公开(公告)号：US20150373839A1

公开(公告)日：2015-12-24

申请号：US14746984

申请日：2015-06-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Soo Keun KIM ,  Ji Chang RYU ,  Jae Hak HER

IPC: H05K1/02 ,  G06F3/0354 ,  G06F3/047 ,  G06F3/041 ,  G06F3/044

CPC classification number: H05K1/0271 ,  G06F3/03545 ,  G06F3/0412 ,  G06F3/044 ,  G06F3/047 ,  G06F2203/04101 ,  G06F2203/04107 ,  G06F2203/04111 ,  G06F2203/04112 ,  G06F2203/04808 ,  G06F2203/04809 ,  H05K1/0274 ,  H05K2201/0145

Abstract: Provided is a touch panel including a cover substrate including an active area and an unactive area, and a printing layer on the unactive area. The printing layer has surface roughness in a range of 0.4 μm to 0.6 μm. The printing layer has straightness in a range of ±0.1 μm to ±10 μm.

Abstract translation: 提供了一种触摸面板，其包括具有活动区域和非活动区域的盖基板，以及在非活动区域上的印刷层。 印刷层的表面粗糙度在0.4μm至0.6μm的范围内。 印刷层的平直度在±0.1μm〜±10μm的范围内。

公开(公告)号：US20150342036A1

公开(公告)日：2015-11-26

申请号：US14819040

申请日：2015-08-05

Applicant: MC10, Inc.

Inventor： Brian David Elolampi ,  Roozbeh Ghaffari ,  Bassel de Graff ,  William J. Aurora ,  Xiaolong Hu

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K1/0278 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/4985 ,  H01L23/5389 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/6835 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/1461 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/115 ,  H05K3/067 ,  H05K3/4644 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H01L2924/00

Abstract: Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.

Abstract translation: 提供了灵活的电子结构和制造柔性电子结构的方法。 一个示例性方法包括将第一层施加到衬底，产生通过第一层到衬底的多个通孔，以及向第一层施加第二聚合物层，使得第二聚合物形成与衬底的至少一部分接触的锚固件 。 至少一个电子器件层设置在第二聚合物层的一部分上。 通过第二聚合物层形成至少一个沟槽以暴露第一层的至少一部分。 通过将结构暴露于选择性蚀刻剂以提供与衬底接触的柔性电子结构来去除第一层的至少一部分。 电子结构可以从衬底释放。

公开(公告)号：US09181464B2

公开(公告)日：2015-11-10

申请号：US13203216

申请日：2010-01-18

Applicant: Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

Inventor： Shingo Kaimori ,  Jun Sugawara ,  Akira Mizoguchi ,  Syougo Asai ,  Takuma Yoshisaka ,  Naota Uenishi

IPC: B32B3/10 ,  B32B7/12 ,  C09J7/02 ,  C09J167/02 ,  C09J163/04 ,  C09J171/10 ,  C09J163/02 ,  C09J177/00 ,  C09J161/14 ,  C09J167/00 ,  C08G59/30 ,  C08G59/32 ,  C09J163/00 ,  C09J171/00 ,  H05K3/38 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  H05K1/03

CPC classification number: C09J167/00 ,  C08G59/304 ,  C08G59/3272 ,  C08G2650/56 ,  C08K5/3437 ,  C08L67/00 ,  C08L77/00 ,  C08L79/04 ,  C08L2666/14 ,  C09J7/22 ,  C09J7/35 ,  C09J163/00 ,  C09J171/00 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2461/00 ,  C09J2463/00 ,  C09J2467/00 ,  C09J2477/00 ,  H01L2924/00013 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  Y10T428/24802 ,  Y10T428/287 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

Abstract translation: 本发明提供无卤素，粘合性，焊料耐热性，阻燃性，流动特性良好的粘合性树脂组合物，以及使用该树脂组合物的层叠体和柔性印刷线路板。 粘合剂树脂组合物含有含磷环氧树脂和/或含磷苯氧树脂，重均分子量大于20,000和150,000以下的含磷聚酯树脂，另一种热塑性树脂和固化 代理商 粘合性树脂组合物优选还含有苯并恶嗪化合物。 优选地，在粘合剂树脂组合物中基本上不混合无机填料。

公开(公告)号：US09085705B2

公开(公告)日：2015-07-21

申请号：US14386876

申请日：2013-03-04

Applicant: Toray Industries, Inc.

Inventor： Tsukuru Mizuguchi ,  Satoshi Matsuba ,  Kazutaka Kusano

IPC: G03F7/027 ,  G03F7/40 ,  H03B13/00 ,  H05K1/09 ,  C09D5/24 ,  H01B1/22 ,  G03F7/004 ,  G03F7/038 ,  H05K1/02

CPC classification number: C09D5/24 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/40 ,  H01B1/22 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/092 ,  H05K1/095 ,  H05K3/106 ,  H05K2201/0145 ,  H05K2201/10151 ,  H05K2203/0793

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract translation: 感光性导电糊包含含有氨基甲酸酯键的环氧丙烯酸酯（A），光聚合引发剂（B）和导电性填料（C），其中，导电性填料（C）的添加量为70〜95重量％ 相对于感光性导电糊的总固体。

公开(公告)号：US20150092370A1

公开(公告)日：2015-04-02

申请号：US14566043

申请日：2014-12-10

Applicant: HZO, Inc.

Inventor： David James Astle ,  Tyler Christensen Child ,  Vimal Kumar Kasagani ,  Cameron LaMar Loose ,  Blake LeRoy Stevens ,  Max Ernest Sorenson

IPC: H05K1/18 ,  H01L21/67

CPC classification number: B05D1/322 ,  C09J9/00 ,  C09J2201/61 ,  H01L21/56 ,  H01L21/561 ,  H01L21/67011 ,  H01L21/6715 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/0073 ,  H05K3/0079 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/09872 ,  H01L2924/00

Abstract: A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

Abstract translation: 公开了一种将保护涂层施加到衬底的选定部分的方法。 该方法包括在不被保护涂层覆盖的基底的至少一部分上施加掩模或形成掩模。 可以通过将可流动材料施加到基底来选择性地形成掩模。 或者，掩模可以由预成型膜形成。 在掩模就位的情况下，可以将保护涂层施加到基底和掩模上。 覆盖在掩模上的保护涂层的一部分可以从保护涂层的其它部分描绘出来; 例如，通过在掩模的周边或附近的位置处切割，削弱或从保护涂层去除材料。 然后可以将覆盖在掩模上的保护涂层和掩模的部分从基材上除去。

公开(公告)号：US20150056560A1

公开(公告)日：2015-02-26

申请号：US14386876

申请日：2013-03-04

Applicant: Toray Industries, Inc.

Inventor： Tsukuru Mizuguchi ,  Satoshi Matsuba ,  Kazutaka Kusano

IPC: C09D5/24 ,  H05K1/02 ,  G03F7/40 ,  H05K1/09

CPC classification number: C09D5/24 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/038 ,  G03F7/40 ,  H01B1/22 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/092 ,  H05K1/095 ,  H05K3/106 ,  H05K2201/0145 ,  H05K2201/10151 ,  H05K2203/0793

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract translation: 感光性导电糊包含含有氨基甲酸酯键的环氧丙烯酸酯（A），光聚合引发剂（B）和导电性填料（C），其中，导电性填料（C）的添加量为70〜95重量％ 相对于感光性导电糊的总固体。

公开(公告)号：US08895873B2

公开(公告)日：2014-11-25

申请号：US13535532

申请日：2012-06-28

Applicant: Tetsuo Amano ,  Toshio Nishiwaki

Inventor： Tetsuo Amano ,  Toshio Nishiwaki

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/0306 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/115 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/096

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract translation: 印刷布线板包括：芯绝缘层，其包括树脂，并且具有通过芯绝缘层的通路导体，形成在芯层上并包括铜箔和镀膜的第一导电层，形成在第一层上的层间绝缘层 层，并且包括树脂，所述层间层具有穿过所述层间层的通孔导体，以及形成在所述中间层上并包括铜箔和镀膜的第二导电层。 第一层包括导电电路，核心层和层间介电常数为4.0或更低，信号传输频率为1GHz，热膨胀系数为85ppm /℃或更低，等于或低于Tg， 第一层的厚度大于第二层的箔的厚度。

公开(公告)号：US20140340826A1

公开(公告)日：2014-11-20

申请号：US13896332

申请日：2013-05-17

Applicant: Asia Vital Components Co., Ltd.

Inventor： Ching-Hang Shen ,  Fu-Kuei Chang

IPC: G06F1/16 ,  H05K1/02

CPC classification number: G06F1/1666 ,  H05K1/0216 ,  H05K1/0266 ,  H05K1/028 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/28 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/029 ,  H05K2201/0308 ,  H05K2201/051 ,  H05K2201/057 ,  H05K2201/09781 ,  H05K2201/09936 ,  H05K2201/10037

Abstract: A portable input device includes a flexible main body, a sensing electrode layer, a protection layer and a memory metal body. The flexible main body has a first face and a second face. The sensing electrode layer has a first sensing electrode and a second sensing electrode disposed on the second face of the flexible main body. The protection layer is correspondingly disposed on the second face of the flexible main body to cover the sensing electrode layer. The memory metal body is disposed on one face of the flexible main body or one face of the protection layer for curling the flexible main body for easy carry or storage. Accordingly, the convenient portable input device is flexible, lightweight and thin for a user to conveniently carry.

Abstract translation: 便携式输入装置包括柔性主体，感测电极层，保护层和记忆金属体。 柔性主体具有第一面和第二面。 感测电极层具有设置在柔性主体的第二面上的第一感测电极和第二感测电极。 保护层相应地设置在柔性主体的第二面上以覆盖感测电极层。 记忆金属体设置在柔性主体的一个面或保护层的一个表面上，用于卷曲柔性主体以便于携带或存放。 因此，方便的便携式输入设备是灵活的，轻便的和薄的，用户方便携带。

公开(公告)号：US20140314966A1

公开(公告)日：2014-10-23

申请号：US14348846

申请日：2012-10-05

Applicant: APPLIED NANOTECH HOLDINGS, INC.

Inventor： Richard Lee Fink ,  James P. Novak ,  Valerie Ginsberg

IPC: H01B13/00

CPC classification number: H01B13/003 ,  H01B1/026 ,  H01B1/22 ,  H05K3/1283 ,  H05K2201/0145

Abstract: Tape lamination on a dry copper ink film, followed by a flash lamp procedure, produces conductive films. The tape lamination increases the curing parameter window and reduces crack formation in the metallic film Tape lamination facilitates curing of a continuous copper film on temperature sensitive substrates, such as PET, at power levels that would usually crack blow off the copper film This lamination process also improves adhesion and uniformity of the cured film.

Abstract translation: 在干铜墨膜上进行胶带层压，然后进行闪光灯操作，产生导电膜。 胶带层压增加了固化参数窗口并减少了金属膜中的裂纹形成。胶带层压有助于在温度敏感的基材（如PET）上固化连续铜膜，功率水平通常会破坏铜膜的冲击。 提高固化膜的粘合性和均匀性。

公开(公告)号：US20140287158A1

公开(公告)日：2014-09-25

申请号：US14219047

申请日：2014-03-19

Applicant: Intrinsiq Materials, Inc.

Inventor： Janet Heyen ,  Michael Carmody

IPC: C09D5/24

CPC classification number: H05K1/095 ,  C08K9/10 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K1/0326 ,  H05K3/1216 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0224 ,  H05K2201/0245 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2203/0514 ,  H01L2924/00

Abstract: A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents.

Abstract translation: 用于筛网的导电糊剂具有平均直径在1.0-8.0微米之间的铜薄片和平均直径为10nm至100nm的铜纳米颗粒的混合物，其中铜片与纳米颗粒的比例为2:1 和5：1重量比; 以及包含分子量超过10,000的聚合物的大约一半的树脂和一种或多种溶剂。