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公开(公告)号：KR1020130035687A
公开(公告)日：2013-04-09
申请号：KR1020110100140
申请日：2011-09-30
Applicant: 삼성전기주식회사
CPC classification number: B60C23/0494
Abstract: PURPOSE: A TPMS(Tire Pressure Monitoring System) transmission module is provided to protect a TPMS transmission unit from corrosion due to the impact or inflow of foreign substances, by coating a coating layer on a left side of a transmission unit. CONSTITUTION: A TPMS transmission module(100) comprises a case(110), a transmission unit(170), and a coating layer(160). The case is mounted on a tire. The transmission unit is mounted on the case. The coating layer is coated on the left side of the transmission unit. The coating layer is made of plastic. The plastic is made of parlylene. The parlylene consists of parlylene C. The transmission unit comprises a circuit unit(120).
Abstract translation: 目的：提供TPMS（轮胎压力监测系统）传输模块，通过在传输单元的左侧涂覆涂层，保护TPMS传输单元免受外来物质的冲击或流入而的腐蚀。 构成：TPMS传输模块（100）包括壳体（110），传输单元（170）和涂层（160）。 外壳安装在轮胎上。 传动单元安装在壳体上。 涂覆层涂覆在传动单元的左侧。 涂层由塑料制成。 塑料是由亚甲板制成。 该亚甲苯由亚氯化碳C组成。传输单元包括电路单元（120）。
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公开(公告)号：KR1020130034399A
公开(公告)日：2013-04-05
申请号：KR1020110098385
申请日：2011-09-28
Applicant: 삼성전기주식회사
CPC classification number: B60C23/0494 , B60C23/0452
Abstract: PURPOSE: A tire pressure monitoring system module is provided to reduce the failure rates, mounting costs, and the manufacturing costs. CONSTITUTION: A tire pressure monitoring system module(100) comprises a circuit board(110), a battery(120), a valve antenna(130), and a connecting pin(140). Various kinds of electronic signal elements and electronic circuits are mounted on the circuit board and receive or transmit an electrical signal and a current. The battery is mounted on the lower part of the circuit board and applies the necessary energy. The valve antenna is mounted on the side of the circuit board. The connecting pin mounts the valve antenna on the circuit board or detaches the valve antenna.
Abstract translation: 目的：提供轮胎压力监测系统模块，以减少故障率，安装成本和制造成本。 构成：轮胎压力监测系统模块（100）包括电路板（110），电池（120），阀门天线（130）和连接销（140）。 各种电子信号元件和电子电路安装在电路板上并接收或发送电信号和电流。 电池安装在电路板的下部，并施加必要的能量。 阀门天线安装在电路板的一侧。 连接销将阀门天线安装在电路板上或拆卸阀门天线。
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公开(公告)号：KR101188007B1
公开(公告)日：2012-10-05
申请号：KR1020100058630
申请日：2010-06-21
Applicant: 삼성전기주식회사
CPC classification number: G06F3/016 , H01L41/0825
Abstract: 본 발명의 일 실시예에 따른 햅틱 피드백 액츄에이터는 햅틱 디바이스의 일면에 제공되어 진동을 전달하는 진동 플레이트; 및 상기 햅틱 디바이스에 제공되며, 상기 햅틱 디바이스의 접촉 압력에 근거하여 제어부에 감지전압(Va)을 제공하는 감지전극과 상기 제어부에 감지된 상기 감지전압(Va)으로부터 상기 감지전극(Va)과 대응되는 구동전압(Vd)을 제공받는 구동전극이 형성되는 복합층과 상기 복합층의 일면에 결합하여 상기 구동전압(Vd)에 따라 진동을 발생시키는 압전체를 구비하는 액츄에이터;를 포함할 수 있다.
Abstract translation: 振动板的触觉反馈的致动器根据本发明的一个实施例被设置在触觉设备，振动的传递的一个表面上; 并且被提供给触觉设备，所感测的电压（Va），其中所述感测电极（Va）和从感测到感测电极和用于基于触觉装置的接触压力向控制单元提供检测电压（Va），控制单元对应 以及与复合层的一个表面耦合并且根据驱动电压Vd产生振动的压电体。
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公开(公告)号：KR101184516B1
公开(公告)日：2012-09-19
申请号：KR1020100008521
申请日：2010-01-29
Applicant: 삼성전기주식회사
CPC classification number: G06F3/041
Abstract: 본 발명에 따른 터치스크린 장치(100a)는 터치스크린(110), 및 상기 터치스크린(110)을 상하방향이 포함된 2차원 또는 3차원으로 구동시키는 액추에이터(120a, 120b, 120c)를 포함하여 구성되고, 터치스크린의 수직인 상하방향으로 구동이 가능하여 사용자에게 클릭감, 다이얼링감, 표면질감과 같은 실제적인 터치감을 전달할 수 있는 장점이 있다.
Abstract translation: 根据本发明的触摸屏设备100a包括触摸屏110和以二维或三维方式驱动触摸屏110的致动器120a，120b和120c， 并且可以在触摸屏的垂直方向上垂直驱动，从而为用户提供传输实际的触摸感觉，拨号感觉和表面纹理的能力。
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公开(公告)号：KR1020100112451A
公开(公告)日：2010-10-19
申请号：KR1020090030964
申请日：2009-04-09
Applicant: 삼성전기주식회사
Abstract: PURPOSE: A repair structure of a pattern part and a repair method thereof are provided to minimize the blot phenomenon of a conductive material by filling a conductive material when a groove part is formed in an insulation layer exposed by an open defect part. CONSTITUTION: A groove part is formed in an insulation layer(102) which is exposed with the open defect part of a pattern part(104). A repair part(114) is formed by filling a conductive material in the open defect part. The groove part is formed in the edge of the insulation layer. The groove part is formed with a laser machining process. The conductive material is a conductive metal ink or a conductive paste.
Abstract translation: 目的：提供图案部分的修复结构及其修复方法，以便在由露出的缺陷部暴露的绝缘层中形成沟部时，通过填充导电材料来最小化导电材料的印迹现象。 构成：在与图案部分（104）的开放缺陷部分一起暴露的绝缘层（102）中形成沟槽部分。 通过在开放缺陷部分填充导电材料形成修复部分（114）。 槽部形成在绝缘层的边缘。 槽部形成有激光加工工序。 导电材料是导电金属油墨或导电浆料。
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Patent Agency Ranking26.发明公开
公开(公告)号：KR1020100087932A
公开(公告)日：2010-08-06
申请号：KR1020090007003
申请日：2009-01-29
Applicant: 삼성전기주식회사
CPC classification number: H01L24/95 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/83 , H01L25/0655 , H01L25/50 , H01L2224/83193 , H01L2224/838 , H01L2224/95085 , H01L2224/95146 , H01L2224/95147 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , Y10T29/4913 , Y10T156/10 , H01L2924/00
Abstract: PURPOSE: A die attaching method and a package substrate thereof are provided to reduce the mounting error of a die by using the self aligning method of a self-assembled monolayer. CONSTITUTION: A first self-assembled monolayer(116) is formed in the different side of a die(110) which has a pad in one side. A second self-assembled monolayer(132a) is formed in the die attach region of a substrate. A die is transferred to the die attach region of the substrate when the die is picked up in a face-up form with a pick-up head. The die is automatically aligned and mounted on the substrate with attraction between the first self-assembled monolayer and the second self-assembled monolayer.
Abstract translation: 目的：提供一种管芯附着方法及其封装基板，通过使用自组装单层的自对准方法来降低管芯的安装误差。 构成：第一自组装单层（116）形成在模具（110）的不同侧，其具有一侧的垫。 第二自组装单层（132a）形成在基板的芯片附着区域中。 当以带有拾取头的面朝上形式拾取模具时，将模具转移到基板的芯片附着区域。 模具自动对准并安装在基板上，吸引第一自组装单层和第二自组装单层。
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公开(公告)号：KR1020100083382A
公开(公告)日：2010-07-22
申请号：KR1020090002727
申请日：2009-01-13
Applicant: 삼성전기주식회사
IPC: H05K3/24
Abstract: PURPOSE: The method of repairing of the patterned portion is that the self-assembled monolayer is formed in the repair circuit domain. The interface neighborhood adhesion is improved. CONSTITUTION: The fault whether or not of the patterned portion(104) is tested. The conductive material(110) is filled in the open bad sector of above pattern unit. The conductive material is filled with the dispenser(108). The conductive material is sintered. The self-assembled monolayer is formed in the sintered conductive material as described above.
Abstract translation: 目的：修复图案部分的方法是在修复电路领域形成自组装单层。 界面附着力提高。 构成：是否测试图案化部分（104）的故障。 导电材料（110）填充在上述图案单元的开口坏扇区中。 导电材料被分配器（108）填充。 导电材料被烧结。 如上所述，在烧结的导电材料中形成自组装单层。
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公开(公告)号：KR1020150145413A
公开(公告)日：2015-12-30
申请号：KR1020140074747
申请日：2014-06-19
Applicant: 삼성전기주식회사
CPC classification number: G01P1/023 , G01P15/0802 , G01P15/125 , G01P2015/0808
Abstract: 본발명은제조가용이하고저온공정이가능한센서패키지및 그제조방법에관한것이다. 이를위한본 발명의실시예에따른센서패키지는, 내부에형성된공간에질량체가배치되고일면에적어도하나의전극이형성된베이스, 상기베이스를일면에결합되어상기질량체가배치된공간을밀봉하는상부캡, 및상기베이스와상기상부캡을상호접합하는폴리머재질의접합부재를포함할수 있다.
Abstract translation: 传感器封装及其制造方法技术领域本发明涉及能够促进制造和低温处理的传感器封装及其制造方法。 根据本发明的实施例，传感器封装包括：具有布置在其内的形成空间内的质量的基底，并在其一侧形成电极; 上盖，其联接到所述基座的一侧并密封所述质量被布置在其中的空间; 以及将基体和上盖相互结合的聚合物型接合部件。
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公开(公告)号：KR1020150130155A
公开(公告)日：2015-11-23
申请号：KR1020140057374
申请日：2014-05-13
Applicant: 삼성전기주식회사
CPC classification number: B81C1/00182 , B81B3/0072 , B81C1/00825
Abstract: 본발명은멤스구조체및 멤스구조체의제조방법에관한것이다. 본발명의실시예에따른멤스구조체는절연층, 절연층상부에형성된회로층, 절연층하부에형성된매스및 매스의측면과이격되도록형성된지지대를포함하며, 측면의모서리부분이오목한형태로형성된중간구조체, 중간구조체의상부를둘러싸도록형성된상부구조체및 중간구조체의하부를둘러싸도록형성된하부구조체를포함한다.
Abstract translation: 本发明涉及MEMS结构和用于制造MEMS结构的方法。 根据本发明的实施例，MEMS结构包括：侧表面的边缘部分凹陷的中间结构; 形成为围绕中间结构的上部的上部结构; 以及形成为围绕中间结构的下部的下部结构。 中间结构包括：绝缘层; 形成在绝缘层的上部的电路层; 形成在绝缘层的下部的质量; 以及形成为与物料的侧表面间隔开的支撑件。
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公开(公告)号：KR1020150110072A
公开(公告)日：2015-10-02
申请号：KR1020140033907
申请日：2014-03-24
Applicant: 삼성전기주식회사
Abstract: 다이아프램을구비하는센서부및 상기센서부하측에구비되는중공부를포함하는복수의 MEMS 디바이스를형성하는 MEMS 디바이스형성단계;상기복수의 MEMS 디바이스사이의하측에절단홈을형성하는절단홈형성단계; 및상기절단홈을따라기계적방법에의하여상기복수의 MEMS 디바이스를개별로분리하는 MEMS 디바이스분리단계;를포함하는 MEMS 디바이스제조방법을제공하여, 다이싱공정시에 MEMS 디바이스에가해지는충격이나스트레스를최소화할수 있다.
Abstract translation: 提供了一种用于制造MEMS器件的方法。 本发明包括：MEMS器件形成步骤，形成具有传感器单元的多个MEMS器件，所述传感器单元具有隔膜并且具有设置在所述传感器单元的下侧的中空部分; 切割槽形成步骤，在MEMS装置之间的下侧形成切割槽; 以及利用机械方法沿着切割槽分离每个MEMS器件的MEMS器件分离步骤。 本发明能够最小化在切割过程期间施加到MEMS器件的冲击或应力。
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