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公开(公告)号：KR1020110118713A
公开(公告)日：2011-10-31
申请号：KR1020117021077
申请日：2010-01-27
Applicant: 퀄컴 엠이엠에스 테크놀로지스, 인크.
Inventor： 나타라잔,방갈로,알. , 구시브,예브게니 , 레이버리,크리스토퍼,에이.
CPC classification number: B01J20/2808 , B01D53/261 , B01D53/28 , B01D2253/108 , B01J20/18 , B01J20/183 , B01J20/2803 , B01J2220/42 , B81B2201/047 , B81C1/00285 , B81C2201/112 , H01L23/26 , H01L51/5259 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/1433 , Y10T156/10 , H01L51/5237 , B81C1/00015 , H01L23/16 , H01L2924/00
Abstract: 건조제가 일체화된 MEMS 장치를 제공하는 시스템 및 방법이 제공된다. 일 실시형태에서, 건조제를 포함하는 건식 조성물은 MEMS 장치의 배면판 혹은 기판 상에 임팩트 분사되고, 기판에 융착된다. 다른 실시형태에서, 건조제는 해당 건조제가 임팩트 분사된 면에 부착되도록 임팩트 분사된다. 또 다른 실시형태에서, 임팩트 분사된 면에는 건조제가 함침된다. 다른 실시형태에서, 건조제는 적절한 무기 바인더와 배합되고 나서, 해당 건조제가 임팩트 분사된 면에 부착되도록 임팩트 분사된다. 또 다른 실시형태에서, 건조제는 소정의 입자 크기의 분체로 미세화 혹은 분쇄되고 나서, 표면 상에 임팩트 분사된다. 이와 같이 해서, 건조제 입자 혹은 분체는 임팩트 분사 과정을 통해 표적 면 상에 융착된다.
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公开(公告)号：KR1020100007759A
公开(公告)日：2010-01-22
申请号：KR1020090062529
申请日：2009-07-09
Applicant: 더 스와치 그룹 리서치 앤 디벨롭먼트 엘티디
IPC: G04B37/04 , H01L21/027
CPC classification number: B81C99/008 , B81B2201/035 , B81C1/00674 , B81C2201/112 , G04B13/02 , G04D3/0069 , Y10T29/49579 , G03F7/0002 , G04B13/026
Abstract: PURPOSE: A manufacturing method for a micromechanical part is provided to manufacture parts provided to the most of watch with a good quality. CONSTITUTION: A manufacturing method for a micromechanical part is as follows. A substrate made with manufacturable minute materials is provided(3). A pattern comprised of parts penetrated through the substrate is etched(5). The etched substrate is installed on supports in order to make the top surface and the bottom surface of the substrate accessible(7). A coating with an excellent rubbing quality is spread on the outer surface of the parts. The parts are separated from the substrate(11).
Abstract translation: 目的：提供一种微机械部件的制造方法，以制造提供给手表最多的部件，质量好。 构成：微机械部件的制造方法如下。 提供由可制造的微小材料制成的基板（3）。 蚀刻由穿透基板的部分构成的图案（5）。 将蚀刻的基板安装在支撑件上，以使基板的顶表面和底表面可接近（7）。 具有优异摩擦质量的涂层涂布在零件的外表面上。 部件与基板（11）分离。
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公开(公告)号：KR100837987B1
公开(公告)日：2008-06-16
申请号：KR1020010034904
申请日：2001-06-20
Applicant: 텍사스 인스트루먼츠 인코포레이티드
IPC: B81B7/02
CPC classification number: G02B26/0841 , B81B3/0005 , B81B2201/042 , B81C1/0096 , B81C2201/112
Abstract: 회전 코팅을 이용하여 자주형 마이크로 기계 장치(302)를 코팅하기 위한 방법이 개시된다. 높은 고체 함량을 가지지만 낮은 점성을 가진 용액은 마이크로 기계 장치 구조의 자유 영역(304)을 통과할 수 있다. 용액을 웨이퍼 또는 다이에서 회전하여 분리시키는 것은 모세관 작용으로부터의 예상되는 손상없이 장치 위에 필름을 형성하게 한다. 유기 중합체가 고체 요소로서 이용되면, 구조는 전형적인 재의 공정에 의해 다시 해제될 수 있다. 이 방법은 해제되고 시험된 구조를 보호하도록 그리고 습식 해제 공정과 관련하여 마이크로 기계 장치의 정마찰-관련 변형을 극복하도록 마이크로 기계 장치의 제조 공정로서 이용될 수 있다.
MEMS, 마이크로 기계 장치, 용해 수지, 재코팅, 마이크로 거울, 모세관힘, 회전 공정-
公开(公告)号：KR1020050107478A
公开(公告)日：2005-11-11
申请号：KR1020057016200
申请日：2004-02-11
Applicant: 무라타 일렉트로닉스 오와이
IPC: G01R15/12
CPC classification number: G01P15/125 , B81B3/0013 , B81B2201/0235 , B81C1/0096 , B81C2201/112 , G01P15/08 , G01P15/0802
Abstract: The invention relates to measuring devices used for the measuring of acceleration, and specifically to capacitive acceleration sensors. The capacitive acceleration sensor according to the present invention comprises a pair of electrodes composed of a movable electrode (4) and a stationary electrode (5), and, related to the pair of electrodes, an isolator protrusion having a special coating. The invention provides an improved, more durable sensor structure, which withstands wear caused by overload situations better than earlier structures.
Abstract translation: 本发明涉及用于测量加速度的测量装置，具体涉及电容式加速度传感器。 根据本发明的电容式加速度传感器包括由可动电极（4）和固定电极（5）组成的一对电极，并且与该对电极相关联，具有特殊涂层的隔离突起。 本发明提供了一种改进的，更耐用的传感器结构，其能够承受比过去结构更好的过载情况下的磨损。
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公开(公告)号：KR100400230B1
公开(公告)日：2003-10-01
申请号：KR1020010073733
申请日：2001-11-26
Applicant: 삼성전자주식회사
IPC: G02B26/08
CPC classification number: G02B26/0841 , B81B3/0005 , B81B2201/042 , B81C1/0096 , B81C2201/112
Abstract: The micro-mechanical structure includes an anti-stiction layer formed by plasma enhanced chemical vapor deposition. The anti-stiction layer is formed on only the area of a substrate other than the top of a movable structure and a part of an electrode that is subsequently bonded to a wire.
Abstract translation: 微机械结构包括通过等离子体增强化学气相沉积形成的抗粘滞层。 抗静摩擦层仅形成在除了可移动结构的顶部之外的基板的区域和随后接合到导线的电极的一部分上。
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Patent Agency Ranking
公开(公告)号：US10053361B2
公开(公告)日：2018-08-21
申请号：US14583269
申请日：2014-12-26
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yuan-Chih Hsieh , Hung-Hua Lin , Wen-Chuan Tai , Hsiang-Fu Chen
CPC classification number: B81C1/00841 , B81B3/0005 , B81C1/00269 , B81C99/0025 , B81C2201/112 , B81C2203/0109 , C23C16/50
Abstract: A microelectromechanical systems (MEMS) package includes a eutectic bonding structure free of a native oxide layer and an anti-stiction layer, while also including a MEMS device having a top surface and sidewalls lined with the anti-stiction layer. The MEMS device is arranged within a MEMS substrate having a first eutectic bonding substructure arranged thereon. A cap substrate having a second eutectic bonding substructure arranged thereon is eutectically bonded to the MEMS substrate with a eutectic bond at the interface of the first and second eutectic bonding substructures. The anti-stiction layer lines a top surface and sidewalls of the MEMS device, but not the first and second eutectic bonding substructures. A method for manufacturing the MEMS package and a process system for selective plasma treatment are also provided.
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公开(公告)号：US10053358B2
公开(公告)日：2018-08-21
申请号：US15252637
申请日：2016-08-31
Applicant: Robert Bosch GmbH
Inventor： Gary Yama , Seow Yeun Yee , Franz Laermer , Ashwin Samarao
CPC classification number: B81B3/0005 , B81B2201/0235 , B81B2201/0264 , B81B2203/0315 , B81C1/00206 , B81C1/00984 , B81C2201/112 , B81C2203/0136
Abstract: A microelectromechanical systems (MEMS) structure includes a substrate, an epitaxial polysilicon cap located above the substrate, a first cavity portion defined between the substrate and the epitaxial polysilicon cap, and a first graphene component having at least one graphene surface immediately adjacent to the first cavity portion.
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公开(公告)号：US20180057351A1
公开(公告)日：2018-03-01
申请号：US15252637
申请日：2016-08-31
Applicant: Robert Bosch GmbH
Inventor： Gary Yama , Seow Yeun Yee , Franz Laermer , Ashwin Samarao
CPC classification number: B81B3/0005 , B81B2201/0235 , B81B2201/0264 , B81B2203/0315 , B81C1/00206 , B81C1/00984 , B81C2201/112 , B81C2203/0136
Abstract: A microelectromechanical systems (MEMS) structure includes a substrate, an epitaxial polysilicon cap located above the substrate, a first cavity portion defined between the substrate and the epitaxial polysilicon cap, and a first graphene component having at least one graphene surface immediately adjacent to the first cavity portion.
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公开(公告)号：US09868628B2
公开(公告)日：2018-01-16
申请号：US15066799
申请日：2016-03-10
Inventor： Yu-Chia Liu , Chia-Hua Chu , Chun-Wen Cheng
CPC classification number: B81B7/0006 , B81B7/0051 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81C1/00246 , B81C2201/0132 , B81C2201/0133 , B81C2201/0176 , B81C2201/0181 , B81C2201/112 , B81C2203/0714 , B81C2203/0735
Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
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公开(公告)号：US09809447B2
公开(公告)日：2017-11-07
申请号：US15414074
申请日：2017-01-24
Applicant: MiraMEMS Sensing Technology Co., Ltd.
Inventor： Yu-Hao Chien , Li-Tien Tseng
CPC classification number: B81B7/0041 , B81B7/02 , B81B2201/0264 , B81B2203/0315 , B81B2203/033 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/00238 , B81C1/00293 , B81C2201/112 , B81C2203/0172 , B81C2203/0792 , H01L23/10 , H01L2924/1461
Abstract: A pressure sensor using the MEMS device comprises an airtight ring surrounding a chamber defined by the first substrate and the second substrate. The airtight ring extends from the upper surface of the second substrate to the interface between the first substrate and the second substrate and further breaks out the interface. The pressure sensor utilizes the airtight ring to retain the airtightness of the chamber.
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