of 4H or smaller, and the conductive adhesive 8 has a thickness which can absorb vibrations and impacts propagating via the support pins 2, 3. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PURPOSE:To enable to reduce the size by forming an inductance element directly on an insulating substrate by a supersonic bonding unit with an insulating winding. CONSTITUTION:A conductive path 2 is formed on an insulating substrate 1, a bobbin 3 is disposed, and one end of a winding 5 contained in a reel is supersonically bonded onto one conductive path by a supersonic bonding unit. An insulated winding 5 fed by the reel is uniformly wound by fluctuating vertically the substrate 1 on the bobbin 3, and the other end of the winding 5 is supersonically bonded to the other path 2. Thus, an inductance element is formed with the bobbin 3, the winding 5 and the least parts to obtain very inexpensive one with small size. Since the winding 5 can be wound in the uniform thickness on the bobbin 3 by vibrating a table 8 elevationally, the inductance element having small size and large value can be formed.
Abstract:
A high capacitance module for electrically connecting to a second circuit board comprises a first circuit board provided with a plurality of metal contacts and at least one capacitor core arranged on the first circuit board. The capacitor cores have connection pins that are electrically connected to the metal contacts through conductive glue. An adhesive layer covers the capacitor cores. The capacitor cores are electrically connected to a memory module arranged on the second circuit board.
Abstract:
Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).
Abstract:
An electronic module for a medical device such as an inhaler is disclosed, the electronic module comprising a printed circuit board, and a damper configured to dampen energy transfer to and/or from a battery when a battery is connected to the electronic module and the electronic module is exposed to mechanical shock.
Abstract:
In an example, a method is described that includes building a first layer of a three-dimensional heterogeneous object in a first plurality of passes of an additive manufacturing system. An electronic component is inserted directly into the first layer. The electronic component is then fused to the first layer in a second plurality of passes of the additive manufacturing system.
Abstract:
According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.