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    가동 구성요소를 구비한 미소 기전 시스템을 제조하는프로세스
    252.
    发明公开
    가동 구성요소를 구비한 미소 기전 시스템을 제조하는프로세스 失效
    用于制造具有可移动部件的微电子机械系统的方法

    公开(公告)号：KR1020060087576A

    公开(公告)日：2006-08-02

    申请号：KR1020067005697

    申请日：2004-09-21

    Applicant: 파나소닉 전공 주식회사

    Inventor： 오카나오마사 ,  하라다히로시 ,  오기하라준 ,  후크시마히로시 ,  노게히로시 ,  스즈키유지 ,  가와노기요히코 ,  요시하라다카아키 ,  스즈무라마사히코

    IPC: B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  G02B6/35

    CPC classification number: G02B26/0816 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C2201/0109 ,  B81C2201/019 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/357 ,  G02B6/3584 ,  H02N1/008

    Abstract: A process for fabricating a micro- electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.

    Abstract translation: 一种用于制造微机电系统（MEMS）的方法，所述微机电系统由固定地支撑在下基板上的固定部件和可移动的部件可移动地支撑在所述下基板上。 该方法利用与下基板分开的上基板。 在其顶层中选择性地蚀刻上基板，以在其中形成多个从上基板的底层共同突出的柱。 支柱包括要固定到下基板的固定部件和仅弹性地支撑到一个或多个固定部件以相对于固定部件可移动的可动部件。 下基板在其顶表面上形成有至少一个凹部。 然后将上基板以这样的方式上下连接到下基板的顶部，以将固定部件直接放置在下基板上并将可移动部件放置在凹部的上方。 最后，去除上基板的底层以从底层释放可移动部件，用于使可移动部件浮动在凹部上方并允许​​它们相对于下基板移动，同时保持固定部件固定在 下基板。

    마이크로 관성센서 및 그 제조 방법
    253.
    发明公开
    마이크로 관성센서 및 그 제조 방법 无效
    MICRO INERTIA传感器及其制造方法

    公开(公告)号：KR1020030077754A

    公开(公告)日：2003-10-04

    申请号：KR1020020016603

    申请日：2002-03-27

    Applicant: 삼성전기주식회사

    Inventor： 안승도 ,  김경수 ,  조지만

    IPC: H01L29/84

    CPC classification number: B81C1/00301 ,  B81B2201/025 ,  B81B2207/095 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/038 ,  G01C19/5783 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0828 ,  Y10T428/24322

    Abstract: PURPOSE: A micro inertia sensor and a method for manufacturing the same are provided to be capable of reducing the size of the sensor and simplifying manufacturing processes by improving the structure of the sensor. CONSTITUTION: A micro inertia sensor is provided with a lower glass substrate(1), a lower silicon layer(2) including the first edge part(2a), the first fixing part(2b), a side motion detecting structure(2c), formed at the upper portion of the lower glass substrate, an upper silicon layer(4) includes the second edge part(4a), the second fixing part(4b), and an upper detecting electrode(4c) corresponding to the first edge part, the first fixing part, the side motion detecting structure, respectively, formed at the upper portion of the lower silicon layer, an adhesive layer(3) located between the lower and upper silicon layer, and an upper glass substrate(5) including a conductive line(6) and a via hole(5a), formed at the upper portion of the resultant structure.

    Abstract translation: 目的：提供微惯性传感器及其制造方法，以能够通过改进传感器的结构来减小传感​​器的尺寸并简化制造过程。 构造：微惯性传感器设置有下玻璃基板（1），包括第一边缘部分（2a），第一固定部分（2b），侧运动检测结构（2c）的下硅层（2） 形成在下玻璃基板的上部，上硅层（4）包括第二边缘部分（4a），第二固定部分（4b）和对应于第一边缘部分的上部检测电极（4c） 第一固定部分，分别形成在下硅层的上部的侧运动检测结构，位于下硅层和上硅层之间的粘合剂层（3）和包括导电的上玻璃基板（5） 线（6）和形成在所得结构的上部的通孔（5a）。

    A method of making a microfluidic device
    255.
    发明授权
    A method of making a microfluidic device 有权
    一种制造微流体装置的方法

    公开(公告)号：EP2554510B1

    公开(公告)日：2018-01-10

    申请号：EP12177755.1

    申请日：2012-07-25

    Applicant: Teledyne Dalsa Semiconductor Inc.

    Inventor： Johnstone, Robert ,  Martel, Stéphane

    IPC: B81C1/00

    CPC classification number: B81C1/00182 ,  B81B2201/054 ,  B81C2201/019 ,  B81C2203/0735

    Abstract: A microfabricated device is fabricated by depositing a first metal layer on a substrate to provide a first electrode of an electrostatic actuator, depositing a first structural polymer layer over the first metal layer, depositing a second metal layer over said first structural polymer layer to form a second electrode of the electrostatic actuator, depositing an insulating layer over said first structural polymer layer, planarizing the insulating layer, etching the first structural polymer layer through the insulating layer and the second metal layer to undercut the second metal layer, providing additional pre-formed structural polymer layers, at least one of which has been previously patterned, and finally bonding the additional structural layers in the form of a stack over the planarized second insulating layer to one or more microfluidic channels. The technique can also be used to make cross over channels in devices without electrostatic actuators, in which case the metal layers can be omitted.

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