Method for manufacturing device comprising transponder antenna connected to contact pad and obtained device
    231.
    发明专利
    Method for manufacturing device comprising transponder antenna connected to contact pad and obtained device 有权
    用于制造包括连接到接触垫和所获得的装置的传感器天线的装置的方法

    公开(公告)号:JP2013122786A

    公开(公告)日:2013-06-20

    申请号:JP2013025366

    申请日:2013-02-13

    Abstract: PROBLEM TO BE SOLVED: To provide a radio frequency electron insert which exhibits excellent communication characteristics, is thin, and has a low cost.SOLUTION: In a method for manufacturing a device comprising a transponder antenna connected to contact pads, the method comprises the steps of: providing or manufacturing an antenna comprising connection terminal parts 7b and 8b mounted on a substrate; placing the contact pads 5 and 6 on the substrate and connecting the contact pads to the connection terminal parts 7b and 8b of the antenna in a form of welding 38 produced by introducing energy between the contact pads 5 and 6 and the connection terminal parts 7b and 8b. In the method, the contact pads 5 and 6 are disposed so as to comprise one surface facing the connection terminal parts 7b and 8b of the antenna, the connection terminal parts 7b and 8b are disposed on the substrate and welding energy is directly applied to the contact pads 5 and 6.

    Abstract translation: 要解决的问题:提供具有优异的通信特性的射频电子插入件,薄且成本低。 解决方案:在用于制造包括连接到接触焊盘的应答器天线的设备的方法中,该方法包括以下步骤:提供或制造包括安装在基板上的连接端子部分7b和8b的天线; 将接触垫5和6放置在基板上,并将接触焊盘连接到天线的连接端子部分7b和8b,其形式为焊接38,其通过在接触垫5和6与连接端子部分7b之间引入能量而产生, 8b。 在该方法中,接触垫5和6被设置为包括面向天线的连接端子部分7b和8b的一个表面,连接端子部分7b和8b设置在基板上,并且焊接能量直接施加到 接触垫5和6.版权所有(C)2013,JPO&INPIT

    Coil part and electronic apparatus
    233.
    发明专利
    Coil part and electronic apparatus 审中-公开
    线圈和电子设备

    公开(公告)号:JP2007005769A

    公开(公告)日:2007-01-11

    申请号:JP2006122359

    申请日:2006-04-26

    Abstract: PROBLEM TO BE SOLVED: To provide coil parts whose influence on other parts is reduced, when mounting on a circuit board, and further the mounting strength to the circuit board is improved, and to provide an electronic apparatus.
    SOLUTION: The electronic apparatus 1 comprises the coil component 2 which is mounted on the circuit board 3 with a conductive paste. The coil part 2 comprises a drum core 4, and the drum core 4 has flanges 8A and 8B provided to both ends of the core. Winding wires 9 and 10 are wound around the cores of the drum core 4. The flanges 8A and 8B have terminal-forming regions 12 on both end sides. Two terminal fittings 13 and 14, electrically connected to both ends of the winding wires 9 and 10, are fixed to each terminal forming region 12, respectively. A grooved recess 16, having rectangular cross-sectional surface which opens in a mounting surface, is provided to the lower end of a region between the terminal-forming regions 12 in the flanges 8A and 8B. Consequently, progress of metal dendrite deposition due to ion migration is suppressed, at voltage application.
    COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题:为了提供对其他部件的影响减小的线圈部件,当安装在电路板上时,进一步提高对电路板的安装强度,并提供电子设备。 解决方案:电子设备1包括用导电浆料安装在电路板3上的线圈部件2。 线圈部分2包括鼓芯4,并且鼓芯4具有设置在芯的两端的凸缘8A和8B。 卷绕线9和10缠绕在鼓芯4的芯上。凸缘8A和8B在两端具有端子形成区域12。 电连接到绕组线9和10的两端的两个端子配件13和14分别固定到每个端子形成区域12。 在凸缘8A和8B中的端子形成区域12之间的区域的下端设置有在安装表面上开口的具有矩形横截面的凹槽16。 因此,在施加电压时,由于离子迁移导致的金属枝晶沉积的进展被抑制。 版权所有(C)2007,JPO&INPIT

    Vibrator support structure and manufacturing method therefor
    234.
    发明专利
    Vibrator support structure and manufacturing method therefor 有权
    振动台支撑结构及其制造方法

    公开(公告)号:JP2004264286A

    公开(公告)日:2004-09-24

    申请号:JP2003343970

    申请日:2003-10-02

    Abstract: PROBLEM TO BE SOLVED: To provide a vibrator support structure and support structure manufacturing method which is capable of absorbing vibrations and impacts which propagate via support pins. SOLUTION: In the support structure of the vibrator 1, the vibrator 1 is supported on a substrate 4 via the support pins 2, 3. Substrate connection portions 2b, 3b of the support pins 2, 3 and a pin connection portion 4a of the substrate 4 are jointed through a conductive adhesive 8, which is made of a resin including a conductive filler and has a pencil hardness of 4H or smaller, and the conductive adhesive 8 has a thickness which can absorb vibrations and impacts propagating via the support pins 2, 3. COPYRIGHT: (C)2004,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种能够吸收通过支撑销传播的振动和冲击的振动器支撑结构和支撑结构制造方法。 解决方案:在振动器1的支撑结构中,振动器1通过支撑销2,3支撑在基板4上。支撑销2,3的基板连接部分2b,3b和销连接部分4a 通过由包含导电填料的树脂制成并具有4H或更小的铅笔硬度的导电粘合剂8连接,并且导电粘合剂8具有能够吸收通过支撑件传播的振动和冲击的厚度 引脚2,3.版权所有(C)2004,JPO&NCIPI

    Forming method of inductance element
    235.
    发明专利
    Forming method of inductance element 失效
    电感元件的形成方法

    公开(公告)号:JPS61124118A

    公开(公告)日:1986-06-11

    申请号:JP24545084

    申请日:1984-11-20

    Inventor: MIURA YOSHIO

    Abstract: PURPOSE:To enable to reduce the size by forming an inductance element directly on an insulating substrate by a supersonic bonding unit with an insulating winding. CONSTITUTION:A conductive path 2 is formed on an insulating substrate 1, a bobbin 3 is disposed, and one end of a winding 5 contained in a reel is supersonically bonded onto one conductive path by a supersonic bonding unit. An insulated winding 5 fed by the reel is uniformly wound by fluctuating vertically the substrate 1 on the bobbin 3, and the other end of the winding 5 is supersonically bonded to the other path 2. Thus, an inductance element is formed with the bobbin 3, the winding 5 and the least parts to obtain very inexpensive one with small size. Since the winding 5 can be wound in the uniform thickness on the bobbin 3 by vibrating a table 8 elevationally, the inductance element having small size and large value can be formed.

    Abstract translation: 目的:通过用绝缘绕组的超音速键合单元直接在绝缘基板上形成电感元件,可以减小尺寸。 构成:在绝缘基板1上形成导电路径2,设置绕线管3,并且包含在卷轴中的绕组5的一端通过超声波接合单元被超声波接合在一个导电路径上。 由卷线筒供给的绝缘绕组5通过使线轴3上的基板1垂直地波动而均匀地卷绕,并且绕组5的另一端被超声波接合到另一路径2.因此,电感元件形成有线轴3 ,绕组5和最小的部件,以获得非常便宜的小尺寸。 由于绕组5可以通过使工作台8向上振动而在绕线筒3上卷绕成均匀的厚度,所以可以形成具有小尺寸和大值的电感元件。

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