Carrier device and carrier kit
    21.
    发明授权

    公开(公告)号:US11282669B2

    公开(公告)日:2022-03-22

    申请号:US17026317

    申请日:2020-09-21

    Inventor: Hung-Jen Chen

    Abstract: A carrier device and a carrier kit are provided. The carrier kit includes the carrier device and a specimen carrier. The carrier device carries the specimen carrier and is configured to be fixedly disposed on a specimen holder. The specimen carrier has two observation grooves and a containing channel that is formed therein, and the two observation grooves are configured to expose a part of the containing channel. The carrier device has a containing groove that is recessed on a side of a main body and an observation port. When the specimen carrier is disposed in the containing groove, one of the observation grooves is exposed from the main body through the observation port. At least one limiting element is configured to limit a range of movement of the specimen carrier disposed in the containing groove relative to the main body.

    Sample preparation system and preparation method for an electron microscope

    公开(公告)号:US10267713B2

    公开(公告)日:2019-04-23

    申请号:US15372396

    申请日:2016-12-08

    Inventor: Hung-Jen Chen

    Abstract: A sample preparation system includes a slicing module, a first tank, a sequencing module and a pickup module. The slicing module is utilized to sequentially slice a sample block into a plurality of sample slices. The first tank is utilized to receive the sample slices. The sample slices float on a fluid in the first tank, and the sample slices are moved by the flowing fluid. The sequencing module is disposed at a side of the first tank, so as to separate the sample slices sequentially. The pick module is coupled with the first tank, so as to pick up the sample slices sequentially and place the sample slices on corresponding sample holders. In addition, a sample preparation method is also provided.

    SAMPLE PREPARATION SYSTEM AND PREPARATION METHOD

    公开(公告)号:US20180095015A1

    公开(公告)日:2018-04-05

    申请号:US15372396

    申请日:2016-12-08

    Inventor: Hung-Jen Chen

    Abstract: A sample preparation system includes a slicing module, a first tank, a sequencing module and a pickup module. The slicing module is utilized to sequentially slice a sample block into a plurality of sample slices. The first tank is utilized to receive the sample slices. The sample slices float on a fluid in the first tank, and the sample slices are moved by the flowing fluid. The sequencing module is disposed at a side of the first tank, so as to separate the sample slices sequentially. The pick module is coupled with the first tank, so as to pick up the sample slices sequentially and place the sample slices on corresponding sample holders. In addition, a sample preparation method is also provided.

    SAMPLE COLLECTION DEVICE AND SAMPLE COLLECTION DEVICE ARRAY
    26.
    发明申请
    SAMPLE COLLECTION DEVICE AND SAMPLE COLLECTION DEVICE ARRAY 有权
    样品收集装置和样品收集装置阵列

    公开(公告)号:US20160377513A1

    公开(公告)日:2016-12-29

    申请号:US15073667

    申请日:2016-03-18

    CPC classification number: G01N1/2813 H01J37/20 H01J37/26 H01J37/32009

    Abstract: A sample collective device includes two substrates and a spacer. Each substrate has a first surface and a second surface, and the two substrates are arranged with the first surfaces facing each other. The spacer is disposed between the two first surfaces for bonding and fixing the two substrates and forming a sample containing space. In addition, each of the substrates includes a first weakening structure located in the periphery of the sample containing space and exposed on the first surface. A sample collective device array including a plurality of the aforementioned sample collective devices is also provided.

    Abstract translation: 样本集体装置包括两个基板和间隔件。 每个基板具有第一表面和第二表面,并且两个基板被布置成使得第一表面彼此面对。 间隔件设置在两个第一表面之间,用于粘合和固定两个基底并形成样品容纳空间。 此外,每个基板包括位于样品容纳空间的周边并暴露在第一表面上的第一弱化结构。 还提供了包括多个上述样本集合装置的样本集合装置阵列。

    Physical analysis method, sample for physical analysis and preparing method thereof

    公开(公告)号:US11955312B2

    公开(公告)日:2024-04-09

    申请号:US17560460

    申请日:2021-12-23

    CPC classification number: H01J37/3178 H01J37/20

    Abstract: A physical analysis method, a sample for physical analysis and a preparing method thereof are provided. The preparing method of the sample for physical analysis includes: providing a sample to be inspected; and forming a contrast enhancement layer on a surface of the sample to be inspected. The contrast enhancement layer includes a plurality of first material layers and a plurality of second material layers stacked upon one another. The first material layer and the second material layer are made of different materials. Each one of the first and second material layers has a thickness that does not exceed 0.1 nm. In an image captured by an electron microscope, a difference between an average grayscale value of a surface layer image of the sample to be inspected and an average grayscale value of an image of the contrast enhancement layer is at least 50.

    CURVE ALIGNMENT METHOD AND CURVE ALIGNMENT APPARATUS

    公开(公告)号:US20230326000A1

    公开(公告)日:2023-10-12

    申请号:US17857172

    申请日:2022-07-05

    CPC classification number: G06T7/0002 G06T2207/10061 G06T2207/20096

    Abstract: A curve alignment method and apparatus are provided. In the method, data obtained by at least one equipment analyzing a test sample is retrieved to generate test curves. In response to an alignment operation of directing a first point around a first curve to a second point around a second curve among the test curves, a correspondence between features corresponding to the first and second points is recorded, and correspondences of alignment operations are collected as feature data. Data obtained by the equipment analyzing a current sample is retrieved to generate current curves, and a third point matching the first feature on a third curve and a fourth point matching the second feature on a fourth curve are searched according to the correspondences. At least one of the third curve and the fourth curve is adjusted to align the third point with the fourth point.

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