公开(公告)号：WO2010096707A3

公开(公告)日：2010-08-26

申请号：PCT/US2010/024807

申请日：2010-02-19

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  DESTA, Yohannes ,  HUANG, Chang ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

Inventor： DESTA, Yohannes ,  HUANG, Chang ,  NAMBURI, Lakshmikanth ,  LOSEY, Matthew

IPC: H01L21/66

Abstract: A plurality of inserts are anchored in holes or recesses in a probe head. Shafts are coupled to the inserts, and adjustable multi-part fasteners are attached to the shafts and to a stiffener. The multi-part fasteners are operated to move the shafts and couple the probe head, the stiffener, and other components of a microelectronic contactor assembly. In some embodiments, the inserts may be anchored in the probe head using an adhesive. In some embodiments, the probe head may comprise more than one major substrate, and the inserts may be anchored in either of the substrates.

公开(公告)号：WO2009011696A8

公开(公告)日：2010-03-18

申请号：PCT/US2007073579

申请日：2007-07-16

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： NAMBURI LAKSHMIKANTH ,  GARABEDIAN RAFFI

IPC: G01R1/073 ,  G01R31/02 ,  G01R31/26 ,  H01L21/00 ,  H01L21/66 ,  H05K3/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/07342

Abstract: A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage. A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card. A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.

Abstract translation: 公开了一种用于修复MEMS系统的新型装置和方法，包括用于半导体测试的探针卡。 在一个实施例中，与用于测试半导体晶片的诊断计算机一起使用的探针卡包括衬底，连接到衬底的多个操作探针，其中多个操作探针适于与诊断计算机进行电连接， 多个连接到基板的替换探针，其中多个操作探针和多个置换探针构成在基本上相同的制造过程中。 还公开了可以修复的新型探针卡。 具体地说，探针卡与用于测试半导体晶片的诊断计算机一起使用的探针卡，所述探针卡包括衬底和连接到所述衬底的探测器的多个操作，其中所述多个操作探针适于与所述诊断计算机进行电连接 ，并且其中所述多个操作探针包括通过施加电压而被激活的牺牲材料。 还公开了一种从探针卡中去除损坏的探针的方法。 该方法从包括连接到基板的多个操作探针的探针卡移除损坏的探针，并且多个操作探针包括通过施加电压而被激活的牺牲材料。 该方法包括识别损坏的探针，向损坏的探针施加电压，将损坏的探针暴露于蚀刻溶液中，并从探针卡上移除损坏的探针。 还公开了用于从探针卡修复损坏的探针的第二种方法。 该方法修复来自探针卡的损坏的探针，所述探针卡包括连接到基底的多个操作探针和连接到所述基底的多个替代探针，并且其中所述多个操作探针和所述多个置换探针基本相同 制造工艺。 该方法包括以下步骤：识别损坏的探针，从探针卡移除损坏的探针，将多个置换探针中的一个与基底分开，以及安装从多个替换探针分离的一个探针，其中损坏的探针被去除 。 公开了对这些装置和方法的若干改进。

公开(公告)号：WO2009035456A3

公开(公告)日：2009-09-24

申请号：PCT/US2007078433

申请日：2007-09-13

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： ISMAIL SALLEH

IPC: G01R1/067 ,  G01R31/26 ,  H01L21/66

CPC classification number: G01R1/06727 ,  G01R1/07342

Abstract: A novel forked probe design for use in a novel probe card is presented that comprises a forked bending element that more efficiently stores displacement energy. Specifically, the novel probe card comprising a substrate and a forked probe connected to the substrate. The forked probe includes a base that is connected to the substrate and a forked bending element connected to the base, wherein the forked bending element comprises at least a first prong connected to a second prong through a prong connecting structure and a handle connected to the prong connecting structure. Connected to the first prong is the probe tip that is adapted to make contact with the DUT. Refinements to the probe card include that the first and second prongs are adapted to bend such that each prong elastically stores a portion of the displacement energy when the probe tip contacts the DUT. Also, the forked bending element may be manufactured using photolithography and using layered photolithography. Each prong may be comprised of different materials. And the forked bending element may be comprised of a nickel alloy. Also, the first prong may be constructed to be stiffer than the second prong, which may yield a shorter scrub length. The stiffness of the prongs may be manipulated by altering the geometry and/or material of the prongs.

Abstract translation: 提出了一种用于新型探针卡的新颖的分叉探针设计，其包括更有效地存储位移能量的叉形弯曲元件。 具体地说，该新颖的探针卡包括一个基片和一个与基片相连的叉形探针。 叉形探头包括连接到基底的基座和连接到基座的叉形弯曲元件，其中叉形弯曲元件至少包括通过插脚连接结构连接到第二插脚的第一插脚和连接到插脚的手柄 连接结构。 连接到第一个插脚是适于与DUT接触的探头。 对探针卡的细化包括第一和第二插脚适于弯曲，使得当探针尖端接触DUT时，每个插脚弹性地存储位移能量的一部分。 此外，叉形弯曲元件可以使用光刻法和使用分层光刻法来制造。 每个插脚可能由不同的材料组成。 并且叉形弯曲元件可以由镍合金构成。 此外，第一个插脚可以被构造成比第二个插脚更硬，这可能产生较短的擦拭长度。 可以通过改变插脚的几何形状和/或材料来操纵插脚的刚度。

公开(公告)号：WO2007040668A3

公开(公告)日：2009-04-16

申请号：PCT/US2006021938

申请日：2006-06-06

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： YABUKI RICHARD

IPC: H01L23/48 ,  H01L21/44

CPC classification number: G01R1/06744 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/1134 ,  H01L2224/13078 ,  H01L2224/1308 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/13657 ,  H01L2224/13684 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/14 ,  H01R13/24 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599

Abstract: A method for providing bump structures (202) that can be formed by conventional stud bump bonding techniques is disclosed. The bumps (210), (225), (230), (235) can be arranged in a buttressed configuration that allows for substantial lateral and vertical contact loads, and substantial heights. A side-by-side configuration may be used to build a stacked bump contact that is substantially taller and stronger than is possible under current techniques. Other arrangements can be selected to optimize the load bearing capacity in any direction or combination of directions.

Abstract translation: 公开了一种用于提供可以通过常规的柱形凸块接合技术形成的凸块结构（202）的方法。 凸起（210），（225），（230），（235）可以布置成支撑构造，其允许实质的横向和垂直接触负载以及实质高度。 可以使用并排配置来构建比当前技术下可能的基本上更高和更强的堆叠凸点接触。 可以选择其他布置来优化任何方向或方向组合的承载能力。

公开(公告)号：WO2008153558A3

公开(公告)日：2009-04-09

申请号：PCT/US2007069896

申请日：2007-05-29

Applicant: TOUCHDOWN TECHNOLOGIES INC

Inventor： KARKLIN KEN ,  GARABEDIAN RAFFI

IPC: G01R31/02

CPC classification number: G01R1/0735 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2224/48 ,  H01L2924/00

Abstract: A novel device for testing semiconductor chips is disclosed A benefit with all the embodiments described herein is that the device may expepence zero (or near zero) nascent force The device may be comppsed of a printed circuit board (PCB)that has at least one PCB piercing structure, a probe contactor substrate that has at least one substrate piercing structure, wherein the substrate piercing structure is electrically connected to a probe contactor, and an interposer that has at least one electrical via made of a conductive elastomer When the PCB piercing structure and the substrate piercing structure pierce the elastomer, the PCB becomes electrically connected to the probe contactor Instead of the piercing structure, the PCB or the probe contractor substrate may be adhered to the elastomer by an adhesive, such that the PCB becomes electrically connected to the probe contactor

Abstract translation: 公开了一种用于测试半导体芯片的新型器件。本文所述的所有实施例的优点在于，器件可以超过零（或近零）新生力。该器件可以由具有至少一个PCB的印刷电路板（PCB） 穿孔结构，具有至少一个基板穿孔结构的探针接触器基板，其中所述基板穿孔结构电连接到探针接触器，以及具有至少一个由导电弹性体制成的电通路的插入件当所述PCB穿孔结构和 基板刺穿结构刺穿弹性体，PCB变得电连接到探针接触器代替穿孔结构，PCB或探针承载基底可以通过粘合剂粘附到弹性体上，使得PCB变得电连接到探针 接触

公开(公告)号：WO2008127333A1

公开(公告)日：2008-10-23

申请号：PCT/US2007/066578

申请日：2007-04-12

Applicant: TOUCHDOWN TECHNOLOGIES, INC

Inventor： MELVIN, Khoo ,  NIM, Tea ,  ZHIYONG, An

IPC: G01R31/02

CPC classification number: G01R1/06727

Abstract: A novel hybrid probe design is presented that comprises a torsion element and a bending element. These elements allow the probe to store the displacement energy as torsion or as bending. The novel hybrid probe comprises a probe base, a torsion element, a bending element, and a probe tip. The probe elastically deforms to absorb the displacement energy as the probe tip contacts the DUT contact pad. The bending element absorbs some of the displacement energy through bending. Because the torsion element and the bending element join at an angle, a portion of the displacement energy is transferred to the torsion element causing it to twist (torque). The torsion element can also bend to accommodate the storage of energy through torsion and bending. Also, adjusting the position of a pivot can be manipulated to alter the energy absorption characteristics of the probe.

Abstract translation: 提出了一种新颖的混合探针设计，其包括扭转元件和弯曲元件。 这些元件允许探头将位移能量存储为扭转或弯曲。 该新型混合探针包括探针基座，扭转元件，弯曲元件和探针尖端。 当探针尖端接触DUT接触垫时，探头弹性变形以吸收位移能量。 弯曲元件通过弯曲吸收一些位移能量。 由于扭转元件和弯曲元件以一定角度接合，所以位移能量的一部分被传递到扭转元件，使其扭转（扭矩）。 扭转元件还可以弯曲以适应通过扭转和弯曲的能量存储。 此外，可以调节枢轴的位置以改变探头的能量吸收特性。

公开(公告)号：WO2008115241A1

公开(公告)日：2008-09-25

申请号：PCT/US2007/069168

申请日：2007-05-17

Applicant: TOUCHDOWN TECHNOLOGIES, INC.

Inventor： DENNIS, Cameron

IPC: G01R31/02

CPC classification number: G06Q10/087 ,  G01R1/07342

Abstract: A novel information system for optimizing a phase in the lifespan of a probe card for semiconductor wafer testing, by receiving, storing, and disseminating probe card data over a network between customer and supplier. The system optimizes the ordering of a probe card by a customer, the manufacture of the probe card by a supplier, and the performance and repair of the probe card during its lifespan. The information system includes a server that receives, stores, and disseminates historical information gathered during the order, manufacture, performance, and repair phases of probe cards. A server application receives current information from a probe card customer or supplier, calculates metrics based on this information, compares the metric to previously recorded historical data, and communicates the results of the comparison and the historical data to a system user.

Abstract translation: 一种新颖的信息系统，用于通过在客户和供应商之间的网络上接收，存储和传播探针卡数据来优化用于半导体晶片测试的探针卡的寿命阶段。 该系统优化了客户对探针卡的排序，供应商制造探针卡，以及探针卡寿命期间的性能和维修。 该信息系统包括一个服务器，用于接收，存储和传播在探针卡的订单，制造，执行和修复阶段收集的历史信息。 服务器应用程序从探测卡客户或供应商接收当前信息，基于该信息计算度量，将度量与先前记录的历史数据进行比较，并将比较结果和历史数据传送给系统用户。

公开(公告)号：EP1984748A1

公开(公告)日：2008-10-29

申请号：EP07717045.4

申请日：2007-01-26

Applicant: Touchdown Technologies, Inc.

Inventor： ISMAIL, Salleh ,  GARABEDIAN, Raffi ,  WANG, Steven

IPC: G01R1/073 ,  G01R31/28

CPC classification number: G01R1/07307 ,  G01R31/2889

Abstract: A probe head for testing semiconductor wafers has a probe contactor substrate have a first side and a second side. A plurality of probe contactor tips are coupled to the first side and the plurality of tips lie in a first plane. A plurality of mounting structures are coupled to the second side with each of the mounting structures each having a top surface lying in a second plane, wherein the first plane is substantially parallel to the second plane.

公开(公告)号：WO2011126628A1

公开(公告)日：2011-10-13

申请号：PCT/US2011/026723

申请日：2011-03-01

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  LOSEY, Matt ,  KHOO, Melvin ,  DESTA, Yohannes ,  HUANG, Chang

Inventor： LOSEY, Matt ,  KHOO, Melvin ,  DESTA, Yohannes ,  HUANG, Chang

IPC: G01R31/00

CPC classification number: G01R31/2889 ,  G01R1/06744

Abstract: A microelectronic contactor assembly can include a probe head having microelectronic contactors for contacting terminals of semiconductor devices to test the semiconductor devices. A stiffener assembly can provide mechanical support to microelectronic contactors and for connecting a probe card assembly to a prober machine. A stiffener assembly may include first and second stiffener bodies that are connected together at their central portions with adjustment mechanisms such as three differential screw mechanisms. A probe head may be attached to a first stiffener body at locations outside its central portion, while a prober machine may be attached to a second stiffener body at locations outside its central portion. The first and second stiffener bodies may have different coefficients of thermal expansion. The stiffener assembly allows for differential thermal expansion of various components of the microelectronic contactor assembly while minimizing accompanying dimensional distortion that could interfere with contacting the terminals of semiconductor devices.

Abstract translation: 微电子接触器组件可以包括具有微电子接触器的探针头，用于接触半导体器件的端子以测试半导体器件。 加强件组件可以为微电子接触器提供机械支撑并将探针卡组件连接到探测机。 加强件组件可以包括第一和第二加强件本体，其在其中心部分处与诸如三个差速螺旋机构的调节机构连接在一起。 探针头可以在其中心部分外部的位置处附接到第一加强体，而探针机可以在其中心部分外部的位置处附接到第二加强体。 第一和第二加强体可具有不同的热膨胀系数。 加强件组件允许微电子接触器组件的各种部件的差分热膨胀，同时最小化可能干扰接触半导体器件的端子的伴随的尺寸变形。

公开(公告)号：WO2011059827A3

公开(公告)日：2011-05-19

申请号：PCT/US2010/054766

申请日：2010-10-29

Applicant: TOUCHDOWN TECHNOLOGIES, INC. ,  LEAVY, Montray

Inventor： LEAVY, Montray

IPC: H01L21/768

Abstract: Processes are provided herein for the fabrication of MEMS utilizing both a primary metal that is integrated into the final MEMS structure and two or more sacrificial secondary metals that provide structural support for the primary metal component during machining. A first secondary metal is thinly plated around the primarj metal and over the entire surface of the substrate without using photolithography. A second secondary metal, is then thickly plated over the deposited first secondary metal without using photolithography. Additionally, techniques are disclosed to increase the deposition rate of the first secondary metal between primary metal features in order to prevent voiding and thus enhance structural support of the primary metal during machining.

Abstract translation: 这里提供了用于制造利用集成到最终MEMS结构中的主金属和在加工期间为主金属部件提供结构支撑的两种或更多种牺牲次级金属的MEMS的工艺。 第一次级金属在主金属周围以及衬底的整个表面上被薄镀，而不使用光刻法。 然后在没有使用光刻的情况下将第二次级金属厚沉积在沉积的第一次级金属上。 另外，公开了用于增加第一金属特征之间的第一次级金属的沉积速率的技术，以便防止空洞并因此在加工期间增强主金属的结构支撑。