公开(公告)号：EP2501644A1

公开(公告)日：2012-09-26

申请号：EP09802226.2

申请日：2009-11-20

Applicant: Unimicron Technology Corp. ,  STMicroelectronics S.r.l.

Inventor： CORTESE, Mario, Francesco ,  AZZOPARDI, Mark, A. ,  HSU, Shih-Ping ,  TSAI, Kun-Chen ,  MICALLEF, Ivan

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0257 ,  B81C2203/0118 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R19/005 ,  Y10T156/1056 ,  Y10T428/24562 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lid for a MEMS device and the relative manufacturing method. The lid includes: a first board with opposite first and second surfaces having first and second metal layers disposed thereon, respectively, wherein a through cavity extends through the first board and the first and second metal layers; a second board with opposite third and fourth surfaces; an adhesive layer sandwiched between the second surface of the first board and the third surface of the second board to couple the first and second boards together such that the through cavity is closed by the second board, thereby forming a recess; and a first conductor layer coating the bottom and the side surfaces of the recess.

公开(公告)号：EP2416630A1

公开(公告)日：2012-02-08

申请号：EP11159293.7

申请日：2011-03-22

Applicant: Unimicron Technology Corp.

Inventor： Tseng, Tzyy-Jang ,  Lee, Chang-Ming ,  Liu, Wen-Fang ,  Yu, Cheng-Po

IPC: H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0204 ,  H05K1/056 ,  H05K3/3436 ,  H05K2201/0187

Abstract: A circuit board includes a metal pattern layer, a thermally conductive plate, an electrically insulating layer, and at least one electrically insulating material. The thermally conductive plate has a plane. The electrically insulating layer is disposed between the metal pattern layer and the plane and partially covers the plane. The electrically insulating material covers the plane where is not covered by the electrically insulating layer and touches the thermally conductive plate. The electrically insulating layer exposes the electrically insulating material, and a thermal conductivity of the electrically insulating material is larger than a thermal conductivity of the electrically insulating layer.

Abstract translation: 电路板包括金属图案层，导热板，电绝缘层和至少一个电绝缘材料。 导热板具有平面。 电绝缘层设置在金属图案层和平面之间并部分地覆盖平面。 电绝缘材料覆盖未被电绝缘层覆盖并接触导热板的平面。 电绝缘层暴露电绝缘材料，并且电绝缘材料的导热率大于电绝缘层的热导率。

公开(公告)号：EP3828627A3

公开(公告)日：2021-07-21

申请号：EP20197966.3

申请日：2020-09-24

Applicant: Unimicron Technology Corp.

Inventor： Lee, An-Sheng ,  Chan, Meng-Chia ,  Hsu, Ming-Yuan ,  Chang, Po-Ching ,  Lin, Shih-Yao ,  Weng, Cheng-Ming

IPC: G02F1/157 ,  B60R1/08

Abstract: An electrochromic mirror module including a light-transmissive substrate, an opaque touch sensing layer and an electrochromic device is provided. The light-transmissive substrate has a visible surface and a back surface disposed opposite to the visible surface. The opaque touch sensing layer and the electrochromic layer are disposed on the back surface. Distribution areas of the opaque touch sensing layer and the electrochromic layer are different on the back surface. An electrochromic mirror module including reflective layer and electrochromic device is also provided.

公开(公告)号：EP2669935B1

公开(公告)日：2020-04-22

申请号：EP12191602.7

申请日：2012-11-07

Applicant: Unimicron Technology Corp.

Inventor： Tzyy-Jang, Tseng ,  Dyi-Chung, Hu

IPC: H01L21/48 ,  H01L23/498

公开(公告)号：EP3104408B1

公开(公告)日：2019-04-17

申请号：EP15183101.3

申请日：2015-08-31

Applicant: Unimicron Technology Corp.

Inventor： Pan, Pi-Te ,  Chen, Chang-Fu

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/36 ,  H01L23/373 ,  H01L25/10 ,  H01L21/48 ,  H01L23/00 ,  H01L23/16 ,  H01L25/065

公开(公告)号：EP3104408A3

公开(公告)日：2017-03-29

申请号：EP15183101.3

申请日：2015-08-31

Applicant: Unimicron Technology Corp.

Inventor： Pan, Pi-Te ,  Chen, Chang-Fu

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/36 ,  H01L23/373 ,  H01L25/10 ,  H01L21/48 ,  H01L23/00 ,  H01L23/16 ,  H01L25/065

CPC classification number: H01L23/49811 ,  H01L21/486 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.

公开(公告)号：EP2416630B1

公开(公告)日：2015-10-07

申请号：EP11159293.7

申请日：2011-03-22

Applicant: Unimicron Technology Corp.

Inventor： Tseng, Tzyy-Jang ,  Lee, Chang-Ming ,  Liu, Wen-Fang ,  Yu, Cheng-Po

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/05

CPC classification number: H05K1/0204 ,  H05K1/056 ,  H05K3/3436 ,  H05K2201/0187

公开(公告)号：EP2120519A1

公开(公告)日：2009-11-18

申请号：EP09250489.3

申请日：2009-02-24

Applicant: Unimicron Technology Corp.

Inventor： Chen, Tsung-Yuan ,  Chiang, Shu-Sheng ,  Cheng, David C. H.

IPC: H05K3/02 ,  H05K1/00 ,  H05K1/11 ,  H05K3/10 ,  H05K3/00

CPC classification number: H05K3/465 ,  H05K1/0265 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/107 ,  H05K3/426 ,  H05K3/428 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/09736 ,  Y10T29/49147

Abstract: An electrical interconnecting structure suitable for a circuit board is provided. The electrical interconnecting structure includes a core (200), an ultra fine pattern (204a, 204b), and a patterned conductive layer. The core (200) has a surface, and the ultra fine pattern (204a, 204b) is inlaid in the surface of the core. The patterned conductive layer (210a, 210b) is disposed on the surface of the core (200) and is partially connected to the ultra fine pattern, since the ultra fine pattern of the electrical interconnecting structure is inlaid in the surface of the core and is partially connected to the patterned conductive layer located on the surface of the core. There is a through hole (200) and a through via (202a).

Abstract translation: 提供了适用于电路板的电互连结构。 电互连结构包括芯（200），超细图案（204a，204b）和图案化导电层。 芯（200）具有表面，并且超细图案（204a，204b）镶嵌在芯的表面中。 图案化的导电层（210a，210b）设置在芯（200）的表面上，并且部分地连接到超细图案，因为电互连结构的超细图案镶嵌在芯的表面中，并且是 部分地连接到位于芯的表面上的图案化导电层。 通孔（200）和通孔（202a）。

公开(公告)号：EP2120515A1

公开(公告)日：2009-11-18

申请号：EP09250862.1

申请日：2009-03-26

Applicant: Unimicron Technology Corp.

Inventor： Chen, Tsung-Yuan ,  Chiang, Shu-Sheng ,  Cheng, David C. H.

IPC: H05K1/05 ,  H05K3/10 ,  H05K3/42 ,  H05K3/04

CPC classification number: H05K1/02 ,  H05K1/0265 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/045 ,  H05K3/107 ,  H05K3/426 ,  H05K3/465 ,  H05K2201/0352 ,  H05K2201/09736 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A circuit board structure comprising a core layer, a fine circuit pattern and an external patterned conductive layer is provided. The core layer has surface material being dielectric material. The fine circuit pattern is inlaid in the core layer, and the external patterned conductive layer is disposed on a surface of the composite layer. After fine circuit grooves are formed on the surface of the composite layer, conductive material is filled into the grooves to form the fine circuit pattern inlaid in the core layer. Since this fine circuit pattern has relatively fine line width and spacing, the circuit board structure has a higher wiring density.

Abstract translation: 提供了包括芯层，精细电路图案和外部图案化导电层的电路板结构。 芯层具有表面材料为介电材料。 精细电路图案嵌入在芯层中，并且外部图案化导电层设置在复合层的表面上。 在复合层的表面上形成精细电路槽之后，将导电材料填充到沟槽中以形成嵌入在芯层中的精细电路图案。 由于该微细电路图形具有相对较细的线宽和间隔，所以电路板结构具有较高的布线密度。

公开(公告)号：EP3104408A2

公开(公告)日：2016-12-14

申请号：EP15183101.3

申请日：2015-08-31

Applicant: Unimicron Technology Corp.

Inventor： Pan, Pi-Te ,  Chen, Chang-Fu

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/36 ,  H01L23/373 ,  H01L25/10 ,  H01L21/48 ,  H01L23/00 ,  H01L23/16 ,  H01L25/065

CPC classification number: H01L23/49811 ,  H01L21/486 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/562 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/37001

Abstract: Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.

Abstract translation: 提供一种封装结构，其包括电路板，多个第一接触焊盘，多个金属柱和至少一个芯片。 第一接触垫设置在电路板上。 芯片设置在第一接触焊盘的一部分上。 金属柱设置在第一接触垫的另一部分上，其中芯片被金属柱包围。 还提供了一种用于制造封装结构的方法。