公开(公告)号：KR1020110010427A

公开(公告)日：2011-02-01

申请号：KR1020090067990

申请日：2009-07-24

Applicant: 삼성전기주식회사

Inventor： 최종규 ,  윤경로 ,  오남근 ,  강명삼 ,  김영지 ,  박정현 ,  김상덕 ,  김지은

IPC: H05K3/46 ,  H05K1/02

Abstract: PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve the density of a circuit pattern by burying the circuit pattern into an insulating body. CONSTITUTION: A first circuit pattern is formed on the surface of a carrier. A second circuit pattern is buried to both sides of a substrate. The carrier is compressed to the substrate in order to bury the first circuit pattern to an insulating body(10). The carrier is removed. A solder resist(20) is formed on the surface of the insulating body in order to cover a part of the first circuit pattern.

Abstract translation: 目的：提供印刷电路板及其制造方法，以通过将电路图案埋入绝缘体来改善电路图案的密度。 构成：在载体的表面上形成第一电路图案。 第二电路图案埋在衬底的两侧。 载体被压缩到基板，以便将第一电路图案埋入到绝缘体（10）中。 载体被移除。 为了覆盖第一电路图形的一部分，在绝缘体的表面上形成阻焊剂（20）。

公开(公告)号：KR1020100053983A

公开(公告)日：2010-05-24

申请号：KR1020080112892

申请日：2008-11-13

Applicant: 삼성전기주식회사

Inventor： 강명삼 ,  오남근 ,  박정현 ,  박정우 ,  김상덕 ,  김지은 ,  최종규 ,  신길용

IPC: H05K1/02

CPC classification number: H05K3/007 ,  H05K1/115 ,  H05K1/187 ,  H05K3/3452 ,  H05K3/429

Abstract: PURPOSE: A carrier member and a PCB manufacturing method thereof are provided to remove a thermosetting resin layer without a separate additional process by removing a thermosetting resin layer during a first desmear process. CONSTITUTION: A seed layer and a wiring pattern are formed on a thermosetting resin layer of a carrier member. The wiring pattern is transcribed in both sides of a core insulating layer by pressurizing the carrier member in both sides of the core insulating layer(110). A metal base part of the carrier member is removed. A via hole is formed in order to interlink the wiring pattern interval. The thermosetting resin layer of the carrier member is removed during a first desmear process. A copper-electroplated layer is formed inside the via hole. A seed layer is removed.

Abstract translation: 目的：提供载体构件和PCB制造方法，以在第一去污工艺中除去热固性树脂层，而不用单独的附加工艺去除热固性树脂层。 构成：在承载构件的热固性树脂层上形成种子层和布线图案。 通过对芯绝缘层（110）的两侧的载体构件进行加压，将布线图案转印到芯绝缘层的两侧。 移除载体构件的金属底座部分。 形成通孔以使布线图案间隔互相连接。 在第一次去污处理期间移除载体构件的热固性树脂层。 在通孔内部形成铜电镀层。 种子层被去除。