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公开(公告)号：KR1020060050656A
公开(公告)日：2006-05-19
申请号：KR1020050078335
申请日：2005-08-25
Applicant: 삼성전기주식회사
IPC: H01L21/60
CPC classification number: H05K3/323 , B81B2207/093 , B81C1/00301 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/29101 , H01L2224/2919 , H01L2224/29399 , H01L2224/32225 , H01L2224/48227 , H01L2224/73203 , H01L2224/73265 , H01L2224/811 , H01L2224/81191 , H01L2224/81855 , H01L2224/83101 , H01L2224/83136 , H01L2224/838 , H01L2224/83851 , H01L2924/00014 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/1461 , H05K3/321 , H05K2201/10674 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A semiconductor package using flip-chip mounting technique is disclosed. The semiconductor package includes: a semiconductor device provided with a plurality of first pads extending from the semiconductor device; a substrate provided with a plurality of second pads extending from the substrate at positions in registry with the location of the first pads of the semiconductor device; and an anisotropic conductive material interposed between the plurality of first pads and the plurality of second pads to electrically connect the first pads to associated second pads, the anisotropic conductive material positioned at discrete locations around the semiconductor device, thereby providing unobstructed clearance at desired locations between the semiconductor device and the substrate.
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Patent Agency Ranking
公开(公告)号：KR1020100055200A
公开(公告)日：2010-05-26
申请号：KR1020080114165
申请日：2008-11-17
Applicant: 삼성전기주식회사
IPC: G02B26/00
CPC classification number: G02B26/0841 , B81B2201/04 , G02B5/1847 , G02B5/1861 , G02B26/0858 , H01L24/80
Abstract: PURPOSE: An optical modulator module package is provided to miniature a package while reducing the whole area by laminating a light modulator element and a driver IC. CONSTITUTION: A light modulator module package comprises a substrate(2), a driver IC(14), and a light modulator element(10). The driver IC is attached on the substrate. The driver IC comprises a first pad(16) in upper part. The driver IC generates the driving voltage according to a control signal. The driver IC outputs a driving voltage through a first pad. The light modulator element comprises a second pad(8) in a lower part. The light modulator element comprises a micro mirror(12). The micro-mirror outputs a diffracted light. The light modulator element is laminated on the driver IC which having a via hole(18).
Abstract translation: 目的：提供光调制器模块封装，通过层叠光调制器元件和驱动器IC来减小封装的整体面积。 构成：光调制器模块封装包括衬底（2），驱动器IC（14）和光调制器元件（10）。 驱动器IC附着在基板上。 驱动器IC包括在上部的第一焊盘（16）。 驱动器IC根据控制信号产生驱动电压。 驱动器IC通过第一焊盘输出驱动电压。 光调制元件包括下部的第二焊盘（8）。 光调制器元件包括微镜（12）。 微镜输出衍射光。 光调制元件层压在具有通孔（18）的驱动器IC上。
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公开(公告)号：KR100861063B1
公开(公告)日：2008-09-30
申请号：KR1020060074342
申请日：2006-08-07
Applicant: 삼성전기주식회사
Abstract: 본 발명에 따르면, 광이 출입할 수 있는 관통 홀이 형성되고, 내부 또는 외면 중 적어도 하나에 회로가 형성되어 있는 기판, 관통 홀에 수용되며, 광 변조기 소자로 입사되는 입사광과 광 변조기로부터 출사되는 회절광을 통과시키는 광 투과성 덮개, 기판의 일면에 부착되어 광 변조기 소자와 드라이버 집적회로를 기판에 실장하기 위한 금속 접속부를 포함하는 광 변조기 모듈 패키지가 제시된다. 본 발명에 따른 광 변조기 모듈 패키지는 광 변조기 소자와 일정 간격으로 이격되어 설치되는 광 투과성 덮개를 임베디드 형식으로 기판내에 수용함으로써, 모듈 패키지를 최소화할 수 있는 효과가 있다.
광 변조기, 기판, 관통 홀, 광 투과-
公开(公告)号：KR1020070026002A
公开(公告)日：2007-03-08
申请号：KR1020060074342
申请日：2006-08-07
Applicant: 삼성전기주식회사
CPC classification number: G02B26/0833 , B81B7/0077 , G02B26/0808 , G02F1/0121
Abstract: An optical modulator module package is provided to embed a light transmissive cover separated from an optical modulator device by a predetermined gap, in a substrate and to prevent electric/optical characteristics from being concentrated on the light transmissive cover as the optical modulator device is not directly installed on the cover. An optical modulator module package is composed of a substrate(210) having a through-hole receiving and emitting the light and a circuit formed on at least one of the inner and outer sides; a light transmissive cover(250) contained in the through-hole to pass the light incident to an optical modulator device(230) and the diffracted light emitted from an optical modulator; and a metal connecting part attached on one surface of the substrate to install the optical modulator device and driver ICs(Integrated Circuit,220,240) on the substrate.
Abstract translation: 提供一种光调制器模块封装，用于将与光调制器件分离的透光罩以预定间隙嵌入衬底中，并且防止电/光特性集中在透光罩上，因为光调制器器件不直接 安装在盖子上。 光调制器模块封装由具有接收和发射光的通孔的基板（210）和形成在内侧和外侧中的至少一个上的电路构成; 包含在所述通孔中以使入射到光调制器装置（230）的光和从光调制器发射的衍射光的透光罩（250）; 以及附接在基板的一个表面上的金属连接部件，以将光调制器装置和驱动器IC（集成电路，220,240）安装在基板上。
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公开(公告)号：KR100643927B1
公开(公告)日：2006-11-10
申请号：KR1020050090651
申请日：2005-09-28
Applicant: 삼성전기주식회사
IPC: H01L21/60
Abstract: A flip chip package is provided to monitor simply easily a flip chip interconnection by using a first and a second substrate pad. A flip chip package includes a first element pad, a second element pad adjacent to the first element pad, a first substrate bump on a substrate corresponding to the first element pad, a second substrate bump on the substrate corresponding to the second element pad, a first substrate pad and a second substrate pad. The first substrate pad(240(1)) is formed on the substrate in order to be electrically connected with the first substrate bump. The second substrate pad(240(2)) is formed on the substrate in order to be electrically connected with the second substrate bump. The connection states between the first element pad and the first substrate bump or between the second element pad and the second substrate bump are easily checked by performing a monitoring process using the first and second substrate pads.
Abstract translation: 提供倒装芯片封装以通过使用第一和第二衬底焊盘简单地监视倒装芯片互连。 一种倒装芯片封装，包括第一元件焊盘，与第一元件焊盘相邻的第二元件焊盘，在与第一元件焊盘对应的衬底上的第一衬底凸点，在衬底上对应于第二元件焊盘的第二衬底凸点， 第一衬底焊盘和第二衬底焊盘。 第一衬底焊盘（240（1））形成在衬底上以与第一衬底凸点电连接。 第二衬底焊盘（240（2））形成在衬底上以便与第二衬底凸点电连接。 通过使用第一和第二衬底焊盘执行监视处理，可以容易地检查第一元件焊盘和第一衬底凸块之间或第二元件焊盘和第二衬底凸块之间的连接状态。
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公开(公告)号：KR1020060097859A
公开(公告)日：2006-09-18
申请号：KR1020050018734
申请日：2005-03-07
Applicant: 삼성전기주식회사
CPC classification number: G02B26/0833 , G03H2225/24 , H01L2224/05001 , H01L2224/05023 , H01L2224/051 , H01L2224/05553 , H01L2224/05568 , H01L2224/056 , H01L2224/16 , H01L2224/48091 , H01L2224/48463 , H01L2924/1461 , H01L2924/00014
Abstract: 본 발명은 플립칩 실장 기술을 이용하여 광변조기 소자를 밀봉 실장함으로써, 외부 환경으로부터 광변조기 소자를 보호하고, 외부와 전기신호 전달을 용이하게 하며, 광변조기 소자의 광학적 특성을 유지하는 플립칩 실장 기술을 이용한 광변조기 모듈 패키지에 관한 것이다.
광변조기, 광변조기 모듈 패키지, 플립칩, MEMS, 밀봉
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